JP4438601B2 - 検査ユニットの製法 - Google Patents
検査ユニットの製法 Download PDFInfo
- Publication number
- JP4438601B2 JP4438601B2 JP2004314229A JP2004314229A JP4438601B2 JP 4438601 B2 JP4438601 B2 JP 4438601B2 JP 2004314229 A JP2004314229 A JP 2004314229A JP 2004314229 A JP2004314229 A JP 2004314229A JP 4438601 B2 JP4438601 B2 JP 4438601B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- hole
- contact probe
- metal
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007689 inspection Methods 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 144
- 239000002184 metal Substances 0.000 claims description 144
- 239000000523 sample Substances 0.000 claims description 84
- 229920005989 resin Polymers 0.000 claims description 49
- 239000011347 resin Substances 0.000 claims description 49
- 125000006850 spacer group Chemical group 0.000 claims description 44
- 238000012360 testing method Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
2 金属ブロック
3 固定手段
11、12 プランジャ
13 金属パイプ
31 金属板
32 絶縁性スペーサ
Claims (5)
- 金属ブロックと、該金属ブロックに設けられる貫通孔内に設けられ、先端のプランジャの突出長を可変し得るコンタクトプローブと、前記金属ブロックの少なくとも一面側に設けられ、前記コンタクトプローブが前記金属ブロックの貫通孔から抜け出ないように、かつ、前記金属ブロックの貫通孔内の中心部に位置するように保持する金属板と絶縁性スペーサとで構成される固定手段とを有し、前記固定手段の金属板は、前記コンタクトプローブの位置と合せて前記プランジャを貫通させ得る貫通孔と、前記金属板の貫通孔と同心で前記金属板の前記金属ブロック側に前記金属板の貫通孔より大径の凹部とを備え、前記絶縁性スペーサは、前記金属板の凹部内に設けられ、前記金属板の貫通孔と同心で、前記プランジャを貫通させる貫通孔および前記コンタクトプローブの肩部を挿入し得る凹部とを備えており、前記コンタクトプローブを介して被検査デバイスと検査装置側とを接続する検査ユニットの製法であって、
前記金属板の凹部内に絶縁性樹脂を充填して固化し、前記絶縁性スペーサの貫通孔および凹部を、前記固化した絶縁性樹脂に穴加工することにより、前記絶縁性スペーサを形成することを特徴とする検査ユニットの製法。 - 金属ブロックと、該金属ブロックに設けられる貫通孔内に設けられ、先端のプランジャの突出長を可変し得るコンタクトプローブと、前記金属ブロックの少なくとも一面側に設けられ、前記コンタクトプローブが前記金属ブロックの貫通孔から抜け出ないように、かつ、前記金属ブロックの貫通孔内の中心部に位置するように保持する金属板と絶縁性スペーサとで構成される固定手段とを有し、前記固定手段の金属板は、前記コンタクトプローブの位置と合せて前記プランジャを貫通させ得る貫通孔と、前記金属板の貫通孔と同心で前記金属板の前記金属ブロック側に前記金属板の貫通孔より大径の凹部とを備え、前記絶縁性スペーサは、前記金属板の凹部内に設けられ、前記金属板の貫通孔と同心で、前記プランジャを貫通させる貫通孔および前記コンタクトプローブの肩部を挿入し得る凹部とを備えており、前記コンタクトプローブを介して被検査デバイスと検査装置側とを接続する検査ユニットの製法であって、
前記絶縁性スペーサの貫通孔および凹部を形成する凸部を有する金型に前記金属板を位置合せして樹脂を充填固化させることにより、前記絶縁性スペーサを形成することを特徴とする検査ユニットの製法。 - 前記金属板の凹部の外周に少なくとも1個の窪み部を有する請求項1または2記載の検査ユニットの製法。
- 前記金属板の少なくとも一面に前記金属板の凹部と連通して、前記樹脂の充填の際に樹脂が流れ込み得る樹脂溝を有する請求項1ないし3のいずれか1項記載の検査ユニットの製法。
- 前記金属板の凹部に樹脂を充填する際に、前記金属板の金属ブロック側と反対側の面に樹脂膜を形成する請求項1ないし4のいずれか1項記載の検査ユニットの製法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004314229A JP4438601B2 (ja) | 2004-10-28 | 2004-10-28 | 検査ユニットの製法 |
US11/259,054 US7282378B2 (en) | 2004-10-28 | 2005-10-27 | Method of manufacturing inspection unit |
MYPI20055095A MY139125A (en) | 2004-10-28 | 2005-10-28 | Method and manufacturing inspection unit |
TW094137772A TW200624839A (en) | 2004-10-28 | 2005-10-28 | Method of manufacturing inspection unit |
KR1020050102083A KR20060052285A (ko) | 2004-10-28 | 2005-10-28 | 검사 유닛 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004314229A JP4438601B2 (ja) | 2004-10-28 | 2004-10-28 | 検査ユニットの製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006125988A JP2006125988A (ja) | 2006-05-18 |
JP4438601B2 true JP4438601B2 (ja) | 2010-03-24 |
Family
ID=36262520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004314229A Active JP4438601B2 (ja) | 2004-10-28 | 2004-10-28 | 検査ユニットの製法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7282378B2 (ja) |
JP (1) | JP4438601B2 (ja) |
KR (1) | KR20060052285A (ja) |
MY (1) | MY139125A (ja) |
TW (1) | TW200624839A (ja) |
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JP4438601B2 (ja) * | 2004-10-28 | 2010-03-24 | 株式会社ヨコオ | 検査ユニットの製法 |
CN201000930Y (zh) * | 2006-08-02 | 2008-01-02 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
WO2008072699A1 (ja) * | 2006-12-15 | 2008-06-19 | Nhk Spring Co., Ltd. | 導電性接触子ホルダ、導電性接触子ユニット、および導電性接触子ホルダの製造方法 |
CN101350464B (zh) * | 2007-07-20 | 2011-05-04 | 深圳富泰宏精密工业有限公司 | 导电柱及具有该导电柱的电子装置 |
JP4937882B2 (ja) * | 2007-11-01 | 2012-05-23 | 株式会社日本マイクロニクス | 検査ソケット |
GB2477358A (en) * | 2010-02-02 | 2011-08-03 | Thales Holdings Uk Plc | RF testing an integrated circuit assembly during manufacture using a interposed adaptor layer which is removed after test to attach the IC to a BGA |
US9689897B2 (en) * | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
US8808010B2 (en) * | 2011-06-06 | 2014-08-19 | Interconnect Devices, Inc. | Insulated metal socket |
TWI514687B (zh) * | 2011-07-15 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | 電連接器及其連接器端子 |
US9291645B2 (en) * | 2011-10-07 | 2016-03-22 | Nhk Spring Co., Ltd. | Probe unit |
US8758066B2 (en) * | 2012-02-03 | 2014-06-24 | Interconnect Devices, Inc. | Electrical connector with insulation member |
JP5658718B2 (ja) * | 2012-08-20 | 2015-01-28 | オルガン針株式会社 | 充放電用プローブの先端形状 |
US8994393B2 (en) * | 2012-09-06 | 2015-03-31 | International Business Machines Corporation | High-frequency cobra probe |
KR101576668B1 (ko) * | 2014-08-18 | 2015-12-22 | 한전케이피에스 주식회사 | 블록형 프로브 장치 |
JP6480798B2 (ja) * | 2015-04-23 | 2019-03-13 | 株式会社ヨコオ | ソケット |
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US9899757B2 (en) * | 2015-09-03 | 2018-02-20 | Apple Inc. | Surface connector with silicone spring member |
KR101762836B1 (ko) * | 2015-09-10 | 2017-07-28 | 리노공업주식회사 | 프로브 소켓 |
JP6601138B2 (ja) * | 2015-10-16 | 2019-11-06 | 山一電機株式会社 | Icソケット |
CN206096201U (zh) * | 2016-07-21 | 2017-04-12 | 梁永焯 | 用于半导体晶圆测试的系统、切线探针卡及其探头组件 |
KR101920822B1 (ko) | 2017-04-21 | 2019-02-13 | 리노공업주식회사 | 프로브 소켓 |
JP2020521986A (ja) * | 2017-05-26 | 2020-07-27 | スミスズ インターコネクト アメリカズ インコーポレイテッドSmiths Interconnect Americas, Inc. | インピーダンス制御テストソケット |
KR101975836B1 (ko) | 2017-08-11 | 2019-08-28 | 리노공업주식회사 | 검사장치 |
KR101954086B1 (ko) * | 2017-11-07 | 2019-03-06 | 리노공업주식회사 | 검사 프로브 조립체 및 검사 소켓 |
CN111316111B (zh) * | 2017-11-30 | 2022-08-05 | 恩普乐股份有限公司 | 电连接用插座及电连接用插座的制造方法 |
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CN113109600B (zh) * | 2021-03-30 | 2022-12-13 | 渭南木王智能科技股份有限公司 | 一种半导体测试探针用磨斜面夹紧定位装置 |
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-
2004
- 2004-10-28 JP JP2004314229A patent/JP4438601B2/ja active Active
-
2005
- 2005-10-27 US US11/259,054 patent/US7282378B2/en active Active
- 2005-10-28 TW TW094137772A patent/TW200624839A/zh unknown
- 2005-10-28 MY MYPI20055095A patent/MY139125A/en unknown
- 2005-10-28 KR KR1020050102083A patent/KR20060052285A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TW200624839A (en) | 2006-07-16 |
US20060094134A1 (en) | 2006-05-04 |
US7282378B2 (en) | 2007-10-16 |
JP2006125988A (ja) | 2006-05-18 |
KR20060052285A (ko) | 2006-05-19 |
MY139125A (en) | 2009-08-28 |
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