SG11201601946XA - Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic el display, and methods respectively for producing organic el element and color filter - Google Patents
Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic el display, and methods respectively for producing organic el element and color filterInfo
- Publication number
- SG11201601946XA SG11201601946XA SG11201601946XA SG11201601946XA SG11201601946XA SG 11201601946X A SG11201601946X A SG 11201601946XA SG 11201601946X A SG11201601946X A SG 11201601946XA SG 11201601946X A SG11201601946X A SG 11201601946XA SG 11201601946X A SG11201601946X A SG 11201601946XA
- Authority
- SG
- Singapore
- Prior art keywords
- resin film
- display
- organic
- polyimide resin
- polyimide
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013201182 | 2013-09-27 | ||
PCT/JP2014/074717 WO2015046019A1 (en) | 2013-09-27 | 2014-09-18 | Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic el display, and methods respectively for producing organic el element and color filter |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601946XA true SG11201601946XA (en) | 2016-04-28 |
Family
ID=52743158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601946XA SG11201601946XA (en) | 2013-09-27 | 2014-09-18 | Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic el display, and methods respectively for producing organic el element and color filter |
Country Status (7)
Country | Link |
---|---|
US (1) | US9828469B2 (en) |
JP (1) | JP5773090B1 (en) |
KR (1) | KR102207439B1 (en) |
CN (1) | CN105593269B (en) |
SG (1) | SG11201601946XA (en) |
TW (1) | TWI644944B (en) |
WO (1) | WO2015046019A1 (en) |
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KR102378357B1 (en) * | 2015-08-24 | 2022-03-25 | 삼성디스플레이 주식회사 | Foldable display apparatus and the operating method thereof |
US9612536B2 (en) * | 2015-08-31 | 2017-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Developer for lithography |
WO2017051827A1 (en) * | 2015-09-24 | 2017-03-30 | 旭化成株式会社 | Polyimide precursor, resin composition, and method for producing resin film |
CN105353555B (en) * | 2015-12-08 | 2018-08-14 | 深圳市华星光电技术有限公司 | The production method of quantum dot color membrane substrates |
WO2017159538A1 (en) * | 2016-03-17 | 2017-09-21 | 株式会社カネカ | Polyamide acid, polyamide acid solution, polyimide, polyimide substrate and method for producing polyimide substrate |
KR102358122B1 (en) * | 2016-03-31 | 2022-02-04 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | Manufacturing method of flexible substrate |
EP3441428B1 (en) | 2016-04-05 | 2024-03-13 | Mitsubishi Gas Chemical Company, Inc. | Polyimide resin composition, method for producing same, and polyimide film |
US10155185B2 (en) * | 2016-05-09 | 2018-12-18 | Tokyo Ohka Kogyo Co., Ltd. | Polyimide-based resin film cleaning liquid, method for cleaning polyimide-based resin film, method for producing polyimide coating, method for producing filter, filter medium, or filter device, and method for producing chemical solution for lithography |
WO2018020333A1 (en) * | 2016-07-29 | 2018-02-01 | Semiconductor Energy Laboratory Co., Ltd. | Separation method, display device, display module, and electronic device |
TW201808628A (en) * | 2016-08-09 | 2018-03-16 | Semiconductor Energy Lab | Manufacturing method of semiconductor device |
WO2018034291A1 (en) * | 2016-08-19 | 2018-02-22 | 富士フイルム株式会社 | Composition for forming plated layer, plated layer, substrate provided with plated layer, electroconductive film, touch panel sensor, and touch panel |
CN106159089B (en) * | 2016-08-22 | 2019-07-23 | 达迈科技股份有限公司 | Flexible base plate and its manufacturing method that can be release |
US10369664B2 (en) * | 2016-09-23 | 2019-08-06 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
KR101796875B1 (en) | 2016-09-23 | 2017-11-10 | 주식회사 엘지화학 | Polyimide precursor solution and preparation method thereof |
US10396305B2 (en) * | 2016-11-29 | 2019-08-27 | Canon Kabushiki Kaisha | Organic EL device, and display apparatus and lighting apparatus using the same |
JP7000682B2 (en) * | 2017-01-17 | 2022-02-10 | 三菱ケミカル株式会社 | Polyimide |
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JP6994712B2 (en) * | 2017-08-24 | 2022-01-14 | 宇部興産株式会社 | Soluble transparent polyimide polymerized in γ-butyrolactone solvent |
CN111095048A (en) * | 2017-09-21 | 2020-05-01 | 富士胶片株式会社 | Method for manufacturing near-infrared cut filter, laminate, and kit |
KR102117151B1 (en) | 2017-09-29 | 2020-05-29 | 주식회사 엘지화학 | Polyimide precursor solution and polyimide film prepared by using same |
CN111164131B (en) * | 2017-10-04 | 2022-08-02 | 三菱瓦斯化学株式会社 | Imide resin, polyimide varnish, and polyimide film |
CN109796590A (en) * | 2017-11-16 | 2019-05-24 | 宁波长阳科技股份有限公司 | A kind of polyimide resin and transparent polyimide film |
US10995237B2 (en) * | 2017-12-29 | 2021-05-04 | Industrial Technology Research Institute | Polyimide hybrid material, precursor solution and manufacture method thereof |
TWI703188B (en) * | 2017-12-29 | 2020-09-01 | 財團法人工業技術研究院 | Polyimide hybrid material, precursor solution and manufacture method thereof |
CN111479854B (en) * | 2018-01-17 | 2023-05-09 | 旭化成株式会社 | Polyimide precursor resin composition |
JP2019144347A (en) * | 2018-02-19 | 2019-08-29 | 株式会社Screenホールディングス | Manufacturing method of display device |
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JP7150465B2 (en) * | 2018-04-27 | 2022-10-11 | 東京応化工業株式会社 | Polyimide precursor composition, polyamic acid, polyimide resin, polyimide film, and optical device |
JP7310808B2 (en) * | 2018-06-22 | 2023-07-19 | 東洋紡株式会社 | Polycarbonate imide resin and paste using the same |
WO2019244988A1 (en) * | 2018-06-22 | 2019-12-26 | 三井化学株式会社 | Polyamic acid, varnish containing same, film, touch panel display, liquid crystal display, and organic el display |
JP7412094B2 (en) * | 2018-06-28 | 2024-01-12 | 旭化成株式会社 | Polyimide precursor resin composition |
KR20200053302A (en) * | 2018-11-08 | 2020-05-18 | 삼성전자주식회사 | Poly(amide-imide) copolymer, composition for preparing poly(amide-imide) copolymer, article including poly(amide-imide) copolymer, and display device including the article |
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CN110256670B (en) * | 2019-05-24 | 2021-06-01 | 东南大学 | Thermoplastic polyimide containing fluorene group and preparation method and application thereof |
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JP6047864B2 (en) * | 2011-07-21 | 2016-12-21 | 宇部興産株式会社 | Polyimide precursor varnish and method for producing polyimide varnish |
CN103228704B (en) * | 2010-07-22 | 2016-10-05 | 宇部兴产株式会社 | Material used in polyimide precursor, polyimides and preparation thereof |
JP5903789B2 (en) | 2010-07-22 | 2016-04-13 | 宇部興産株式会社 | Copolymer polyimide precursor and copolymer polyimide |
JP5727885B2 (en) * | 2010-09-07 | 2015-06-03 | Jfeケミカル株式会社 | Polyimide and polyimide film |
WO2012173126A1 (en) * | 2011-06-13 | 2012-12-20 | 株式会社カネカ | Polyamic acid, polyimide, polyamic acid solution, polyimide solution, polyimide films obtained from these solutions, and use of polyimide films |
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CN104380366B (en) * | 2012-06-19 | 2017-09-08 | 新日铁住金化学株式会社 | Display device and its manufacture method and display device supporting base material polyimide film and its manufacture method |
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-
2014
- 2014-09-18 US US15/021,144 patent/US9828469B2/en active Active
- 2014-09-18 KR KR1020167007544A patent/KR102207439B1/en active IP Right Grant
- 2014-09-18 SG SG11201601946XA patent/SG11201601946XA/en unknown
- 2014-09-18 WO PCT/JP2014/074717 patent/WO2015046019A1/en active Application Filing
- 2014-09-18 CN CN201480052871.6A patent/CN105593269B/en active Active
- 2014-09-18 JP JP2014546220A patent/JP5773090B1/en active Active
- 2014-09-26 TW TW103133390A patent/TWI644944B/en active
Also Published As
Publication number | Publication date |
---|---|
CN105593269B (en) | 2017-11-21 |
KR20160062006A (en) | 2016-06-01 |
CN105593269A (en) | 2016-05-18 |
JPWO2015046019A1 (en) | 2017-03-09 |
TWI644944B (en) | 2018-12-21 |
JP5773090B1 (en) | 2015-09-02 |
KR102207439B1 (en) | 2021-01-26 |
WO2015046019A1 (en) | 2015-04-02 |
US20160222165A1 (en) | 2016-08-04 |
TW201522421A (en) | 2015-06-16 |
US9828469B2 (en) | 2017-11-28 |
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