HK1206155A1 - 電子元件 - Google Patents

電子元件

Info

Publication number
HK1206155A1
HK1206155A1 HK15106513.8A HK15106513A HK1206155A1 HK 1206155 A1 HK1206155 A1 HK 1206155A1 HK 15106513 A HK15106513 A HK 15106513A HK 1206155 A1 HK1206155 A1 HK 1206155A1
Authority
HK
Hong Kong
Prior art keywords
electronic component
electronic
component
Prior art date
Application number
HK15106513.8A
Other languages
English (en)
Inventor
植松秀典藤田知宏亀山郎降旗哲也阿部冬希西村和紀
Original Assignee
Skyworks Panasonic Filter Solutions Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skyworks Panasonic Filter Solutions Japan Co Ltd filed Critical Skyworks Panasonic Filter Solutions Japan Co Ltd
Publication of HK1206155A1 publication Critical patent/HK1206155A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
HK15106513.8A 2012-07-11 2015-07-08 電子元件 HK1206155A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012155313 2012-07-11
JP2012279001 2012-12-21
PCT/JP2013/004095 WO2014010197A1 (ja) 2012-07-11 2013-07-02 電子部品

Publications (1)

Publication Number Publication Date
HK1206155A1 true HK1206155A1 (zh) 2015-12-31

Family

ID=49915681

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15106513.8A HK1206155A1 (zh) 2012-07-11 2015-07-08 電子元件

Country Status (7)

Country Link
US (1) US10084125B2 (zh)
EP (1) EP2874312B1 (zh)
JP (2) JPWO2014010197A1 (zh)
KR (1) KR20150045433A (zh)
CN (1) CN104521140B (zh)
HK (1) HK1206155A1 (zh)
WO (1) WO2014010197A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6103906B2 (ja) * 2012-12-06 2017-03-29 スカイワークスフィルターソリューションズジャパン株式会社 弾性波装置と封止体
JP2017022473A (ja) * 2015-07-08 2017-01-26 セイコーエプソン株式会社 振動子及びその製造方法、発振器、電子機器、並びに、移動体
JP2017188621A (ja) * 2016-04-08 2017-10-12 クラスターテクノロジー株式会社 半導体素子実装パッケージおよびその製造方法、ならびに当該パッケージ製造のための基板プレート
JP7087996B2 (ja) * 2018-12-26 2022-06-21 三菱電機株式会社 半導体モジュール、その製造方法及び電力変換装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236456A (ja) * 1985-08-09 1987-02-17 Mitsubishi Electric Corp 半導体素子用封止樹脂
JPH02208256A (ja) * 1989-02-08 1990-08-17 Denki Kagaku Kogyo Kk 低熱膨張性セラミックス及びそれを用いた半導体封止材用充填材
JP4377500B2 (ja) 1999-12-24 2009-12-02 京セラ株式会社 弾性表面波装置及び弾性表面波装置の製造方法
JP2003101383A (ja) * 2001-07-16 2003-04-04 Toshiba Corp 弾性表面波装置及び電子部品装置
JP4089534B2 (ja) 2003-07-29 2008-05-28 株式会社村田製作所 圧電装置
US7400217B2 (en) * 2003-10-30 2008-07-15 Avago Technologies Wireless Ip Pte Ltd Decoupled stacked bulk acoustic resonator band-pass filter with controllable pass bandwith
JP2005217177A (ja) * 2004-01-29 2005-08-11 Kyocera Corp 電子部品装置
JP2006033748A (ja) * 2004-07-21 2006-02-02 Matsushita Electric Ind Co Ltd 薄膜バルク音波共振子
JP2006304145A (ja) * 2005-04-25 2006-11-02 Kyocera Corp 高周波モジュール
JP2007096519A (ja) 2005-09-27 2007-04-12 Kyocera Corp 高周波モジュールおよびその製造方法
US7649235B2 (en) * 2006-02-07 2010-01-19 Panasonic Corporation Electronic component package
JP4484831B2 (ja) * 2006-03-02 2010-06-16 パナソニック株式会社 電子部品内蔵モジュールおよび電子部品内蔵モジュールの製造方法
WO2008039179A1 (en) * 2006-09-26 2008-04-03 Addiction Research Institute, Inc. Compositions for the treatment of hepatitis c and methods for using compositions for the treatment of hepatitis c
WO2008081935A1 (ja) * 2006-12-28 2008-07-10 Kyocera Corporation 弾性表面波装置およびその製造方法
JP4396746B2 (ja) * 2007-08-13 2010-01-13 セイコーエプソン株式会社 電子デバイス
JP5104392B2 (ja) * 2008-02-25 2012-12-19 パナソニック株式会社 弾性表面波デバイス
JP5391600B2 (ja) * 2008-07-16 2014-01-15 船井電機株式会社 振動ミラー素子
JP2010245704A (ja) 2009-04-02 2010-10-28 Sumitomo Bakelite Co Ltd 弾性表面波素子用基板および弾性表面波装置
JP5425005B2 (ja) * 2009-08-19 2014-02-26 日本電波工業株式会社 圧電部品及びその製造方法
JP2011188255A (ja) * 2010-03-09 2011-09-22 Panasonic Corp 弾性波素子
JP5795187B2 (ja) * 2010-08-12 2015-10-14 キヤノン株式会社 対熱膨張性樹脂および対熱膨張性金属

Also Published As

Publication number Publication date
US10084125B2 (en) 2018-09-25
EP2874312A4 (en) 2015-11-18
JP6660415B2 (ja) 2020-03-11
JPWO2014010197A1 (ja) 2016-06-20
EP2874312B1 (en) 2019-04-17
CN104521140B (zh) 2018-10-16
US20150270473A1 (en) 2015-09-24
KR20150045433A (ko) 2015-04-28
CN104521140A (zh) 2015-04-15
JP2018142967A (ja) 2018-09-13
WO2014010197A1 (ja) 2014-01-16
EP2874312A1 (en) 2015-05-20

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