SG11201401212TA - Probe unit - Google Patents

Probe unit

Info

Publication number
SG11201401212TA
SG11201401212TA SG11201401212TA SG11201401212TA SG11201401212TA SG 11201401212T A SG11201401212T A SG 11201401212TA SG 11201401212T A SG11201401212T A SG 11201401212TA SG 11201401212T A SG11201401212T A SG 11201401212TA SG 11201401212T A SG11201401212T A SG 11201401212TA
Authority
SG
Singapore
Prior art keywords
probe unit
probe
unit
Prior art date
Application number
SG11201401212TA
Other languages
English (en)
Inventor
Akihiro Matsui
Takashi Mori
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of SG11201401212TA publication Critical patent/SG11201401212TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG11201401212TA 2011-10-07 2012-10-04 Probe unit SG11201401212TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011223359 2011-10-07
PCT/JP2012/075862 WO2013051675A1 (ja) 2011-10-07 2012-10-04 プローブユニット

Publications (1)

Publication Number Publication Date
SG11201401212TA true SG11201401212TA (en) 2014-09-26

Family

ID=48043828

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201401212TA SG11201401212TA (en) 2011-10-07 2012-10-04 Probe unit

Country Status (9)

Country Link
US (1) US9291645B2 (ko)
EP (1) EP2765427B1 (ko)
JP (1) JP6109072B2 (ko)
KR (1) KR101582432B1 (ko)
MY (1) MY167999A (ko)
PH (1) PH12014500743B1 (ko)
SG (1) SG11201401212TA (ko)
TW (1) TWI502201B (ko)
WO (1) WO2013051675A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6490600B2 (ja) * 2014-02-13 2019-03-27 日本発條株式会社 検査ユニット
JP6527042B2 (ja) * 2015-07-13 2019-06-05 オルガン針株式会社 ワイヤープローブの保持構造
JP6890921B2 (ja) * 2015-10-21 2021-06-18 株式会社日本マイクロニクス プローブカード及び接触検査装置
JP6740630B2 (ja) * 2016-02-15 2020-08-19 オムロン株式会社 プローブピンおよびこれを用いた検査装置
KR20190013732A (ko) * 2016-05-31 2019-02-11 니혼덴산리드가부시키가이샤 접촉 도전 지그, 및 검사 장치
JP2018009789A (ja) * 2016-07-11 2018-01-18 アルプス電気株式会社 スプリングコンタクトと、スプリングコンタクトを使用したソケット、およびスプリングコンタクトの製造方法
CN107688107B (zh) * 2016-08-04 2019-11-22 创意电子股份有限公司 测试装置与其探针连接器
US10331917B2 (en) * 2016-10-09 2019-06-25 Barys Marozau Device for reading information from electronic ignition switch via pogo pin in motor vehicles
WO2018230627A1 (ja) * 2017-06-14 2018-12-20 日本発條株式会社 導電性接触子ユニット
CN107102181B (zh) * 2017-07-07 2019-10-15 京东方科技集团股份有限公司 测试探针、测试装置及测试方法
CN111913019A (zh) * 2017-09-15 2020-11-10 中华精测科技股份有限公司 探针卡装置的圆形探针
JP2019138768A (ja) * 2018-02-09 2019-08-22 株式会社村田製作所 プローブ
KR101968100B1 (ko) * 2018-03-05 2019-04-12 주식회사 이노글로벌 방열기능을 가진 양방향 도전성 모듈
JP7236848B2 (ja) * 2018-11-27 2023-03-10 日本メクトロン株式会社 プローブ装置、電気検査装置、および電気検査方法
WO2020184684A1 (ja) 2019-03-13 2020-09-17 日本発條株式会社 コンタクトプローブおよび信号伝送方法
US20230180379A1 (en) * 2021-12-03 2023-06-08 Xilinx, Inc. Micro device with adaptable thermal management device

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291129A (en) * 1988-10-24 1994-03-01 Nhk Spring Co., Ltd. Contact probe
US5004977A (en) * 1988-10-24 1991-04-02 Nhk Spring Co., Ltd. Contact probe
JPH02234066A (ja) * 1989-03-08 1990-09-17 Nec Corp インサーキットテスタ用プローブピン
US5003255A (en) * 1989-06-15 1991-03-26 Nhk Spring Co., Ltd. Electric contact probe
JPH0749417Y2 (ja) * 1990-09-28 1995-11-13 三菱重工業株式会社 電気抵抗探傷用探触子
JP3326095B2 (ja) * 1996-12-27 2002-09-17 日本発条株式会社 導電性接触子
JPH09312185A (ja) 1996-05-22 1997-12-02 Nippon Konekuto Kogyo Kk プリント基板用圧接プローブコネクタ
JP3090255B2 (ja) 1996-10-18 2000-09-18 キタムラ機械株式会社 マシニングセンタ
KR20010021666A (ko) 1997-07-14 2001-03-15 마에다 츠구요시 도전성 접촉자
JP2001042002A (ja) * 1999-07-30 2001-02-16 Advantest Corp 半導体デバイス試験装置のタイミング校正用コンタクトボード・このコンタクトボードに接触するプローブ
JP3500105B2 (ja) * 2000-02-10 2004-02-23 日本発条株式会社 導電性接触子用支持体及びコンタクトプローブユニット
JP4889183B2 (ja) * 2000-06-16 2012-03-07 日本発條株式会社 マイクロコンタクタプローブと電気プローブユニット
KR100404713B1 (ko) * 2001-04-23 2003-11-07 주식회사 동광산업 탄소섬유강화 골프샤프트의 개선으로 하여 브레이드섬유강화 골프샤프트를 제조하는 방법
JP3090255U (ja) 2002-05-24 2002-11-29 志成 呉 プローブ構造
US6937045B2 (en) * 2002-07-18 2005-08-30 Aries Electronics, Inc. Shielded integrated circuit probe
JP2005049163A (ja) 2003-07-31 2005-02-24 Yokowo Co Ltd 高周波・高速用デバイスの検査治具および検査用プローブ
JP4438601B2 (ja) * 2004-10-28 2010-03-24 株式会社ヨコオ 検査ユニットの製法
JP2006351474A (ja) * 2005-06-20 2006-12-28 Micronics Japan Co Ltd 電気的接続装置
JP4905876B2 (ja) 2005-10-31 2012-03-28 日本発條株式会社 導電性接触子ホルダの製造方法および導電性接触子ホルダ
MY147876A (en) * 2005-12-05 2013-01-31 Nhk Spring Co Ltd Probe card
EP2093576A4 (en) 2006-12-15 2010-09-22 Nhk Spring Co Ltd CONDUCTIVE CONTACT SUPPORT, CONDUCTIVE CONTACT UNIT AND METHOD FOR MANUFACTURING A CONDUCTIVE CONTACT SUPPORT
KR100843224B1 (ko) * 2007-01-04 2008-07-02 삼성전자주식회사 웨이퍼 테스트용 프로브 카드
CN101669034A (zh) * 2007-04-27 2010-03-10 日本发条株式会社 导电性接触器
US8149008B2 (en) * 2007-07-19 2012-04-03 Nhk Spring Co., Ltd. Probe card electrically connectable with a semiconductor wafer
US7663387B2 (en) 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
WO2009096318A1 (ja) * 2008-02-01 2009-08-06 Nhk Spring Co., Ltd. プローブユニット
JP4900843B2 (ja) * 2008-12-26 2012-03-21 山一電機株式会社 半導体装置用電気接続装置及びそれに使用されるコンタクト
TWI482973B (zh) * 2009-04-03 2015-05-01 Nhk Spring Co Ltd 彈簧用線材、接觸探針及探針單元
WO2010117058A1 (ja) * 2009-04-09 2010-10-14 日本発條株式会社 コンタクトプローブおよびプローブユニット
JP5229104B2 (ja) 2009-05-15 2013-07-03 富士通株式会社 ソケット用プローブ、集積回路用ソケット及び電子装置
WO2011013731A1 (ja) 2009-07-30 2011-02-03 株式会社ヨコオ コンタクトプローブ及びソケット
CN102959406B (zh) * 2010-06-25 2015-08-12 日本发条株式会社 接触探针及探针单元
JP5782261B2 (ja) * 2011-01-17 2015-09-24 株式会社ヨコオ ソケット
MY177561A (en) * 2011-07-19 2020-09-19 Nhk Spring Co Ltd Contact structure unit
JP6107234B2 (ja) * 2013-03-01 2017-04-05 山一電機株式会社 検査用プローブ、および、それを備えるｉｃソケット

Also Published As

Publication number Publication date
EP2765427A1 (en) 2014-08-13
PH12014500743A1 (en) 2014-10-20
EP2765427B1 (en) 2016-12-07
MY167999A (en) 2018-10-10
KR20140065467A (ko) 2014-05-29
US9291645B2 (en) 2016-03-22
WO2013051675A1 (ja) 2013-04-11
TW201331587A (zh) 2013-08-01
KR101582432B1 (ko) 2016-01-04
US20150285840A1 (en) 2015-10-08
JP6109072B2 (ja) 2017-04-05
TWI502201B (zh) 2015-10-01
EP2765427A4 (en) 2015-07-22
JPWO2013051675A1 (ja) 2015-03-30
PH12014500743B1 (en) 2014-10-20

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