SG11201601946XA - Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic el display, and methods respectively for producing organic el element and color filter - Google Patents
Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic el display, and methods respectively for producing organic el element and color filterInfo
- Publication number
- SG11201601946XA SG11201601946XA SG11201601946XA SG11201601946XA SG11201601946XA SG 11201601946X A SG11201601946X A SG 11201601946XA SG 11201601946X A SG11201601946X A SG 11201601946XA SG 11201601946X A SG11201601946X A SG 11201601946XA SG 11201601946X A SG11201601946X A SG 11201601946XA
- Authority
- SG
- Singapore
- Prior art keywords
- resin film
- display
- organic
- polyimide resin
- polyimide
- Prior art date
Links
- 229920001721 polyimide Polymers 0.000 title 4
- 239000004642 Polyimide Substances 0.000 title 2
- 239000009719 polyimide resin Substances 0.000 title 2
- 239000002243 precursor Substances 0.000 title 2
- 230000003287 optical effect Effects 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013201182 | 2013-09-27 | ||
PCT/JP2014/074717 WO2015046019A1 (ja) | 2013-09-27 | 2014-09-18 | ポリイミド前駆体、それから得られるポリイミド樹脂膜、ならびにそれを含む表示素子、光学素子、受光素子、タッチパネル、回路基板、有機elディスプレイ、および、有機el素子ならびにカラーフィルタの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601946XA true SG11201601946XA (en) | 2016-04-28 |
Family
ID=52743158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601946XA SG11201601946XA (en) | 2013-09-27 | 2014-09-18 | Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic el display, and methods respectively for producing organic el element and color filter |
Country Status (7)
Country | Link |
---|---|
US (1) | US9828469B2 (zh) |
JP (1) | JP5773090B1 (zh) |
KR (1) | KR102207439B1 (zh) |
CN (1) | CN105593269B (zh) |
SG (1) | SG11201601946XA (zh) |
TW (1) | TWI644944B (zh) |
WO (1) | WO2015046019A1 (zh) |
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US9612536B2 (en) * | 2015-08-31 | 2017-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Developer for lithography |
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CN112708134B (zh) * | 2020-12-28 | 2021-08-03 | 深圳瑞华泰薄膜科技股份有限公司 | 一种无色透明共聚酰胺-酰亚胺膜及其制备方法 |
JP2023001636A (ja) * | 2021-06-21 | 2023-01-06 | 株式会社ピーアイ技術研究所 | 感光性ポリイミド樹脂組成物 |
CN116814179B (zh) * | 2023-01-31 | 2024-02-27 | 江苏穿越光电科技有限公司 | 一种uv光固化型光学胶膜 |
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JPH0539363A (ja) * | 1991-08-05 | 1993-02-19 | Nippon Steel Corp | ポリイミド樹脂成形物とその製造方法 |
JPH1180350A (ja) | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | 光部品用ポリイミド及びこれを用いた光部品 |
JP5135718B2 (ja) | 2005-06-01 | 2013-02-06 | 三菱化学株式会社 | テトラカルボン酸又はそのポリエステルイミド、及びその製造方法 |
JP2007269970A (ja) * | 2006-03-31 | 2007-10-18 | Toray Ind Inc | 着色樹脂組成物、カラーフィルター、および液晶表示装置 |
JP5595381B2 (ja) | 2009-03-31 | 2014-09-24 | 三井化学株式会社 | 低熱膨張性ブロックポリイミドおよびその前駆体ならびにその用途 |
CN110628025B (zh) | 2010-07-22 | 2022-07-12 | 宇部兴产株式会社 | 聚酰亚胺前体、聚酰亚胺及其制备中所用的材料 |
JP6047864B2 (ja) * | 2011-07-21 | 2016-12-21 | 宇部興産株式会社 | ポリイミド前駆体ワニス、およびポリイミドワニスの製造方法 |
JP5903789B2 (ja) | 2010-07-22 | 2016-04-13 | 宇部興産株式会社 | 共重合ポリイミド前駆体及び共重合ポリイミド |
JP5727885B2 (ja) * | 2010-09-07 | 2015-06-03 | Jfeケミカル株式会社 | ポリイミドおよびポリイミドフィルム |
CN103608382B (zh) * | 2011-06-13 | 2015-09-30 | 株式会社钟化 | 聚酰胺酸、聚酰亚胺、聚酰胺酸溶液、聚酰亚胺溶液、和由这些溶液获得的聚酰亚胺膜、以及聚酰亚胺膜的利用 |
US11084906B2 (en) * | 2011-08-19 | 2021-08-10 | Akron Polymer Systems, Inc. | Thermally stable, low birefringent copolyimide films |
KR102198316B1 (ko) * | 2012-06-19 | 2021-01-04 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 표시장치 및 그 제조방법, 그리고 표시장치 지지기재용 폴리이미드 필름 및 그 제조방법 |
JP5695276B2 (ja) * | 2012-07-02 | 2015-04-01 | 株式会社カネカ | ポリアミド酸、ポリイミド、ポリアミド酸溶液、およびポリイミドの利用 |
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2014
- 2014-09-18 CN CN201480052871.6A patent/CN105593269B/zh active Active
- 2014-09-18 JP JP2014546220A patent/JP5773090B1/ja active Active
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- 2014-09-18 KR KR1020167007544A patent/KR102207439B1/ko active IP Right Grant
- 2014-09-18 US US15/021,144 patent/US9828469B2/en active Active
- 2014-09-18 WO PCT/JP2014/074717 patent/WO2015046019A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
JP5773090B1 (ja) | 2015-09-02 |
WO2015046019A1 (ja) | 2015-04-02 |
CN105593269A (zh) | 2016-05-18 |
JPWO2015046019A1 (ja) | 2017-03-09 |
CN105593269B (zh) | 2017-11-21 |
KR102207439B1 (ko) | 2021-01-26 |
KR20160062006A (ko) | 2016-06-01 |
TW201522421A (zh) | 2015-06-16 |
US20160222165A1 (en) | 2016-08-04 |
US9828469B2 (en) | 2017-11-28 |
TWI644944B (zh) | 2018-12-21 |
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