TWI799834B - 測試座以及其製造方法 - Google Patents

測試座以及其製造方法 Download PDF

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Publication number
TWI799834B
TWI799834B TW110113673A TW110113673A TWI799834B TW I799834 B TWI799834 B TW I799834B TW 110113673 A TW110113673 A TW 110113673A TW 110113673 A TW110113673 A TW 110113673A TW I799834 B TWI799834 B TW I799834B
Authority
TW
Taiwan
Prior art keywords
fabricating
same
test socket
socket
test
Prior art date
Application number
TW110113673A
Other languages
English (en)
Other versions
TW202144784A (zh
Inventor
白承夏
金勤洙
鄭宰歡
申晶澈
Original Assignee
南韓商李諾工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020210013607A external-priority patent/KR102570428B1/ko
Application filed by 南韓商李諾工業股份有限公司 filed Critical 南韓商李諾工業股份有限公司
Publication of TW202144784A publication Critical patent/TW202144784A/zh
Application granted granted Critical
Publication of TWI799834B publication Critical patent/TWI799834B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW110113673A 2020-05-22 2021-04-16 測試座以及其製造方法 TWI799834B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20200061463 2020-05-22
KR10-2020-0061463 2020-05-22
KR10-2021-0013607 2021-01-29
KR1020210013607A KR102570428B1 (ko) 2020-05-22 2021-01-29 검사소켓 및 그의 제조방법

Publications (2)

Publication Number Publication Date
TW202144784A TW202144784A (zh) 2021-12-01
TWI799834B true TWI799834B (zh) 2023-04-21

Family

ID=78708711

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110113673A TWI799834B (zh) 2020-05-22 2021-04-16 測試座以及其製造方法

Country Status (4)

Country Link
US (1) US20220413008A1 (zh)
JP (1) JP7430253B2 (zh)
TW (1) TWI799834B (zh)
WO (1) WO2021235844A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102587516B1 (ko) * 2023-05-18 2023-10-11 주식회사 티에스이 테스트 소켓

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007178165A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
TW201118381A (en) * 2009-11-16 2011-06-01 Pleader Yamaichi Co Ltd Test device for high-frequency vertical probe card
US20130271175A1 (en) * 2012-04-13 2013-10-17 Formfactor, Inc. Wiring Substrate With Filled Vias To Accommodate Custom Terminals
KR101534778B1 (ko) * 2014-01-24 2015-07-09 리노공업주식회사 검사장치
US20150233973A1 (en) * 2013-12-17 2015-08-20 Tim WOODEN Method of Manufacturing a Test Socket Body of an Impedance-Matched Test Socket
US20190206750A1 (en) * 2018-01-04 2019-07-04 Winway Technology Co., Ltd. Testing method for testing wafer level chip scale packages
TWI679424B (zh) * 2019-03-29 2019-12-11 矽品精密工業股份有限公司 檢測裝置及其製法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4438601B2 (ja) 2004-10-28 2010-03-24 株式会社ヨコオ 検査ユニットの製法
JP2009129877A (ja) 2007-11-28 2009-06-11 S Ii R:Kk 電子部品用ソケット
JP4921344B2 (ja) 2007-12-26 2012-04-25 株式会社ヨコオ 検査ソケット
JP6475479B2 (ja) 2014-11-27 2019-02-27 株式会社ヨコオ 検査ユニット
JP6827029B2 (ja) 2015-07-03 2021-02-10 オキンス エレクトロニクス カンパニー リミテッド テストソケット、テストソケットの製造方法、およびテストソケット用治具アセンブリー

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007178165A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
TW201118381A (en) * 2009-11-16 2011-06-01 Pleader Yamaichi Co Ltd Test device for high-frequency vertical probe card
US20130271175A1 (en) * 2012-04-13 2013-10-17 Formfactor, Inc. Wiring Substrate With Filled Vias To Accommodate Custom Terminals
US20150233973A1 (en) * 2013-12-17 2015-08-20 Tim WOODEN Method of Manufacturing a Test Socket Body of an Impedance-Matched Test Socket
KR101534778B1 (ko) * 2014-01-24 2015-07-09 리노공업주식회사 검사장치
US20190206750A1 (en) * 2018-01-04 2019-07-04 Winway Technology Co., Ltd. Testing method for testing wafer level chip scale packages
TWI679424B (zh) * 2019-03-29 2019-12-11 矽品精密工業股份有限公司 檢測裝置及其製法

Also Published As

Publication number Publication date
TW202144784A (zh) 2021-12-01
US20220413008A1 (en) 2022-12-29
WO2021235844A1 (en) 2021-11-25
JP7430253B2 (ja) 2024-02-09
JP2022550155A (ja) 2022-11-30

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