DE112013006131A5 - Electronic module with a plastic-encased electronic circuit and method for its production - Google Patents

Electronic module with a plastic-encased electronic circuit and method for its production Download PDF

Info

Publication number
DE112013006131A5
DE112013006131A5 DE112013006131.7T DE112013006131T DE112013006131A5 DE 112013006131 A5 DE112013006131 A5 DE 112013006131A5 DE 112013006131 T DE112013006131 T DE 112013006131T DE 112013006131 A5 DE112013006131 A5 DE 112013006131A5
Authority
DE
Germany
Prior art keywords
plastic
production
encased
electronic
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112013006131.7T
Other languages
German (de)
Inventor
Martin Steinau
Thomas Schmidt
Bernhard Schuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies Germany GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112013006131A5 publication Critical patent/DE112013006131A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE112013006131.7T 2012-12-20 2013-11-11 Electronic module with a plastic-encased electronic circuit and method for its production Withdrawn DE112013006131A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012112738.7 2012-12-20
DE102012112738.7A DE102012112738A1 (en) 2012-12-20 2012-12-20 Electronic module with a plastic-encased electronic circuit and method for its production
PCT/DE2013/200288 WO2014094754A1 (en) 2012-12-20 2013-11-11 Electronic module with a plastic-coated electronic circuit and method for the production thereof

Publications (1)

Publication Number Publication Date
DE112013006131A5 true DE112013006131A5 (en) 2015-09-10

Family

ID=49765754

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102012112738.7A Withdrawn DE102012112738A1 (en) 2012-12-20 2012-12-20 Electronic module with a plastic-encased electronic circuit and method for its production
DE112013006131.7T Withdrawn DE112013006131A5 (en) 2012-12-20 2013-11-11 Electronic module with a plastic-encased electronic circuit and method for its production

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102012112738.7A Withdrawn DE102012112738A1 (en) 2012-12-20 2012-12-20 Electronic module with a plastic-encased electronic circuit and method for its production

Country Status (5)

Country Link
US (1) US20150359107A1 (en)
EP (1) EP2936556A1 (en)
JP (1) JP2016502279A (en)
DE (2) DE102012112738A1 (en)
WO (1) WO2014094754A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2892074B1 (en) * 2012-08-31 2018-01-03 Mitsubishi Materials Corporation Power module substrate and power module
JP2014165456A (en) * 2013-02-27 2014-09-08 Fujitsu Mobile Communications Ltd Electronic apparatus, and rear case for electronic apparatus
DE102015207310A1 (en) * 2015-04-22 2016-10-27 Zf Friedrichshafen Ag Electronic module and method for encapsulating the same
DE102015212169A1 (en) * 2015-06-30 2017-01-05 Osram Gmbh Circuit carrier for an electronic circuit and method for producing such a circuit carrier
DE102016005291B4 (en) * 2016-04-29 2024-01-11 Ksg Austria Gmbh Method for producing an electronic device in the form of an injection molded part with an inserted circuit board
GB2554737A (en) * 2016-10-07 2018-04-11 Jaguar Land Rover Ltd Control unit
GB2554735A (en) * 2016-10-07 2018-04-11 Jaguar Land Rover Ltd Control unit
US11071205B2 (en) * 2016-10-07 2021-07-20 Jaguar Land Rover Limited Control unit
US10829048B2 (en) * 2016-10-07 2020-11-10 Jaguar Land Rover Limited Control unit
DE102016224909A1 (en) * 2016-12-14 2018-06-14 Conti Temic Microelectronic Gmbh Use of ultrasonic waves to increase the porosity of tin surfaces on a circuit board and method
DE102017201800A1 (en) 2017-02-06 2018-08-09 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Bamberg Method for producing an electronic unit and electronic unit
DE102018217349A1 (en) * 2018-10-10 2020-04-16 Conti Temic Microelectronic Gmbh Circuit board
DE102018217457A1 (en) * 2018-10-11 2020-03-19 Conti Temic Microelectronic Gmbh Electronics module of a motor vehicle
DE102018217456B4 (en) 2018-10-11 2020-07-09 Conti Temic Microelectronic Gmbh Electronic control device and method for manufacturing an electronic control device
US11166363B2 (en) * 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
CN113130422B (en) * 2021-02-26 2023-04-18 广东美的白色家电技术创新中心有限公司 Power module and preparation method thereof
DE102021202686A1 (en) 2021-03-19 2022-09-22 Vitesco Technologies Germany Gmbh Printed circuit board cooler combination, circuit arrangement with a printed circuit board cooler combination
DE102021211523A1 (en) 2021-05-21 2022-11-24 Vitesco Technologies Germany Gmbh Electronic control module for a vehicle and method of manufacturing the electronic control module
DE102021211524A1 (en) 2021-05-21 2022-11-24 Vitesco Technologies Germany Gmbh Electronic control module with at least one attachment device for a vehicle and method for manufacturing the electronic control module
DE102022202618A1 (en) 2022-03-16 2023-09-21 Vitesco Technologies Germany Gmbh Electronic control module

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01248548A (en) * 1988-03-29 1989-10-04 Nec Corp Hybrid integrated circuit device
US5841190A (en) * 1995-05-19 1998-11-24 Ibiden Co., Ltd. High density multi-layered printed wiring board, multi-chip carrier and semiconductor package
JP3321006B2 (en) * 1996-12-27 2002-09-03 株式会社三井ハイテック Semiconductor device
DE19751095C1 (en) 1997-11-18 1999-05-20 Siemens Ag Electrical connection arrangement e.g. for motor vehicle transmission housing
DE19757597A1 (en) * 1997-12-23 1999-07-01 Siemens Ag Multichip module with low overall height
JP3756691B2 (en) 1999-03-18 2006-03-15 株式会社日立製作所 Resin-sealed electronic device for internal combustion engine
JP2003078006A (en) * 2001-09-04 2003-03-14 Ibiden Co Ltd Semiconductor chip and method of manufacturing the same
DE10213296B9 (en) * 2002-03-25 2007-04-19 Infineon Technologies Ag Electronic component with a semiconductor chip, method for its production and method for producing a benefit
US6819200B2 (en) * 2002-07-26 2004-11-16 Freescale Semiconductor, Inc. Broadband balun and impedance transformer for push-pull amplifiers
JP3931855B2 (en) * 2003-08-08 2007-06-20 株式会社日立製作所 Electronic circuit equipment
TW200517437A (en) * 2003-10-16 2005-06-01 Nitto Denko Corp Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
DE102005016830A1 (en) * 2004-04-14 2005-11-03 Denso Corp., Kariya Semiconductor device and method for its production
JP4821537B2 (en) * 2006-09-26 2011-11-24 株式会社デンソー Electronic control unit
JP2008172172A (en) 2007-01-15 2008-07-24 Denso Corp Electronic controller and method of manufacturing the same
JP5436557B2 (en) * 2009-07-17 2014-03-05 パナソニック株式会社 Electronic module and manufacturing method thereof
JP2013514674A (en) 2009-12-17 2013-04-25 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング Printed wiring board having a plurality of printed wiring board layers provided to be overlapped by bare die attachment for use as a transmission control device

Also Published As

Publication number Publication date
EP2936556A1 (en) 2015-10-28
DE102012112738A1 (en) 2014-06-26
WO2014094754A1 (en) 2014-06-26
JP2016502279A (en) 2016-01-21
US20150359107A1 (en) 2015-12-10

Similar Documents

Publication Publication Date Title
DE112013006131A5 (en) Electronic module with a plastic-encased electronic circuit and method for its production
HK1196457A1 (en) Transparent electronic display board and method for manufacturing same
HK1191499A1 (en) Electronic circuit module and method for producing the same
EP2830119A4 (en) Method for producing a substrate for organic electronic devices
EP2966137A4 (en) Adhesive film and method for producing organic electronic device using same
EP2902115A4 (en) Pattern forming method, electronic wiring substrate, optical device, and pattern forming device
FR2996054B1 (en) ELECTRONIC MODULE AND ASSOCIATED METHOD
EP2721694A4 (en) A reusable electronic circuit assembling and testing system and uses thereof
EP2846615A4 (en) Multilayer wiring substrate and manufacturing method thereof
SG10201606075XA (en) Opto-electronic module and method for manufacturing the same
DE102012102660A8 (en) Circuit arrangement with a plurality of on-chip monitoring circuits and a control circuit and associated method
EP2821826A4 (en) Optical waveguide, optical wiring component, optical waveguide module and electronic device
EP2930722A4 (en) Process for manufacturing conductive film and printed wiring board
TWI562696B (en) Printed circuit board and method for manufacturing the same
EP2927721A4 (en) Optical wiring component and electronic device
EP2904884A4 (en) The printed circuit board and the method for manufacturing the same
FR2980920B1 (en) INTEGRATED CIRCUIT WITH SELF-PROGRAMMED IDENTIFICATION KEY
TWI560510B (en) Electronic ink display device and method for manufacturing the same
DE112013006179A5 (en) Optoelectronic component and method for its production
EP2931008A4 (en) Printed circuit board and manufacturing method therefor
EP2811050A4 (en) Wiring board and method for manufacturing wiring board
EP2820927A4 (en) The printed circuit board and the method for manufacturing the same
EP2790476A4 (en) Multilayer printed circuit board and manufacturing method thereof
DE112013004960A5 (en) Optoelectronic component with integrated protective diode and method for its production
HK1181921A1 (en) Substrate with a built-in electronic component

Legal Events

Date Code Title Description
R081 Change of applicant/patentee

Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE

Free format text: FORMER OWNER: CONTI TEMIC MICROELECTRONIC GMBH, 90411 NUERNBERG, DE

R005 Application deemed withdrawn due to failure to request examination