JP4921344B2 - 検査ソケット - Google Patents
検査ソケット Download PDFInfo
- Publication number
- JP4921344B2 JP4921344B2 JP2007335315A JP2007335315A JP4921344B2 JP 4921344 B2 JP4921344 B2 JP 4921344B2 JP 2007335315 A JP2007335315 A JP 2007335315A JP 2007335315 A JP2007335315 A JP 2007335315A JP 4921344 B2 JP4921344 B2 JP 4921344B2
- Authority
- JP
- Japan
- Prior art keywords
- metal block
- contact probe
- hole
- contact
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007689 inspection Methods 0.000 title claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 121
- 239000002184 metal Substances 0.000 claims description 121
- 239000000523 sample Substances 0.000 claims description 118
- 239000004020 conductor Substances 0.000 claims description 12
- 239000011148 porous material Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001509 metal bromide Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Description
11 プランジャ
13 金属パイプ
17 グランドチューブ
18 グランド板
2 金属ブロック
21 第1の分割ブロック
22 第2の分割ブロック
23 第3の分割ブロック
24 貫通孔
31 押え板
32 押え板
4 絶縁シート
41 孔
5 位置決めピン
Claims (4)
- 金属ブロックと、該金属ブロックの貫通孔内に空隙を介して設けられ、同軸構造の中心導体とする信号用コンタクトプローブと、該信号用コンタクトプローブを含むコンタクトプローブの軸方向および径方向の移動を押えるために前記金属ブロックの両面に設けられる絶縁性の押え板とを有し、前記金属ブロックの一面側に設けられる被検査デバイスの電極端子と該金属ブロックの他面側に設けられる検査装置と接続された配線基板の配線とを前記同軸構造のコンタクトプローブを介して接続し、前記被検査デバイスの特性検査を行う検査ソケットであって、前記金属ブロックの貫通孔を横切る面で前記金属ブロックが少なくとも2分割され、該少なくとも2分割された金属ブロックの分割面に、前記金属ブロックの貫通孔と同心になり、前記信号用コンタクトプローブの外径より大きく、前記貫通孔の内径より小さい孔があけられた絶縁シートを介在させて前記少なくとも2分割された金属ブロックが固定されてなる検査ソケット。
- 前記金属ブロックが、該金属ブロックの厚さ方向における中央付近で2分割されてなる請求項1記載の検査ソケット。
- 前記金属ブロックが、略等間隔で3分割以上に分割されてなる請求項1記載の検査ソケット。
- 前記金属ブロックと前記絶縁性の押え板との間に、グランドコンタクトプローブと接触し、他のコンタクトプローブとは接触しないように形成されたグランド板が介在され、前記絶縁シートに形成される孔が、全てのコンタクトプローブに対して同じ孔径で形成されてなる請求項1、2または3記載の検査ソケット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007335315A JP4921344B2 (ja) | 2007-12-26 | 2007-12-26 | 検査ソケット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007335315A JP4921344B2 (ja) | 2007-12-26 | 2007-12-26 | 検査ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009156710A JP2009156710A (ja) | 2009-07-16 |
JP4921344B2 true JP4921344B2 (ja) | 2012-04-25 |
Family
ID=40960889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007335315A Active JP4921344B2 (ja) | 2007-12-26 | 2007-12-26 | 検査ソケット |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4921344B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101911496B1 (ko) * | 2018-04-13 | 2018-12-28 | 황동원 | 반도체 디바이스 테스트 소켓장치 |
KR102321126B1 (ko) * | 2020-05-22 | 2021-11-04 | 리노공업주식회사 | 검사소켓의 제조방법 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6286371B2 (ja) * | 2013-02-08 | 2018-02-28 | 日本発條株式会社 | プローブユニット用ベース部材、プローブユニットおよびプローブユニット用ベース部材の製造方法 |
KR101534778B1 (ko) * | 2014-01-24 | 2015-07-09 | 리노공업주식회사 | 검사장치 |
JP6436711B2 (ja) * | 2014-10-01 | 2018-12-12 | 日本発條株式会社 | プローブユニット |
JP6475479B2 (ja) * | 2014-11-27 | 2019-02-27 | 株式会社ヨコオ | 検査ユニット |
KR101691192B1 (ko) * | 2015-02-27 | 2016-12-30 | 주식회사 오킨스전자 | 반도체 디바이스 테스트용 소켓 |
JP6752829B2 (ja) * | 2015-03-13 | 2020-09-09 | テクノプローベ エス.ピー.エー. | 高周波適用に適したバーチカルプローブをもつ試験ヘッド |
JP6473364B2 (ja) * | 2015-03-30 | 2019-02-20 | 日本発條株式会社 | プローブユニット |
KR101762836B1 (ko) * | 2015-09-10 | 2017-07-28 | 리노공업주식회사 | 프로브 소켓 |
KR101772396B1 (ko) * | 2016-01-29 | 2017-08-29 | 퀄맥스시험기술 주식회사 | 에어갭을 이용한 테스트 소켓 |
JP7068578B2 (ja) | 2018-03-30 | 2022-05-17 | 山一電機株式会社 | 検査用ソケット |
TWI799834B (zh) | 2020-05-22 | 2023-04-21 | 南韓商李諾工業股份有限公司 | 測試座以及其製造方法 |
KR102321112B1 (ko) * | 2020-05-22 | 2021-11-04 | 리노공업주식회사 | 검사소켓의 제조방법 |
CN216646721U (zh) * | 2020-06-22 | 2022-05-31 | 株式会社友华 | 检查装置 |
CN112083200A (zh) * | 2020-09-11 | 2020-12-15 | 苏州韬盛电子科技有限公司 | 一种新型高频测试插座 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001099889A (ja) * | 1999-09-29 | 2001-04-13 | Yokowo Co Ltd | 高周波回路の検査装置 |
JP4535828B2 (ja) * | 2004-09-30 | 2010-09-01 | 株式会社ヨコオ | 検査ユニットの製法 |
-
2007
- 2007-12-26 JP JP2007335315A patent/JP4921344B2/ja active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101911496B1 (ko) * | 2018-04-13 | 2018-12-28 | 황동원 | 반도체 디바이스 테스트 소켓장치 |
WO2019198853A1 (ko) * | 2018-04-13 | 2019-10-17 | 황동원 | 반도체 디바이스 테스트용 콘택트 및 테스트 소켓장치 |
US10761110B2 (en) | 2018-04-13 | 2020-09-01 | Dong Weon Hwang | Contact for testing semiconductor device, and test socket device therefor |
CN112041689A (zh) * | 2018-04-13 | 2020-12-04 | 黄东源 | 用于测试半导体器件的接触件及测试插座 |
CN112041689B (zh) * | 2018-04-13 | 2024-03-12 | 黄东源 | 用于测试半导体器件的接触件及测试插座 |
KR102321126B1 (ko) * | 2020-05-22 | 2021-11-04 | 리노공업주식회사 | 검사소켓의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP2009156710A (ja) | 2009-07-16 |
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