HK1193500A1 - 部件內置基板 - Google Patents
部件內置基板Info
- Publication number
- HK1193500A1 HK1193500A1 HK14106733.3A HK14106733A HK1193500A1 HK 1193500 A1 HK1193500 A1 HK 1193500A1 HK 14106733 A HK14106733 A HK 14106733A HK 1193500 A1 HK1193500 A1 HK 1193500A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- built
- substrate
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013189176 | 2013-09-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1193500A1 true HK1193500A1 (zh) | 2014-09-19 |
Family
ID=50202723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14106733.3A HK1193500A1 (zh) | 2013-09-12 | 2014-07-03 | 部件內置基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9101075B2 (zh) |
JP (1) | JP5412002B1 (zh) |
CN (1) | CN103730425B (zh) |
HK (1) | HK1193500A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106601636B (zh) * | 2016-12-21 | 2018-11-09 | 江苏长电科技股份有限公司 | 一种贴装预包封金属导通三维封装结构的工艺方法 |
CN106684050A (zh) * | 2017-01-25 | 2017-05-17 | 江苏长电科技股份有限公司 | 一种金属柱导通埋芯片线路板结构及其工艺方法 |
CN111372369B (zh) | 2018-12-25 | 2023-07-07 | 奥特斯科技(重庆)有限公司 | 具有部件屏蔽的部件承载件及其制造方法 |
JP7518395B2 (ja) * | 2021-12-20 | 2024-07-18 | 日亜化学工業株式会社 | 回路基板、発光装置及びそれらの製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4190269B2 (ja) | 2002-07-09 | 2008-12-03 | 新光電気工業株式会社 | 素子内蔵基板製造方法およびその装置 |
JP4638657B2 (ja) | 2003-03-19 | 2011-02-23 | 太陽誘電株式会社 | 電子部品内蔵型多層基板 |
CN100508701C (zh) * | 2004-10-22 | 2009-07-01 | 株式会社村田制作所 | 复合多层基板及其制造方法 |
US8314343B2 (en) * | 2007-09-05 | 2012-11-20 | Taiyo Yuden Co., Ltd. | Multi-layer board incorporating electronic component and method for producing the same |
JP5172319B2 (ja) * | 2007-12-20 | 2013-03-27 | 日本特殊陶業株式会社 | セラミック部品の製造方法 |
US8024858B2 (en) * | 2008-02-14 | 2011-09-27 | Ibiden Co., Ltd. | Method of manufacturing printed wiring board with built-in electronic component |
JP2010114434A (ja) * | 2008-10-08 | 2010-05-20 | Ngk Spark Plug Co Ltd | 部品内蔵配線基板及びその製造方法 |
JP5432918B2 (ja) * | 2008-10-31 | 2014-03-05 | 太陽誘電株式会社 | プリント配線版の製造方法 |
JP5635958B2 (ja) * | 2011-09-08 | 2014-12-03 | 日本特殊陶業株式会社 | 部品内蔵配線基板及びその製造方法 |
JP5122018B1 (ja) * | 2012-08-10 | 2013-01-16 | 太陽誘電株式会社 | 電子部品内蔵基板 |
-
2013
- 2013-09-18 JP JP2013192717A patent/JP5412002B1/ja not_active Expired - Fee Related
- 2013-12-09 US US14/101,026 patent/US9101075B2/en not_active Expired - Fee Related
- 2013-12-27 CN CN201310741204.6A patent/CN103730425B/zh not_active Expired - Fee Related
-
2014
- 2014-07-03 HK HK14106733.3A patent/HK1193500A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US9101075B2 (en) | 2015-08-04 |
US20150070862A1 (en) | 2015-03-12 |
JP5412002B1 (ja) | 2014-02-12 |
CN103730425A (zh) | 2014-04-16 |
JP2015079777A (ja) | 2015-04-23 |
CN103730425B (zh) | 2016-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20211229 |