DE112013006131A5 - Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung - Google Patents

Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung Download PDF

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Publication number
DE112013006131A5
DE112013006131A5 DE112013006131.7T DE112013006131T DE112013006131A5 DE 112013006131 A5 DE112013006131 A5 DE 112013006131A5 DE 112013006131 T DE112013006131 T DE 112013006131T DE 112013006131 A5 DE112013006131 A5 DE 112013006131A5
Authority
DE
Germany
Prior art keywords
plastic
production
encased
electronic
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112013006131.7T
Other languages
English (en)
Inventor
Martin Steinau
Thomas Schmidt
Bernhard Schuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies Germany GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112013006131A5 publication Critical patent/DE112013006131A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
DE112013006131.7T 2012-12-20 2013-11-11 Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung Withdrawn DE112013006131A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012112738.7A DE102012112738A1 (de) 2012-12-20 2012-12-20 Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung
DE102012112738.7 2012-12-20
PCT/DE2013/200288 WO2014094754A1 (de) 2012-12-20 2013-11-11 Elektronikmodul mit einer mit kunststoff umhüllten elektronische schaltung und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
DE112013006131A5 true DE112013006131A5 (de) 2015-09-10

Family

ID=49765754

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102012112738.7A Withdrawn DE102012112738A1 (de) 2012-12-20 2012-12-20 Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung
DE112013006131.7T Withdrawn DE112013006131A5 (de) 2012-12-20 2013-11-11 Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102012112738.7A Withdrawn DE102012112738A1 (de) 2012-12-20 2012-12-20 Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung

Country Status (5)

Country Link
US (1) US20150359107A1 (de)
EP (1) EP2936556A1 (de)
JP (1) JP2016502279A (de)
DE (2) DE102012112738A1 (de)
WO (1) WO2014094754A1 (de)

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KR102094566B1 (ko) * 2012-08-31 2020-03-27 미쓰비시 마테리알 가부시키가이샤 파워 모듈용 기판 및 파워 모듈
JP2014165456A (ja) * 2013-02-27 2014-09-08 Fujitsu Mobile Communications Ltd 電子機器及び電子機器のリアケース
DE102015207310A1 (de) * 2015-04-22 2016-10-27 Zf Friedrichshafen Ag Elektronikmodul und Verfahren zum Umkapseln desselben
DE102015212169A1 (de) * 2015-06-30 2017-01-05 Osram Gmbh Schaltungsträger für eine elektronische Schaltung und Verfahren zum Herstellen eines derartigen Schaltungsträgers
DE102016005291B4 (de) * 2016-04-29 2024-01-11 Ksg Austria Gmbh Verfahren zur Herstellung eines elektronischen Gerätes in der Form eines Spritzgußteils mit eingelegter Leiterplatte
GB2557422A (en) * 2016-10-07 2018-06-20 Jaguar Land Rover Ltd Control unit
GB2554737A (en) * 2016-10-07 2018-04-11 Jaguar Land Rover Ltd Control unit
US10829048B2 (en) * 2016-10-07 2020-11-10 Jaguar Land Rover Limited Control unit
GB2554735A (en) * 2016-10-07 2018-04-11 Jaguar Land Rover Ltd Control unit
DE102016224909A1 (de) * 2016-12-14 2018-06-14 Conti Temic Microelectronic Gmbh Verwendung von Ultraschallwellen zur Erhöhung einer Porosität von Zinnoberflächen auf einer Leiterplatte sowie Verfahren dazu
DE102017201800A1 (de) 2017-02-06 2018-08-09 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Bamberg Verfahren zur Herstellung einer Elektronikeinheit und Elektronikeinheit
GB201814347D0 (en) * 2018-09-04 2018-10-17 Pilkington Group Ltd Electrical device, interlayer ply including an electrical device and methods for making said electrical device and interlayer ply
DE102018217349A1 (de) * 2018-10-10 2020-04-16 Conti Temic Microelectronic Gmbh Leiterplatte
DE102018217457A1 (de) * 2018-10-11 2020-03-19 Conti Temic Microelectronic Gmbh Elektronikmodul eines Kraftfahrzeugs
DE102018217456B4 (de) 2018-10-11 2020-07-09 Conti Temic Microelectronic Gmbh Elektronische Steuervorrichtung und Verfahren zur Herstellung einer elektronischen Steuervorrichtung
US11166363B2 (en) * 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
CN113130422B (zh) * 2021-02-26 2023-04-18 广东美的白色家电技术创新中心有限公司 功率模块及其制备方法
DE102021202686A1 (de) 2021-03-19 2022-09-22 Vitesco Technologies Germany Gmbh Leiterplatte-Kühler-Verbund, Schaltungsanordnung mit einem Leiterplatte-Kühler-Verbund
DE102021211523A1 (de) 2021-05-21 2022-11-24 Vitesco Technologies Germany Gmbh Elektronisches Steuermodul für ein Fahrzeug und Verfahren zur Herstellung des elektronischen Steuermoduls
DE102021211524A1 (de) 2021-05-21 2022-11-24 Vitesco Technologies Germany Gmbh Elektronisches Steuermodul mit mindestens einer Befestigungseinrichtung für ein Fahrzeug und Verfahren zur Herstellung des elektronischen Steuermoduls
DE102022202618A1 (de) 2022-03-16 2023-09-21 Vitesco Technologies Germany Gmbh Elektronisches Steuermodul

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WO2011072629A1 (de) 2009-12-17 2011-06-23 Conti Temic Microelectronic Gmbh Leiterplatte mit mehreren übereinander angeordneten leiterplattenlagen mit einer bare-die-montage für den einsatz als getriebesteuerung

Also Published As

Publication number Publication date
WO2014094754A1 (de) 2014-06-26
EP2936556A1 (de) 2015-10-28
US20150359107A1 (en) 2015-12-10
DE102012112738A1 (de) 2014-06-26
JP2016502279A (ja) 2016-01-21

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Legal Events

Date Code Title Description
R081 Change of applicant/patentee

Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE

Free format text: FORMER OWNER: CONTI TEMIC MICROELECTRONIC GMBH, 90411 NUERNBERG, DE

R005 Application deemed withdrawn due to failure to request examination