SG147427A1 - Mounting apparatus and mounting method - Google Patents

Mounting apparatus and mounting method

Info

Publication number
SG147427A1
SG147427A1 SG200807550-9A SG2008075509A SG147427A1 SG 147427 A1 SG147427 A1 SG 147427A1 SG 2008075509 A SG2008075509 A SG 2008075509A SG 147427 A1 SG147427 A1 SG 147427A1
Authority
SG
Singapore
Prior art keywords
ring frame
dicing tape
mounting apparatus
mounting
semiconductor wafer
Prior art date
Application number
SG200807550-9A
Other languages
English (en)
Inventor
Masaki Tsujimoto
Kenji Kobayashi
Takahisa Yoshioka
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG147427A1 publication Critical patent/SG147427A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y10T156/1339—Delivering cut part in sequence to serially conveyed articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type
    • Y10T156/1352—Work traversing type with liquid applying means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
SG200807550-9A 2003-10-10 2004-09-29 Mounting apparatus and mounting method SG147427A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003351900A JP4444619B2 (ja) 2003-10-10 2003-10-10 マウント装置及びマウント方法

Publications (1)

Publication Number Publication Date
SG147427A1 true SG147427A1 (en) 2008-11-28

Family

ID=34431094

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200807550-9A SG147427A1 (en) 2003-10-10 2004-09-29 Mounting apparatus and mounting method

Country Status (8)

Country Link
US (1) US8196632B2 (fr)
EP (1) EP1672684B1 (fr)
JP (1) JP4444619B2 (fr)
KR (1) KR101059431B1 (fr)
CN (1) CN100437918C (fr)
SG (1) SG147427A1 (fr)
TW (1) TW200514188A (fr)
WO (1) WO2005036628A1 (fr)

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JP5112984B2 (ja) * 2008-08-06 2013-01-09 リンテック株式会社 シート貼付装置及び貼付方法
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JP5006300B2 (ja) * 2008-10-23 2012-08-22 リンテック株式会社 マウント装置及びマウント方法
JP5412226B2 (ja) 2009-10-01 2014-02-12 日東電工株式会社 粘着テープ貼付け装置
JP5529503B2 (ja) * 2009-11-13 2014-06-25 リンテック株式会社 帯状体の巻取装置及び巻取方法
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JP5916295B2 (ja) * 2011-04-22 2016-05-11 古河電気工業株式会社 ウエハ加工用テープおよびウエハ加工用テープを用いて半導体装置を製造する方法
JP5897856B2 (ja) * 2011-09-28 2016-04-06 リンテック株式会社 シート製造装置及び製造方法
KR101403864B1 (ko) * 2011-12-27 2014-06-09 제일모직주식회사 다이싱 다이본딩 필름
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JP5945493B2 (ja) * 2012-10-31 2016-07-05 リンテック株式会社 シート貼付装置および貼付方法
KR101981639B1 (ko) * 2012-11-13 2019-05-27 삼성디스플레이 주식회사 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법
CN104347354A (zh) * 2013-08-07 2015-02-11 日东电工株式会社 粘合带粘贴方法及粘合带粘贴装置
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KR101694498B1 (ko) * 2016-10-07 2017-01-10 조상희 소파 밴드 고정장치
JP6779579B2 (ja) * 2017-01-31 2020-11-04 株式会社ディスコ 判定方法、測定装置、及び粘着テープ貼着装置
JP7154737B2 (ja) 2017-03-27 2022-10-18 リンテック株式会社 シート貼付装置および貼付方法
JP6901322B2 (ja) 2017-05-31 2021-07-14 株式会社ディスコ 保護テープの貼着装置
JP6920113B2 (ja) * 2017-06-16 2021-08-18 株式会社ディスコ テープ形成装置
CN107158783B (zh) * 2017-06-20 2022-11-25 利辛县飞达网业有限公司 一种过滤网自动装填装置
CN107244134A (zh) * 2017-08-02 2017-10-13 江苏万果保鲜科技有限公司 点胶覆膜机及其薄膜张紧度控制系统
TWI670199B (zh) * 2018-01-24 2019-09-01 林俊宏 捲帶式電子模組自動化加工裝置
DE102018132750A1 (de) * 2018-12-18 2020-06-18 Bundesdruckerei Gmbh Vorrichtung und verfahren zur anbringung einer klebstoffschicht an einem klebstofflosen einband eines ausweis-, wert- oder sicherheitsdokument
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TWI738049B (zh) * 2019-09-04 2021-09-01 志聖工業股份有限公司 層膜裁切裝置、層膜裁切方法、晶圓貼膜機以及晶圓貼膜方法
US20230009839A1 (en) * 2021-07-09 2023-01-12 Taiwan Semiconductor Manufacturing Company System and method for chemical mechanical polishing pad replacement
CN114121736B (zh) * 2022-01-28 2022-06-21 新恒汇电子股份有限公司 引线框架双面揭膜系统

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Also Published As

Publication number Publication date
KR20060125720A (ko) 2006-12-06
WO2005036628A1 (fr) 2005-04-21
TWI331786B (fr) 2010-10-11
US20070131344A1 (en) 2007-06-14
CN100437918C (zh) 2008-11-26
EP1672684A1 (fr) 2006-06-21
EP1672684B1 (fr) 2015-12-09
CN1868038A (zh) 2006-11-22
EP1672684A4 (fr) 2010-05-26
TW200514188A (en) 2005-04-16
JP2005116928A (ja) 2005-04-28
JP4444619B2 (ja) 2010-03-31
KR101059431B1 (ko) 2011-08-25
US8196632B2 (en) 2012-06-12

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