JP5412002B1 - 部品内蔵基板 - Google Patents
部品内蔵基板 Download PDFInfo
- Publication number
- JP5412002B1 JP5412002B1 JP2013192717A JP2013192717A JP5412002B1 JP 5412002 B1 JP5412002 B1 JP 5412002B1 JP 2013192717 A JP2013192717 A JP 2013192717A JP 2013192717 A JP2013192717 A JP 2013192717A JP 5412002 B1 JP5412002 B1 JP 5412002B1
- Authority
- JP
- Japan
- Prior art keywords
- component
- cavity
- support surface
- electronic component
- cavity portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】本発明の一実施形態に係る部品内蔵基板100は、金属製のコア層10と、配線層21と、電子部品30とを具備する。コア層10は、部品収容用のキャビティ部11を有する。配線層21は、コア層10に積層され、キャビティ部11と対向する領域に層間接続用の複数のビア21vが形成される。電子部品30は、複数のビア21vと電気的に接続される複数の端子部31と、キャビティ部11に収容され複数の端子部31を支持する支持面32aを有する部品本体32とを含む。複数の端子部31は支持面32aの中心から第1の方向に偏って配置され、部品本体32はキャビティ部11の中心から上記第1の方向とは反対側の第2の方向に偏って配置される。
【選択図】図1
Description
上記コア層は、部品収容用のキャビティ部を有する。
上記配線層は、上記コア層に積層され、上記キャビティ部と対向する領域に層間接続用の複数のビアが形成される。
上記電子部品は、上記複数のビアと電気的に接続される複数の端子部と、上記キャビティ部に収容され上記複数の端子部を支持する支持面を有する部品本体とを含む。上記複数の端子部は上記支持面の中心から第1の方向に偏って配置され、上記部品本体は上記キャビティ部の中心から上記第1の方向とは反対側の第2の方向に偏って配置される。
上記コア層は、部品収容用のキャビティ部を有する。
上記配線層は、上記コア層に積層され、上記キャビティ部と対向する領域に層間接続用の複数のビアが形成される。
上記電子部品は、上記複数のビアと電気的に接続される複数の端子部と、上記キャビティ部に収容され上記複数の端子部を支持する支持面を有する部品本体とを含む。上記複数の端子部は上記支持面の中心から第1の方向に偏って配置され、上記部品本体は上記キャビティ部の中心から上記第1の方向とは反対側の第2の方向に偏って配置される。
これによりキャビティ部の中心から一方側へ偏って配置された電子部品と当該キャビティ部の隅部とのクリアランスを確保できるため、実装作業性の低下や絶縁不良等の発生が防止される。
図1は、本発明の一実施形態に係る部品内蔵基板の構成を示す概略側断面図である。図2は図1における[A]−[A]線断面図である。
図4(A)〜(C)は、本発明の第2の実施形態に係る部品内蔵基板におけるキャビティ部と電子部品との関係を示す平面図である。以下、第1の実施形態と異なる構成について主に説明し、上述の実施形態と同様の構成については同様の符号を付しその説明を省略または簡略化する。
11,110…キャビティ部
21…第1の配線層
21v…ビア
22…第2の配線層
30,30A,30B,40A,40B…電子部品
31…端子部
32…部品本体
32a…支持面
100…部品内蔵基板
110a…第1の開口部
110b…第2の開口部
Claims (4)
- 部品収容用のキャビティ部を有する金属製のコア層と、
前記コア層に積層され、前記キャビティ部と対向する領域に層間接続用の複数のビアが形成された配線層と、
前記複数のビアと電気的に接続される複数の端子部と、前記キャビティ部に収容され前記複数の端子部を支持する支持面を有する部品本体とを含み、前記複数の端子部が前記支持面の中心から第1の方向に偏って配置され、前記部品本体が前記キャビティ部の中心から前記第1の方向とは反対側の第2の方向に偏って配置された電子部品と
を具備する部品内蔵基板。 - 請求項1に記載の部品内蔵基板であって、
前記キャビティ部は、開口形状が略矩形の第1の開口部を有し、
前記支持面は、略矩形の平面形状を有し、
前記複数の端子部は、前記支持面の周縁に沿って配置される
部品内蔵基板。 - 請求項1又は2に記載の部品内蔵基板であって、
前記部品本体は、セラミクス材料で構成される
部品内蔵基板。 - 請求項2又は3に記載の部品内蔵基板であって、
前記キャビティ部は、前記第1の開口部の四隅位置にそれぞれ形成され前記四隅位置から外方へ突出する複数の第2の開口部をさらに有する
部品内蔵基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013192717A JP5412002B1 (ja) | 2013-09-12 | 2013-09-18 | 部品内蔵基板 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013189176 | 2013-09-12 | ||
JP2013189176 | 2013-09-12 | ||
JP2013192717A JP5412002B1 (ja) | 2013-09-12 | 2013-09-18 | 部品内蔵基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5412002B1 true JP5412002B1 (ja) | 2014-02-12 |
JP2015079777A JP2015079777A (ja) | 2015-04-23 |
Family
ID=50202723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013192717A Expired - Fee Related JP5412002B1 (ja) | 2013-09-12 | 2013-09-18 | 部品内蔵基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9101075B2 (ja) |
JP (1) | JP5412002B1 (ja) |
CN (1) | CN103730425B (ja) |
HK (1) | HK1193500A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106601636B (zh) * | 2016-12-21 | 2018-11-09 | 江苏长电科技股份有限公司 | 一种贴装预包封金属导通三维封装结构的工艺方法 |
CN106684050A (zh) * | 2017-01-25 | 2017-05-17 | 江苏长电科技股份有限公司 | 一种金属柱导通埋芯片线路板结构及其工艺方法 |
CN111372369B (zh) | 2018-12-25 | 2023-07-07 | 奥特斯科技(重庆)有限公司 | 具有部件屏蔽的部件承载件及其制造方法 |
JP7518395B2 (ja) | 2021-12-20 | 2024-07-18 | 日亜化学工業株式会社 | 回路基板、発光装置及びそれらの製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004096058A (ja) * | 2002-07-09 | 2004-03-25 | Shinko Electric Ind Co Ltd | 素子内蔵基板製造方法およびその装置 |
JP2009152415A (ja) * | 2007-12-20 | 2009-07-09 | Ngk Spark Plug Co Ltd | セラミック部品の製造方法 |
JP2009194382A (ja) * | 2008-02-14 | 2009-08-27 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2013058619A (ja) * | 2011-09-08 | 2013-03-28 | Ngk Spark Plug Co Ltd | 部品内蔵配線基板及びその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4638657B2 (ja) | 2003-03-19 | 2011-02-23 | 太陽誘電株式会社 | 電子部品内蔵型多層基板 |
WO2006043474A1 (ja) * | 2004-10-22 | 2006-04-27 | Murata Manufacturing Co., Ltd. | 複合多層基板及びその製造方法 |
US8314343B2 (en) * | 2007-09-05 | 2012-11-20 | Taiyo Yuden Co., Ltd. | Multi-layer board incorporating electronic component and method for producing the same |
JP2010114434A (ja) * | 2008-10-08 | 2010-05-20 | Ngk Spark Plug Co Ltd | 部品内蔵配線基板及びその製造方法 |
TWI458400B (zh) * | 2008-10-31 | 2014-10-21 | Taiyo Yuden Kk | Printed circuit board and manufacturing method thereof |
JP5122018B1 (ja) * | 2012-08-10 | 2013-01-16 | 太陽誘電株式会社 | 電子部品内蔵基板 |
-
2013
- 2013-09-18 JP JP2013192717A patent/JP5412002B1/ja not_active Expired - Fee Related
- 2013-12-09 US US14/101,026 patent/US9101075B2/en not_active Expired - Fee Related
- 2013-12-27 CN CN201310741204.6A patent/CN103730425B/zh not_active Expired - Fee Related
-
2014
- 2014-07-03 HK HK14106733.3A patent/HK1193500A1/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004096058A (ja) * | 2002-07-09 | 2004-03-25 | Shinko Electric Ind Co Ltd | 素子内蔵基板製造方法およびその装置 |
JP2009152415A (ja) * | 2007-12-20 | 2009-07-09 | Ngk Spark Plug Co Ltd | セラミック部品の製造方法 |
JP2009194382A (ja) * | 2008-02-14 | 2009-08-27 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2013058619A (ja) * | 2011-09-08 | 2013-03-28 | Ngk Spark Plug Co Ltd | 部品内蔵配線基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2015079777A (ja) | 2015-04-23 |
CN103730425A (zh) | 2014-04-16 |
US20150070862A1 (en) | 2015-03-12 |
CN103730425B (zh) | 2016-01-06 |
US9101075B2 (en) | 2015-08-04 |
HK1193500A1 (zh) | 2014-09-19 |
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