CN101350464B - 导电柱及具有该导电柱的电子装置 - Google Patents
导电柱及具有该导电柱的电子装置 Download PDFInfo
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- 229910052709 silver Inorganic materials 0.000 description 4
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- 229910052718 tin Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
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- 239000004593 Epoxy Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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Abstract
本发明公开了一种导电柱及具有该导电柱的电子装置,该电子装置包括一导电柱及一电路板,该导电柱设置于该电路板上,该导电柱具有一楔形面,且所述导电柱包括一柱身及一连接于该柱身一端的连接部,所述楔形面位于该柱身的外壁邻接连接部的一端,所述楔形面由柱身的外壁倾斜而成,以便该导电柱在受到外力的撞击下由该楔形面断裂。
Description
技术领域
本发明涉及一种导电柱及具有该导电柱的电子装置,尤其涉及一种可防止损坏电路板的导电柱及具有该导电柱的电子装置。
背景技术
在日常生活中,人们经常使用到移动电话及个人数位助理(personal digital assitant,PDA)等电子装置。静电放电是人们在使用各式各样的电子装置时经常遇到的问题。静电放电对电子装置及人身安全都有一定的损害,因此大多数电子装置都具有接地结构。
请参阅图1,现有的一电子装置10包括一电路板11、若干导电柱12、一盖板13及若干电子元件14。该导电柱12设置于该电路板11上,该盖板13盖设于该电路板11上且与该导电柱12相抵接。该电子元件14设置于该电路板11上。
该电路板11包括一导线层111、一绝缘层112、一接地层113及若干连接埠114。该绝缘层112设置于该导线层111及接地层113之间。该电路板11贯通其导线层111及绝缘层112开设若干通孔115,用于容置一连接埠114于其内,以便该导电柱12得以通过该连接埠114电连接于该接地层113,从而使得该盖板13达到接地的目的。
然而,所述电子装置10的导电柱12比设置于电路板11上的电子元件14高,因此其在电子装置10的组装过程中经常会被撞击而损毁,进而伤及与其相连接的连接埠114,从而造成整块电路板11的报废损毁,大大增加了电子装置10的生产成本。
发明内容
有鉴于此,有必要提供一种能够有效防止电路板损坏的导电柱。
还有必要提供一种具有该导电柱的电子装置。
一种具有导电柱的电子装置,包括一导电柱及一电路板,该导电柱设置于该电路板上,该导电柱具有一楔形面,且所述导电柱包括一柱身及一连接于该柱身一端的连接部,所述楔形面位于该柱身的外壁邻接连接部的一端,所述楔形面由柱身的外壁倾斜而成,以便该导电柱在受到外力的撞击下由该楔形面断裂。
一种导电柱,该导电柱具有一楔形面,且所述导电柱包括一柱身及一连接于该柱身一端的连接部,所述楔形面位于该柱身的外壁邻接连接部的一端,所述楔形面由柱身的外壁倾斜而成,以便其在受到外力的撞击下由该楔形面断裂。
相较现有技术,所述具有导电柱的电子装置采用了具有一楔形面的导电柱,使得导电柱在被撞击的时候自行在该楔形面断裂,从而保护了电路板结构不被损坏,而导电柱只需通过焊接等方式再次连接于连接埠即可,如此大大减少了生产成本。
附图说明
图1是现有导电柱及具有该导电柱的电子装置的立体分解示意图;
图2是本发明导电柱及具有该导电柱的电子装置的较佳实施例的立体分解示意图;
图3是本发明导电柱及具有该导电柱的电子装置的较佳实施例的立体组装示意图;
图4是图3所示的导电柱的立体剖视图。
具体实施方式
本发明公开了一种导电柱及具有该导电柱的电子装置,其适用于移动电话或个人数位助理(personal digital assitant,PDA)等电子装置。
请参阅图2及图3所示的本发明导电柱及具有该导电柱的电子装置的较佳实施例,该电子装置20包括一电路板21、至少一导电柱22及一盖板23。该导电柱22设置于该电路板21上,该盖板23盖设于该电路板21上且与该导电柱22相抵接。
该电路板21包括一导线层211、一绝缘层212、一接地层213及若干连接埠214。该电路板21贯通其导线层211及绝缘层212开设至少一通孔215。该通孔215与该连接埠214对应开设,用于容置一连接埠214于其内,以便该导电柱23得以通过该连接埠214电连接于该接地层213,从而使得该盖板22达到接地的目的。
该导线层211是一导电金属薄层,如铜、银或锡等,其设置于该绝缘层212的上表面。该导线层211以锡焊的方式连接有若干电子元件24,如电容及电感等。该导线层211具有导电性高、抗拉强度大、可挠曲、比重小及耐腐蚀等特点。
该绝缘层212是一与导线层211相平行的薄层,其设置于该导线层211及接地层213之间。该绝缘层212是由一绝缘隔热、无法弯曲的材质制成,如玻璃环氧树脂(Glass Epoxy)等。该绝缘层212是用于隔绝导线层211与接地层213之间的电流以防止导线层211与接地层213电气接触而短路。
该接地层213亦是一导电金属薄层,如铜、银或锡等,其与导线层211平行并设置于绝缘层212的下表面。该接地层213用于接收盖板22所积聚的静电荷,并将该静电荷导入主地,以免电子装置20产生静电放电。
该连接埠214用于电连接该导电柱22及电路板21的接地层213。该连接埠214由金属导电材质,如铜、银或锡等填充于通孔215而成。
请参阅图4,该导电柱22在本实施例中为一顶针式连接器,其由一金属导电材质制成,如铜、银或锡等。该导电柱22包括一柱头221、一柱身222、一连接部223及一弹簧224。该柱头221可伸缩地容置于柱身222,该连接部223连接该柱身222的一端。
该柱头221具有一头部2211及一连接于该头部2211的尾部2212。
该柱身222大致为一中空柱体,其内开设一容置室2221,并于其两端分别形成一第一开口2222及一第二开口2223。第一开口2222的尺寸与柱头221的头部2211的尺寸大致相当。第二开口2223与连接部223连接。该柱身222的外壁邻接该第二开口2223处为一楔形面2224,以提高该柱身222的脆裂性。该楔形面2224由柱身222的外壁自第二开口2223远离容置室2221向外倾斜而成,如此柱身222与连接部223的连接处的厚度最小。
该连接部223为一实心圆柱体,其通过表面粘着技术(Surface-mounting Techonology,SMT)电连接于连接埠214上,从而与接地层213电连接。
该弹簧224容置于柱身222的容置室2221,且一端抵持于连接部223,另一端抵持于柱头221的尾部2212。
组装该导电柱22时,首先将柱头221从柱身222的第二开口2223容置于柱身222的容置室2221内,且让柱头221的头部221伸出于柱身222的第一开口2222;然后将弹簧224从柱身222的第二开口2223容置于柱身222的容置室2221内,且让其一端抵持于柱头221的尾部2212;最后将连接部223连接于柱身222的第二开口2223,使得弹簧224的另一端抵持于连接部223。
请再次参阅图2及图3,该盖板23大致为一平板体,其可以是电子装置20的机壳及电池盖等。该盖板23为一金属导电板,其抵接于该导电柱22的柱头221上,并与该导电柱22电连接。
组装该电子装置20时,首先将该导电柱22的连接部223对准对应的电路板21的连接埠214;然后通过表面粘着技术将该连接部223固定连接于该连接埠214,从而与该接地层213电连接;最后将该盖板23盖设于该导电柱22的柱头221上,以便该盖板23与该导电柱22电连接,如此即将该电子装置20组装完毕。
所述电子装置20采用了具有一楔形面2224的导电柱22来连接盖板23及接地层213,使得导电柱22在被撞击的时候由楔形面2224断裂,从而保护了更为重要的连接埠214,避免了整块电路板21的报废,而导电柱22只需通过焊接等方式再次连接于连接埠214即可,如此大大减少了生产成本。
Claims (8)
1.一种具有导电柱的电子装置,包括一导电柱及一电路板,该
导电柱设置于该电路板上,其特征在于:该导电柱具有一楔形面,且所述导电柱包括一柱身及一连接于该柱身一端的连接部,所述楔形面位于该柱身的外壁邻接连接部的一端,所述楔形面由柱身的外壁倾斜而成,以便该导电柱在受到外力的撞击下由该楔形面断裂。
2.如权利要求1所述的具有导电柱的电子装置,其特征在于:该柱身与连接部的连接处的厚度最小。
3.如权利要求1所述的具有导电柱的电子装置,其特征在于:所述导电柱还包括一柱头及一弹簧,该柱身具有一内孔,该弹簧容置于该内孔,该弹簧的一端抵持于柱头,另一端抵持于连接部。
4.如权利要求1所述的具有导电柱的电子装置,其特征在于:所述具有导电柱的电子装置还包括一盖板,该盖板盖设于该电路板上且与该导电柱相抵接。
5.一种导电柱,其特征在于:该导电柱具有一楔形面,且所述导电柱包括一柱身及一连接于该柱身一端的连接部,所述楔形面位于该柱身的外壁邻接连接部的一端,所述楔形面由柱身的外壁倾斜而成,以便其在受到外力的撞击下由该楔形面断裂。
6.如权利要求5所述的导电柱,其特征在于:该柱身与连接部的连接处的厚度最小。
7.如权利要求5所述的导电柱,其特征在于:所述导电柱还包括一柱头,该柱头具有一头部及一连接于该头部的尾部。
8.如权利要求5所述的导电柱,其特征在于:所述导电柱还包括一弹簧,该柱身具有一内孔,该弹簧容置于该内孔,且其一端抵持于柱头,另一端抵持于连接部。
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CN200710076090.2A CN101350464B (zh) | 2007-07-20 | 2007-07-20 | 导电柱及具有该导电柱的电子装置 |
US11/952,973 US7813142B2 (en) | 2007-07-20 | 2007-12-07 | Portable electronic device with conducting pole |
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JP4828617B2 (ja) * | 2009-04-20 | 2011-11-30 | ソニー エリクソン モバイル コミュニケーションズ, エービー | スプリングコネクタ及び端末装置 |
DE202010003457U1 (de) * | 2010-03-11 | 2010-06-02 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Leiterplattensteckverbinder |
CN102665375B (zh) * | 2012-05-31 | 2014-12-17 | 昆山市线路板厂 | 一种聚酯材料挠性电路板低温焊接系统及焊接方法 |
EP2962365A1 (en) * | 2013-02-27 | 2016-01-06 | ABB Technology AG | Programming connector |
DE102016112571A1 (de) * | 2016-07-08 | 2018-01-11 | Harting Electric Gmbh & Co. Kg | Anordnung und Verfahren zur Masseanbindung einer Leiterkarte an ein Gehäuse eines elektrischen Gerätes |
US11518005B2 (en) * | 2017-12-12 | 2022-12-06 | Bae Systems Information And Electronic Systems Integration Inc. | Apparatus for engaging a guide pin |
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JPH10189087A (ja) * | 1996-12-25 | 1998-07-21 | Nec Yamagata Ltd | ポゴピン |
JP2002343479A (ja) | 2001-05-11 | 2002-11-29 | Yokowo Co Ltd | 電気接続構造 |
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2007
- 2007-07-20 CN CN200710076090.2A patent/CN101350464B/zh not_active Expired - Fee Related
- 2007-12-07 US US11/952,973 patent/US7813142B2/en not_active Expired - Fee Related
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US5641315A (en) * | 1995-11-16 | 1997-06-24 | Everett Charles Technologies, Inc. | Telescoping spring probe |
CN2746547Y (zh) * | 2004-07-30 | 2005-12-14 | 禾昌兴业股份有限公司 | 电池连接器顶针 |
CN2727989Y (zh) * | 2004-09-26 | 2005-09-21 | 青岛源日电子有限公司 | 弹簧电子连接器 |
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Also Published As
Publication number | Publication date |
---|---|
CN101350464A (zh) | 2009-01-21 |
US20090020312A1 (en) | 2009-01-22 |
US7813142B2 (en) | 2010-10-12 |
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