SG135074A1 - Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices - Google Patents

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Info

Publication number
SG135074A1
SG135074A1 SG200601271-0A SG2006012710A SG135074A1 SG 135074 A1 SG135074 A1 SG 135074A1 SG 2006012710 A SG2006012710 A SG 2006012710A SG 135074 A1 SG135074 A1 SG 135074A1
Authority
SG
Singapore
Prior art keywords
devices
stacked
manufacturing
methods
microelectronic
Prior art date
Application number
SG200601271-0A
Other languages
English (en)
Inventor
David J Corisis
Chong Chin Hui
Lee Choon Kuan
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200601271-0A priority Critical patent/SG135074A1/en
Priority to US11/414,864 priority patent/US7671459B2/en
Priority to KR1020087023595A priority patent/KR101022907B1/ko
Priority to JP2008557488A priority patent/JP5088583B2/ja
Priority to EP07757642.9A priority patent/EP2005472B1/de
Priority to PCT/US2007/062981 priority patent/WO2007101251A2/en
Publication of SG135074A1 publication Critical patent/SG135074A1/en
Priority to US12/689,624 priority patent/US8450839B2/en
Priority to US13/898,004 priority patent/US9362141B2/en
Priority to US15/144,699 priority patent/US9768121B2/en
Priority to US15/702,225 priority patent/US10211114B2/en

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Classifications

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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
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    • H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate
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    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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    • H01L2924/161—Cap
    • H01L2924/162—Disposition
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
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    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG200601271-0A 2006-02-08 2006-02-28 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices SG135074A1 (en)

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SG200601271-0A SG135074A1 (en) 2006-02-28 2006-02-28 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US11/414,864 US7671459B2 (en) 2006-02-08 2006-05-01 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
KR1020087023595A KR101022907B1 (ko) 2006-02-28 2007-02-28 마이크로 전자 장치, 적층된 마이크로 전자 장치, 그러한 장치를 제조하는 방법
JP2008557488A JP5088583B2 (ja) 2006-02-28 2007-02-28 マイクロ電子装置、積層型マイクロ電子装置、およびそうした装置の製造方法
EP07757642.9A EP2005472B1 (de) 2006-02-28 2007-02-28 Gestapelte mikroelektronische bauelemente
PCT/US2007/062981 WO2007101251A2 (en) 2006-02-28 2007-02-28 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US12/689,624 US8450839B2 (en) 2006-02-28 2010-01-19 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US13/898,004 US9362141B2 (en) 2006-02-28 2013-05-20 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US15/144,699 US9768121B2 (en) 2006-02-28 2016-05-02 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US15/702,225 US10211114B2 (en) 2006-02-28 2017-09-12 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

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US9362141B2 (en) 2016-06-07
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US7671459B2 (en) 2010-03-02
WO2007101251A2 (en) 2007-09-07
US9768121B2 (en) 2017-09-19
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US20100117212A1 (en) 2010-05-13
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US20180005909A1 (en) 2018-01-04

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