HK1181921A1 - 電子零件內置基板 - Google Patents
電子零件內置基板Info
- Publication number
- HK1181921A1 HK1181921A1 HK13109207.5A HK13109207A HK1181921A1 HK 1181921 A1 HK1181921 A1 HK 1181921A1 HK 13109207 A HK13109207 A HK 13109207A HK 1181921 A1 HK1181921 A1 HK 1181921A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- built
- substrate
- electronic component
- electronic
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012177965A JP5122018B1 (ja) | 2012-08-10 | 2012-08-10 | 電子部品内蔵基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1181921A1 true HK1181921A1 (zh) | 2013-11-15 |
Family
ID=47692868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13109207.5A HK1181921A1 (zh) | 2012-08-10 | 2013-08-06 | 電子零件內置基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8536959B1 (zh) |
JP (1) | JP5122018B1 (zh) |
KR (1) | KR101284011B1 (zh) |
CN (1) | CN103094259B (zh) |
HK (1) | HK1181921A1 (zh) |
TW (1) | TWI428067B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5400235B1 (ja) * | 2012-11-09 | 2014-01-29 | 太陽誘電株式会社 | 電子部品内蔵基板 |
JP5639242B2 (ja) * | 2013-04-12 | 2014-12-10 | 太陽誘電株式会社 | 電子部品内蔵基板 |
JP5412002B1 (ja) * | 2013-09-12 | 2014-02-12 | 太陽誘電株式会社 | 部品内蔵基板 |
JP6348701B2 (ja) * | 2013-11-06 | 2018-06-27 | 太陽誘電株式会社 | モジュール |
KR102186148B1 (ko) * | 2014-02-28 | 2020-12-03 | 삼성전기주식회사 | 임베디드 기판 및 임베디드 기판의 제조 방법 |
JP6375889B2 (ja) * | 2014-11-18 | 2018-08-22 | 株式会社村田製作所 | 電子部品内蔵基板およびその製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3598060B2 (ja) * | 1999-12-20 | 2004-12-08 | 松下電器産業株式会社 | 回路部品内蔵モジュール及びその製造方法並びに無線装置 |
JP3554310B2 (ja) * | 2001-03-28 | 2004-08-18 | 京セラ株式会社 | 電子回路モジュール |
JP2002344146A (ja) * | 2001-05-15 | 2002-11-29 | Tdk Corp | 高周波モジュールとその製造方法 |
US7230512B1 (en) * | 2003-08-19 | 2007-06-12 | Triquint, Inc. | Wafer-level surface acoustic wave filter package with temperature-compensating characteristics |
US7385463B2 (en) * | 2003-12-24 | 2008-06-10 | Kyocera Corporation | Surface acoustic wave device and electronic circuit device |
CN101107776B (zh) * | 2005-06-16 | 2010-05-19 | 株式会社村田制作所 | 压电器件及其制作方法 |
JP2007273585A (ja) * | 2006-03-30 | 2007-10-18 | Sony Corp | マイクロデバイスモジュール及びその製造方法 |
US20100044845A1 (en) * | 2006-04-27 | 2010-02-25 | Nec Corporation | Circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrate |
EP2159916B1 (en) * | 2007-02-28 | 2018-07-11 | Murata Manufacturing Co. Ltd. | Branching filter and its manufacturing method |
TW200922429A (en) * | 2007-11-14 | 2009-05-16 | Advanced Semiconductor Eng | Structure and manufacturing method of (with embedded component) multilayer circuit board |
JP4468436B2 (ja) * | 2007-12-25 | 2010-05-26 | 富士通メディアデバイス株式会社 | 弾性波デバイスおよびその製造方法 |
TWI357293B (en) * | 2008-01-23 | 2012-01-21 | Unimicron Technology Corp | Flex-rigid circuit board and method for fabricatin |
WO2009096563A1 (ja) * | 2008-01-30 | 2009-08-06 | Kyocera Corporation | 弾性波装置およびその製造方法 |
WO2010024233A1 (ja) * | 2008-08-27 | 2010-03-04 | 日本電気株式会社 | 機能素子を内蔵可能な配線基板及びその製造方法 |
JP5206377B2 (ja) * | 2008-12-05 | 2013-06-12 | 株式会社村田製作所 | 電子部品モジュール |
JP2011176061A (ja) | 2010-02-23 | 2011-09-08 | Panasonic Corp | 半導体装置 |
-
2012
- 2012-08-10 JP JP2012177965A patent/JP5122018B1/ja not_active Expired - Fee Related
- 2012-08-20 US US13/589,531 patent/US8536959B1/en active Active
- 2012-12-06 KR KR1020120141015A patent/KR101284011B1/ko active IP Right Grant
- 2012-12-24 TW TW101149613A patent/TWI428067B/zh not_active IP Right Cessation
-
2013
- 2013-01-18 CN CN201310020093.XA patent/CN103094259B/zh not_active Expired - Fee Related
- 2013-08-06 HK HK13109207.5A patent/HK1181921A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN103094259A (zh) | 2013-05-08 |
CN103094259B (zh) | 2014-12-10 |
US8536959B1 (en) | 2013-09-17 |
TWI428067B (zh) | 2014-02-21 |
KR101284011B1 (ko) | 2013-07-09 |
JP2014036190A (ja) | 2014-02-24 |
TW201334652A (zh) | 2013-08-16 |
JP5122018B1 (ja) | 2013-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU343074S (en) | Electronic device case | |
EP2589082A4 (en) | ELECTRONIC DEVICES WITH ELASTIC SUBSTRATES | |
AP00340S1 (en) | Electronic devices | |
EP2927984A4 (en) | SUBSTRATE FOR ORGANIC ELECTRONIC ELEMENT | |
EP2743955A4 (en) | ELECTRONIC COMPONENT | |
EP2916440A4 (en) | ELECTRIC CIRCUIT | |
PL2844487T6 (pl) | Giętkie podłoże z układem scalonym | |
HK1210867A1 (zh) | 旋轉操作型電子部件 | |
EP2560242A4 (en) | ELECTRONIC COMPONENT | |
GB201421101D0 (en) | Electronic communicating | |
EP2821863A4 (en) | INTEGRATED ANTENNA TYPE ELECTRONIC CLOCK | |
EP2699065A4 (en) | CIRCUIT BOARD | |
EP2908358A4 (en) | SUBSTRATE FOR AN ORGANIC ELECTRONIC DEVICE | |
EP2694620A4 (en) | ELECTRONIC DEVICE | |
EP2824682A4 (en) | ELECTRONIC COMPONENT | |
AP00380S1 (en) | Electronic devices | |
EP2760121A4 (en) | ELECTRIC CIRCUIT | |
TWM433676U (en) | Electronic device with automatic positioning function | |
AP00379S1 (en) | Electronic devices | |
EP2829164A4 (en) | CONNECTIVE ELECTRONIC DEVICES | |
HK1181921A1 (zh) | 電子零件內置基板 | |
EP2672726A4 (en) | ELECTRONIC DEVICE | |
HK1207479A1 (zh) | 電子電壓適配器模塊的調節 | |
IL227870A0 (en) | Electronic assembly | |
HK1206155A1 (zh) | 電子元件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20190116 |