TWI799873B - 測試座及其製造方法 - Google Patents

測試座及其製造方法 Download PDF

Info

Publication number
TWI799873B
TWI799873B TW110119211A TW110119211A TWI799873B TW I799873 B TWI799873 B TW I799873B TW 110119211 A TW110119211 A TW 110119211A TW 110119211 A TW110119211 A TW 110119211A TW I799873 B TWI799873 B TW I799873B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
test socket
socket
test
Prior art date
Application number
TW110119211A
Other languages
English (en)
Other versions
TW202146906A (zh
Inventor
申榮澤
李炳哲
Original Assignee
南韓商李諾工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商李諾工業股份有限公司 filed Critical 南韓商李諾工業股份有限公司
Publication of TW202146906A publication Critical patent/TW202146906A/zh
Application granted granted Critical
Publication of TWI799873B publication Critical patent/TWI799873B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW110119211A 2020-06-01 2021-05-27 測試座及其製造方法 TWI799873B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2020-0065853 2020-06-01
KR1020200065853A KR102295761B1 (ko) 2020-06-01 2020-06-01 검사소켓

Publications (2)

Publication Number Publication Date
TW202146906A TW202146906A (zh) 2021-12-16
TWI799873B true TWI799873B (zh) 2023-04-21

Family

ID=77779704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110119211A TWI799873B (zh) 2020-06-01 2021-05-27 測試座及其製造方法

Country Status (7)

Country Link
US (1) US20230228808A1 (zh)
EP (1) EP4158358A1 (zh)
JP (1) JP2023529323A (zh)
KR (1) KR102295761B1 (zh)
CN (1) CN115698729A (zh)
TW (1) TWI799873B (zh)
WO (1) WO2021246719A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102315536B1 (ko) * 2021-08-31 2021-10-21 하병호 검사소켓 및 그 제조방법
KR102598055B1 (ko) * 2023-01-10 2023-11-06 하이콘 주식회사 반도체 소자 테스트용 소켓장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005180922A (ja) * 2003-12-15 2005-07-07 Yamaichi Electronics Co Ltd 検査装置用ケーブルの配線構造
JP2010060527A (ja) * 2008-09-05 2010-03-18 Yokowo Co Ltd グランド用コンタクトプローブを有する検査ユニット
TW201339583A (zh) * 2012-03-16 2013-10-01 Choice Sun Technology Co Ltd 測試用探針裝置
TW201723490A (zh) * 2015-12-18 2017-07-01 吳俊杰 探針裝置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101095907B1 (ko) * 2010-08-17 2011-12-21 리노공업주식회사 검사용 소켓
JP6157047B2 (ja) * 2011-02-01 2017-07-05 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
KR101552552B1 (ko) * 2014-08-22 2015-09-14 리노공업주식회사 테스트 소켓
KR101762836B1 (ko) * 2015-09-10 2017-07-28 리노공업주식회사 프로브 소켓
KR101798853B1 (ko) * 2016-02-12 2017-11-20 리노공업주식회사 테스트 소켓
KR101882209B1 (ko) * 2016-03-23 2018-07-27 리노공업주식회사 동축 테스트소켓 조립체
KR101827860B1 (ko) * 2016-08-12 2018-02-12 주식회사 아이에스시 핀 블록 어셈블리
KR101975836B1 (ko) * 2017-08-11 2019-08-28 리노공업주식회사 검사장치
KR102044753B1 (ko) * 2018-05-25 2019-11-15 리노공업주식회사 검사장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005180922A (ja) * 2003-12-15 2005-07-07 Yamaichi Electronics Co Ltd 検査装置用ケーブルの配線構造
JP2010060527A (ja) * 2008-09-05 2010-03-18 Yokowo Co Ltd グランド用コンタクトプローブを有する検査ユニット
TW201339583A (zh) * 2012-03-16 2013-10-01 Choice Sun Technology Co Ltd 測試用探針裝置
TW201723490A (zh) * 2015-12-18 2017-07-01 吳俊杰 探針裝置

Also Published As

Publication number Publication date
US20230228808A1 (en) 2023-07-20
WO2021246719A1 (en) 2021-12-09
JP2023529323A (ja) 2023-07-10
EP4158358A1 (en) 2023-04-05
TW202146906A (zh) 2021-12-16
CN115698729A (zh) 2023-02-03
KR102295761B1 (ko) 2021-09-01

Similar Documents

Publication Publication Date Title
EP3915706A4 (en) METHOD OF MAKING HETEROMETALLIC ARRANGEMENT AND HETEROMETALLIC ARRANGEMENT
TWI799873B (zh) 測試座及其製造方法
EP3957411A4 (en) MANUFACTURING METHOD AND PRODUCTION DEVICE FOR CONNECTING COMPONENT
TWI799796B (zh) 積體電路和製造積體電路的方法
TWI800191B (zh) 滑鼠裝置及其組裝調校方法
EP3935689A4 (en) ANTENNA STRUCTURE AND METHOD OF MANUFACTURE THEREOF
EP3995486A4 (en) PEPTIDE AND PROCESS FOR THE PREPARATION THEREOF
EP3995223A4 (en) MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR STRUCTURAL ELEMENT
EP3965173A4 (en) LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURE THEREOF
EP3920215A4 (en) HEAT DISSIPATION ELEMENT AND METHOD OF MANUFACTURING THEREOF
EP3902048A4 (en) CELL PREPARATION DEVICE AND METHOD
TWI800143B (zh) 測試座以及其製造方法
TWI799834B (zh) 測試座以及其製造方法
EP3919202A4 (en) CAN BODY AND METHOD OF MANUFACTURING THEREOF
EP3922764A4 (en) RECOMBINANT STRUCTURED PROTEIN MULTIFILAMENT AND METHOD FOR MAKING IT
EP3907784A4 (en) ELECTRODE AND METHOD FOR MANUFACTURING IT
EP3950993A4 (en) CARBONED COMPONENT AND PROCESS FOR ITS MANUFACTURE
EP4138144A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THEREOF
EP3956121A4 (en) AUTOMOTIVE WINDOWGLASS ASSEMBLY AND METHOD OF MANUFACTURE THEREOF
EP3928911A4 (en) BUS BAR JOINT AND METHOD OF MAKING BUS BAR JOINT
EP3920214A4 (en) HEAT DISSIPATION ELEMENT AND METHOD OF MANUFACTURING THEREOF
EP3993188A4 (en) DEVICE FOR GENERATION OF EFFECTIVE COMPONENTS AND METHOD OF MANUFACTURE THEREOF
EP3975282A4 (en) METHOD OF MANUFACTURING A SEPARATOR AND SEPARATOR MANUFACTURED THEREFORE
EP3950204A4 (en) CONNECTION STRUCTURE, AUTOMOTIVE PART AND METHOD OF MAKING A CONNECTION STRUCTURE
EP3895668A4 (en) ENDOPROSTHESIS AND METHOD FOR MANUFACTURING IT