HK1181921A1 - 電子零件內置基板 - Google Patents

電子零件內置基板

Info

Publication number
HK1181921A1
HK1181921A1 HK13109207.5A HK13109207A HK1181921A1 HK 1181921 A1 HK1181921 A1 HK 1181921A1 HK 13109207 A HK13109207 A HK 13109207A HK 1181921 A1 HK1181921 A1 HK 1181921A1
Authority
HK
Hong Kong
Prior art keywords
built
substrate
electronic component
electronic
component
Prior art date
Application number
HK13109207.5A
Other languages
English (en)
Inventor
麥谷英兒
佐治哲夫
松田隆志
中村浩
Original Assignee
太陽誘電株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太陽誘電株式會社 filed Critical 太陽誘電株式會社
Publication of HK1181921A1 publication Critical patent/HK1181921A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/6483—Ladder SAW filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
HK13109207.5A 2012-08-10 2013-08-06 電子零件內置基板 HK1181921A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012177965A JP5122018B1 (ja) 2012-08-10 2012-08-10 電子部品内蔵基板

Publications (1)

Publication Number Publication Date
HK1181921A1 true HK1181921A1 (zh) 2013-11-15

Family

ID=47692868

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13109207.5A HK1181921A1 (zh) 2012-08-10 2013-08-06 電子零件內置基板

Country Status (6)

Country Link
US (1) US8536959B1 (zh)
JP (1) JP5122018B1 (zh)
KR (1) KR101284011B1 (zh)
CN (1) CN103094259B (zh)
HK (1) HK1181921A1 (zh)
TW (1) TWI428067B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5400235B1 (ja) * 2012-11-09 2014-01-29 太陽誘電株式会社 電子部品内蔵基板
JP5639242B2 (ja) * 2013-04-12 2014-12-10 太陽誘電株式会社 電子部品内蔵基板
JP5412002B1 (ja) * 2013-09-12 2014-02-12 太陽誘電株式会社 部品内蔵基板
JP6348701B2 (ja) * 2013-11-06 2018-06-27 太陽誘電株式会社 モジュール
KR102186148B1 (ko) * 2014-02-28 2020-12-03 삼성전기주식회사 임베디드 기판 및 임베디드 기판의 제조 방법
JP6375889B2 (ja) * 2014-11-18 2018-08-22 株式会社村田製作所 電子部品内蔵基板およびその製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3598060B2 (ja) * 1999-12-20 2004-12-08 松下電器産業株式会社 回路部品内蔵モジュール及びその製造方法並びに無線装置
JP3554310B2 (ja) * 2001-03-28 2004-08-18 京セラ株式会社 電子回路モジュール
JP2002344146A (ja) * 2001-05-15 2002-11-29 Tdk Corp 高周波モジュールとその製造方法
US7230512B1 (en) * 2003-08-19 2007-06-12 Triquint, Inc. Wafer-level surface acoustic wave filter package with temperature-compensating characteristics
US7385463B2 (en) * 2003-12-24 2008-06-10 Kyocera Corporation Surface acoustic wave device and electronic circuit device
WO2006134928A1 (ja) * 2005-06-16 2006-12-21 Murata Manufacturing Co., Ltd. 圧電デバイス及びその製造方法
JP2007273585A (ja) * 2006-03-30 2007-10-18 Sony Corp マイクロデバイスモジュール及びその製造方法
US20100044845A1 (en) * 2006-04-27 2010-02-25 Nec Corporation Circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrate
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法
TW200922429A (en) * 2007-11-14 2009-05-16 Advanced Semiconductor Eng Structure and manufacturing method of (with embedded component) multilayer circuit board
JP4468436B2 (ja) * 2007-12-25 2010-05-26 富士通メディアデバイス株式会社 弾性波デバイスおよびその製造方法
TWI357293B (en) * 2008-01-23 2012-01-21 Unimicron Technology Corp Flex-rigid circuit board and method for fabricatin
WO2009096563A1 (ja) * 2008-01-30 2009-08-06 Kyocera Corporation 弾性波装置およびその製造方法
JPWO2010024233A1 (ja) * 2008-08-27 2012-01-26 日本電気株式会社 機能素子を内蔵可能な配線基板及びその製造方法
JP5206377B2 (ja) * 2008-12-05 2013-06-12 株式会社村田製作所 電子部品モジュール
JP2011176061A (ja) 2010-02-23 2011-09-08 Panasonic Corp 半導体装置

Also Published As

Publication number Publication date
CN103094259A (zh) 2013-05-08
JP2014036190A (ja) 2014-02-24
TWI428067B (zh) 2014-02-21
TW201334652A (zh) 2013-08-16
US8536959B1 (en) 2013-09-17
CN103094259B (zh) 2014-12-10
JP5122018B1 (ja) 2013-01-16
KR101284011B1 (ko) 2013-07-09

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190116