EP1422530B1 - Inspection jig for radio frequency device, and contact probe incorporated in the jig - Google Patents
Inspection jig for radio frequency device, and contact probe incorporated in the jig Download PDFInfo
- Publication number
- EP1422530B1 EP1422530B1 EP03026538A EP03026538A EP1422530B1 EP 1422530 B1 EP1422530 B1 EP 1422530B1 EP 03026538 A EP03026538 A EP 03026538A EP 03026538 A EP03026538 A EP 03026538A EP 1422530 B1 EP1422530 B1 EP 1422530B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact probe
- jig
- metal
- contact
- metal pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 90
- 238000007689 inspection Methods 0.000 title description 22
- 229910052751 metal Inorganic materials 0.000 claims description 92
- 239000002184 metal Substances 0.000 claims description 92
- 239000004020 conductor Substances 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000011295 pitch Substances 0.000 description 8
- 230000003247 decreasing effect Effects 0.000 description 5
- 230000000994 depressogenic effect Effects 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Definitions
- the present invention is related to an inspection jig and a contact probe incorporated in the jig, which firmly connect an inspection apparatus to an inspected device in a case where an electric characteristic of this device is inspected before the device is assembled on a circuit board.
- the inspected device corresponds to either a module or an IC (integrated circuit) of a high frequency/high-speed circuit such as, for instance, an amplifier circuit, a mixer circuit, and a filter circuit, which are assembled in a cellular phone.
- US 4,730,159 discloses programmable bed-of-nails test access jigs based on a pin actuating mechanism to fit into the space available by proposing the use of miniature clutch, or valve, mechanisms involving the utilization of an electro rheological fluid.
- the above-described high frequency circuit is defined as such an analog circuit operable in a high frequency range
- the above-described high-speed circuit is defined as such a digital circuit in which a pulse width and a pulse interval of a digital signal are very short
- both the analog high frequency circuit and the digital high-speed circuit will also be referred to as an RF (radio frequency) circuit or device.
- the RF signal involves either a sine wave signal, or a pulse signal, the repetition period of which is higher than, or equal to 1 GHz.
- an RF circuit corresponding to the inspected device is arranged as a module 20 in which an amplifier circuit, a mixer circuit, or the like are assembled within a housing made of a metal material in order to avoid external.
- the module 20 is constituted by employing input/output terminals 21/24 for inputting/outputting RF signals, a power supply terminal 22, a ground (earth) terminal 23, or the like on a surface of this metal housing. Then, such an inspection method is employed so as to inspect the RF circuit in such a manner that these terminals 21, 22, 23, 24 are electrically connected to respective terminals of a wiring board 36 on which wiring lines for inspection have been formed.
- a contact probe in which a plunger and a spring are inserted into a metal pipe such that a tip end of the plunger is retractably projected from the pipe by the urging force of the spring.
- a contact probe 33 for RF signal, a contact probe 34 for power supply, and a contact probe 35 for ground are stored within a metal block 31 capable of preventing an adverse influence caused by noise.
- These contact probes 33, 34, 35 are electrically made in contact with the respective terminals 22/23 and input/output terminals 21/24.
- This contact probe 33 for RF signal is made of a short-length probe so as to decrease an inductance component. Even when this contact probe 33 for RF signal employs such a short probe, the inductance component of this short contact probe 33 cannot be neglected in the RF range. For example, as to a contact probe for RF signal having an inductance value of 1 nH, an impedance of this 1 nH - contact probe becomes 63 Ohms ( ⁇ ) in the frequency range of 10 GHz.
- a coaxial line structure is formed in such a way that the contact probe 33 for RF signal is set as a core conductor and the metal block 31 is set as an external conductor.
- this coaxial line structure may prevent the increase of the impedance, and/or may avoid the penetration of the noise.
- reference numeral 37 shows a coaxial cable
- reference numeral 38 represents a plate for fixing the metal pipe provided as an outer periphery of the contact probe 33.
- an outer diameter of a contact probe for RF signal which involves a dielectric layer, must be made narrow.
- this outer diameter must be matched with such a characteristic impedance (for example, 50 ⁇ ) which satisfies a relationship (1) between a diameter "d" of a core conductor of a coaxial line path and an inner diameter "D" of an outer conductor thereof, assuming now that a dielectric constant of a dielectric substance between the core conductor and the external conductor is defined as " ⁇ r ".
- a jig for inspecting a device provided with at least a radio frequency signal terminal and an earth terminal comprising:
- a dimension in the first direction of each of the dielectric ring members is sufficiently smaller than a length of the metal pipe in the first direction.
- the dielectric constant " ⁇ r " of the dielectric member defined in the above-explained formula (1) may be regarded as substantially 1.
- the inner diameter "D" of the outer conductor may be set to be approximately 0.35 mm ⁇ , which may be properly adapted to the terminal interval of 0.4 mm.
- the dielectric ring members are comprised of a resin material and integrally molded with the metal pipe.
- the dielectric ring members will not be moved when the contact probe is fitted into the through hole. Therefore, the assembling operation can be facilitated and performed safely.
- the dielectric members are integrally molded on recessed portions formed on the outer periphery of the metal pipe.
- the jig further comprises a conductive rubber sheet, in which metal filaments are arranged so as to extend in the first direction, and on which the earth terminal of the device to be inspected is brought into contact, so that the earth terminal and the metal block are electrically connected via the metal filaments.
- connection between the earth terminal of the inspected device and the metal block can be firmly established over a wide area. Furthermore, since the metal filament connected to the metal block is located between the metal block and the inspected device, there is substantially no electric gap. Therefore, no signal is leaked between the RF input/output terminals, and the isolation characteristic in the inspection can be improved.
- a contact probe inserted into a through hole formed in a metal block of a jig for inspecting a device provided with at least a radio frequency signal terminal and an earth terminal, the contact probe comprising:
- a contact probe 3 for RF signal is provided in a metal block 1 in such a manner that a tip portion of a retractable plunger 11 is projected from the side of one face of the metal block 1.
- An inspected device 20 on which an RF circuit has been formed is depressed toward the metal block 1, so that RF signal terminals 21 and 24 of this inspected device 20 are made in contact with the contact probe 3.
- the electric inspection of the device 20 is carried out by an inspecting circuit which is connected to the other end of the contact probe 3 via a coaxial cable 7.
- dielectric rings 15 are fixed on at least two places of an outer periphery of the contact probe 3, and are fitted into a through hole of the metal block 1, so that a hollow portion 15a is formed between the contact probe 3 and the metal block 1.
- An outer diameter of the dielectric ring 15 is set so as to establish a desired characteristic impedance of a coaxial ling path in which the contact probe 3 serves as a core conductor and the metal block 1 serves as an external conductor.
- Fig. 3 shows a structure of a general-purpose contact probe 10 (3, 4) with which the dielectric ring 15 is not equipped.
- a spring 14, and one ends of plungers 11, 12 are stored in a metal pipe 13 formed with narrowed portions 13a which cause the plungers 11 and 13 not to be ejected from the metal pipe 13.
- the plungers 11, 12 are urged outward by the spring 14 such that the tip portions of the plungers 11, 12 projected from the metal pipe 13 are made retractable.
- the tip portion of the plunger 11 is projected from the metal pipe 13 by approximately 1 mm.
- the plungers 11, 12 are provided at both edges.
- the plunger may be provided at least one end of a contact probe 10 confronting the inspected device 20.
- the other end of the contact probe 10 may be fixed with another member by soldering.
- a length "L 1 " of the metal pipe 13 is selected to be approximately 3.5 mm.
- An outer diameter “d" of the metal pipe 13 is selected to be approximately 0.15 mm.
- the metal pipe 13 is made of nickel silver (copper/nickel/zinc alloy).
- the plungers 11, 12 are made of either an SK material (carbon steel) or beryllium copper. Thicknesses of the plungers 11, 12 are selected to be approximately 0.1 mm. Projected lengths "L 2 " of the plunger 11 from the end of the metal pipe 13 are made by approximately 1 mm.
- the spring 14 is formed by a piano wire, or the like.
- molding resin is integrally formed on the outer periphery of the contact probe 10, so that the dielectric ring 15 is formed.
- This dielectric ring 15 has an outer diameter "d 2 " is selected to be 0.34 mm ⁇ and a length "L 3 " thereof is selected to be approximately 0.4 mm, in a case where an inner diameter "D" of a through hole formed in the metal block 1 is selected to be 0.33 mm ⁇ .
- the dielectric ring 15 is fitted the through hole to be fixed therein.
- the outer diameter of this dielectric ring 15 is determined so as to have a dimension larger than the inner diameter "D" by 0.1 to 0.2 mm.
- the inner diameter "D" of the metal block 1 is determined by the outer diameter "d" of the contact probe 3 and the dielectric constant of the dielectric ring 15 corresponding to a dimension ratio relative to the hollow portion 15a, based upon the above-explained formula (1).
- the dielectric constant of the dielectric ring 15 can be substantially regarded as 1, in a case where the length "L 3 " of the dielectric ring 15 is sufficiently smaller than the length "L 1 " of the metal pipe 13.
- each dielectric ring 15 in the length direction thereof is made sharp as shown in Figs. 1A and 1B.
- the outer diameter of the dielectric ring 15 may be made equal entirely in the length direction.
- the number of the dielectric rings 15 may be increased if the length of the dielectric ring 15 is long. However, it is preferable to suppress the number of these dielectric rings 15 in view of such a technical aspect that the dielectric constants of the dielectric substances may be decreased.
- the resin material such a resin as polypropylene (PP) whose dielectric constant is small may be employed.
- this dielectric ring 15 is integrally molded on the narrowed portion (concave portion) 13a of the contact probe 10, this dielectric ring 15 is not moved when the dielectric ring 15 is fitted into the through hole of the metal block 1.
- the contact probe 10 having the structure shown in Fig. 3 is firstly formed.
- the contact probe 10 is set into a mold where the concave portion confronting the narrowed portion 13a has been formed, and molten resin is then poured into the mold. After this molten resin is cooled to solidify, this assembly is taken out from the mold.
- the contact probe 3 provided with the dielectric rings 15 may be mass-produced in the simple manner.
- the other end of the contact probe 3 is connected to a coaxial cable 7 such as a semi-rigid cable.
- a coaxial cable 7 such as a semi-rigid cable.
- this coaxial cable 7 is connected to an SMA (Sub Miniature Type-A) connector 18 which is provided in a wiring box 17 made of a metal plate, for example, aluminum.
- a not-shown tester may be connected to the SMA connector 18 via a coaxial cable.
- the contact probe 4 for power supply terminal need not be formed in a coaxial structure, but may be held via an insulating member 16 in such a manner that this contact probe 4 may be electrically insulated with respect to the metal block 1. If a dielectric substance having a desirable thickness and a large dielectric constant is formed so as to establish a desirable capacitance between this contact probe 4 and the metal block 1, high frequency noise which is superimposed on the power supply line can be eliminated. As shown in Fig.
- the respective contact probes 3 and 4 are designed not to be vertically moved in such a manner that the lower ends thereof are fixed by the wiring board 6, and the upper ends thereof are fixed by way of through holes of a GND board 8 (will be explained later), and also such a portion that a GND electrode is not formed (will be discussed later).
- an earth (ground) terminal 23 of the inspected device 20 is connected to the metal block 1 via both the GND board 8 and an conductive rubber sheet 5. Since such a structure is employed, a contact area between the earth terminal 23 and the metal block 1 can be made several tens larger than that achieved by employing the above-described contact probe for earth shown in Fig. 4. However, the earth terminal 23 may be connected by way of the related-art contact probe.
- the GND board 8 which fixes the upper ends of both the contact probes 3 and 4 is provided on the metal block 1, so that only the plunger 11 is projected upwardly from the GND board 8 by the spring 14.
- a thickness "t 2 " of this GND board 8 is selected to be approximately 0.25 mm, so that this plunger 11 is projected by approximately 0.45 mm above the conductive rubber sheet 5 which is provided on this GND board 8 (will be discussed later) in a case where the plunger 11 is not depressed by the inspected device 20.
- the GND board 8 is made of for example, a glass epoxy board formed with through holes having dimensions of approximately 0.3 mm ⁇ in a matrix manner at an interval of approximately 1 mm. Vias 81 are formed in these through holes by way of a plating manner so as to electrically connect an upper face and a lower face of the GND board 8 therethrough.
- a metal film is formed on almost entire of the upper and lower faces of the GND board 8 so as to avoid the terminals 21, 22 and 24. Thereby the metal film serves as a GND electrode for electrically connecting the metal block 1 and metal filaments formed in the conductive rubber sheet 5 (will be described later).
- the metal film and the vias 81 are plated with gold.
- the GND board 8 is formed with through holes 82 each having a smaller diameter than the outer diameter of the metal pipe.
- the through holes 82 are formed at positions confronting the contact probes 3, 4 such that the plungers 11 are allowed to pass through.
- the upper end of the metal pipe 13 is fixed by a vicinity of the through hole 82 of this GND board 8. Therefore, in order to avoid the short-circuit between the metal pipe 13 and the metal block 1, the above described GND electrode and the vias 81 are not formed in the vicinity of the through hole 82 (see Fig. 2C).
- the GND board 8 is fixed to the metal block 1 by employing a screw (not shown).
- the relevant contact probe may be easily replaced by a new contact probe, or the foreign matter may be removed so as to repair the inspection jig.
- this GND board 8 may be eliminated so long as the contact probes 3 and 4 can be fixed.
- the conductive rubber sheet 5 comprises: an insulating material 51 such as elastic rubber; and a large number of metal filaments 52 such as gold filaments or copper filaments plated with gold which are embedded in the insulating material 51.
- a thickness "t 1 " of the insulating material 51 is approximately 0.3 mm, and the metal filaments 52 are arranged with a pitch of approximately 30 to 50 ⁇ m in a matrix manner. Accordingly, upper and lower faces of the rubber sheet 5 is electrically connected via the metal filaments 52, but insulation is established in the lateral direction of the rubber sheet 5 by the insulating material 51 existing between the metal filaments 52.
- the thickness of the conductive rubber sheet 5 may be selected as approximately 0.2 to 1 mm in view of the purpose.
- the conductive rubber sheet 5 is formed with through holes 53 at portions to be confronted with the contact probes 3, 4 while avoiding the plungers 11 and the terminals 21, 22 and 24 of the inspected device 20.
- the through holes 53 may not necessarily avoid the terminals 21, 22 and 24 so long as the movement of the plungers 11 are not disturbed.
- the dimension of the earth terminal 23 of the inspected device 20 shown in Fig. 1A is selected to be approximately 0.3 mm square, and that the metal filaments 52 of the conductive rubber sheet 5 are arranged at an interval of approximately 50 ⁇ m, a total number of the metal filaments 52 which are present within the area of the earth terminal 23 becomes 36 filaments. According to the elasticity, all the filaments 52 confronting the earth terminal 23 can be brought into contact with the earth terminal 23, upon the depression of the inspected device 20 toward the inspection jig. Therefore, it is possible to secure a considerably larger contact area than the configuration shown in Fig. 4 in which only a tip end of the contact probe 35 is brought into point contact with the earth terminal 23.
- metal filaments 52 are electrically connected with the metal block 1 at portions between the terminals 21, 22 and 24, leakages of RF signals can be prevented, and isolation established between the input side and the output side can be improved.
- At least a portion of the outer peripheries of the contact probes 3, 4 may be held by the metal block 1 formed from a metal plate via an insulating material, so that a coaxial line path may be readily formed and/or a capacitor capable of short-circuiting high frequency noise may be easily formed.
- the wiring board 6 is used to apply electric power to the inspected device 20. While wiring lines are formed on a board, terminals of these wiring lines are formed at places corresponding to the terminals of the inspected device 20 in a proper manner. In this case, when the inspected device 20 corresponds to an amplifier, a chip capacitor, or the like are connected between the power supply terminal and the earth terminal on the wiring board 6. Otherwise, a dielectric material having a large dielectric constant is inserted around the contact probe 4 for power supply terminal in order to form a capacitor, so that noise can be eliminated.
- This wiring board 6 is fixed on the metal block 1 by using, for example, a screw 9 as shown in Fig. 1A.
- the coaxial cable 7 is directly connected to the other end of the contact probe 3.
- the contact probe 3 may be directly connected to the wiring board 6, and the coaxial cable 7 may be connected to the wiring board 6.
- a board member for supporting the contact probe 3 In a case where an inspected device is constituted only by a passive circuit which requires no electric power, no longer such a power supply electric terminal is required, and thus, such a wiring board 6 is not required. However, it is preferable that a board member for supporting the contact probe 3.
- the dielectric ring 15 is held in the metal block 1 via the dielectric ring 15, and the hollow portion 15a formed between the contact probe 3 and the metal block 1 serves as the dielectric member of the coaxial line path thus constructed. Since the dielectric constant of this dielectric member can be decreased, the inner diameter "D" of the external conductor (metal block 1) can be reduced to approximately 0.35 mm ⁇ , while the contact probe 3 having the thickness "d" nearly equal to the conventional thickness of 0.15 mm ⁇ is used as the core conductor.
Description
- The present invention is related to an inspection jig and a contact probe incorporated in the jig, which firmly connect an inspection apparatus to an inspected device in a case where an electric characteristic of this device is inspected before the device is assembled on a circuit board. The inspected device corresponds to either a module or an IC (integrated circuit) of a high frequency/high-speed circuit such as, for instance, an amplifier circuit, a mixer circuit, and a filter circuit, which are assembled in a cellular phone.
-
US 4,730,159 discloses programmable bed-of-nails test access jigs based on a pin actuating mechanism to fit into the space available by proposing the use of miniature clutch, or valve, mechanisms involving the utilization of an electro rheological fluid. - In this specification, the above-described high frequency circuit is defined as such an analog circuit operable in a high frequency range, and the above-described high-speed circuit is defined as such a digital circuit in which a pulse width and a pulse interval of a digital signal are very short, and further, both the analog high frequency circuit and the digital high-speed circuit will also be referred to as an RF (radio frequency) circuit or device. The RF signal involves either a sine wave signal, or a pulse signal, the repetition period of which is higher than, or equal to 1 GHz.
- In a case where electric characteristics of RF devices such as semiconductor wafers, ICs, and modules are inspected, in particular, if contact conditions of terminal portions are not sufficiently established, then impedances or the like are changed, so that measurement values are varied. Therefore, the electric characteristics of the RF devices are inspected by way of a jig shown in Fig. 4 as disclosed in
Japanese Patent Publication No. 2001-99889A - Specifically, an RF circuit corresponding to the inspected device is arranged as a
module 20 in which an amplifier circuit, a mixer circuit, or the like are assembled within a housing made of a metal material in order to avoid external. Themodule 20 is constituted by employing input/output terminals 21/24 for inputting/outputting RF signals, apower supply terminal 22, a ground (earth)terminal 23, or the like on a surface of this metal housing. Then, such an inspection method is employed so as to inspect the RF circuit in such a manner that theseterminals wiring board 36 on which wiring lines for inspection have been formed. - In the above inspection jig, it is employed a contact probe in which a plunger and a spring are inserted into a metal pipe such that a tip end of the plunger is retractably projected from the pipe by the urging force of the spring. A
contact probe 33 for RF signal, acontact probe 34 for power supply, and acontact probe 35 for ground are stored within ametal block 31 capable of preventing an adverse influence caused by noise. Thesecontact probes respective terminals 22/23 and input/output terminals 21/24. - This
contact probe 33 for RF signal is made of a short-length probe so as to decrease an inductance component. Even when thiscontact probe 33 for RF signal employs such a short probe, the inductance component of thisshort contact probe 33 cannot be neglected in the RF range. For example, as to a contact probe for RF signal having an inductance value of 1 nH, an impedance of this 1 nH - contact probe becomes 63 Ohms (Ω) in the frequency range of 10 GHz. To avoid such a problem, while a dielectric tube is inserted between thecontact probe 33 for RF signal and themetal block 31, a coaxial line structure is formed in such a way that thecontact probe 33 for RF signal is set as a core conductor and themetal block 31 is set as an external conductor. As a result, this coaxial line structure may prevent the increase of the impedance, and/or may avoid the penetration of the noise. In Fig. 4,reference numeral 37 shows a coaxial cable, andreference numeral 38 represents a plate for fixing the metal pipe provided as an outer periphery of thecontact probe 33. - In the inspection jig shown in Fig. 4, two sets (input and output purposes) of the
contact probes 33 for RF signals are illustrated, and one set of thecontact probe 34 for power supply and also one set ofcontact probe 35 for ground are illustrated. However, in actual inspection jigs, large members of these contact probes are formed. Moreover, in the specific case, there are some cases that approximately 400 pieces per 1 cm2 of terminals are provided in conjunction with recent higher integrations such as ICs. Therefore, such narrower pitches (about 0.4 mm) of the respective terminals appear in the field. - When terminal pitches become such narrower pitches, an outer diameter of a contact probe for RF signal, which involves a dielectric layer, must be made narrow. However, this outer diameter must be matched with such a characteristic impedance (for example, 50 Ω) which satisfies a relationship (1) between a diameter "d" of a core conductor of a coaxial line path and an inner diameter "D" of an outer conductor thereof, assuming now that a dielectric constant of a dielectric substance between the core conductor and the external conductor is defined as "εr".
- As a consequence, in order to simply make an outer diameter narrower, a diameter of a core conductor is required to be made smaller, and an outer diameter of a contact probe must be made narrower, for example, about 0.09 mm (in this case, inner diameter "D" becomes 0.3 mm). In order to narrow a contact probe having a complex structure, there are such problems that very high cost is required, durability of the contact probe is lowered, and reliability of this contact probe is decreased.
- It is therefore an object of the invention to provide an inspection jig for an RF device, capable of performing a highly reliable inspection without being adversely influenced by noise, while employing a contact probe having a coaxial structure and manufactured in lower cost, even in such a case that a recent RF device having a very narrow pitch (interval) of terminals.
- In order to achieve the above object, according to the invention, there is provided a jig for inspecting a device provided with at least a radio frequency signal terminal and an earth terminal, the jig comprising:
- a metal block, formed with a through hole extending in a first direction; and
- a contact probe, inserted into the through hole, the contact probe comprising:
- a metal pipe, extending in the first direction;
- a plunger, retractably projected from one longitudinal end of the metal pipe to be brought into contact with the radio frequency signal terminal; and
- at least two dielectric ring members, provided on an outer periphery of the metal pipe, and fitted with the through hole while forming a gap between the outer periphery of the metal pipe and an inner wall of the through hole, in order to form a coaxial path in which the contact probe serves as a core conductor and the metal block serves as an external conductor,
- Preferably, a dimension in the first direction of each of the dielectric ring members is sufficiently smaller than a length of the metal pipe in the first direction.
- In the above configuration, since a major portion of the contact probe along the first direction becomes an air layer between this contact probe and the metal block, the dielectric constant "εr" of the dielectric member defined in the above-explained formula (1) may be regarded as substantially 1. As a result, even when the diameter "d" of the core conductor is not decreased, since this dielectric constant "εr" becomes small, the inner diameter "D" of the external conductor can be reduced. Therefore, the invention can be properly adapted to such a need for narrowing pitches between the terminals of the inspected devices. For instance, even when the related-art contact probe having the outer diameter "d" = 0.15 mmφ is employed, the inner diameter "D" of the outer conductor may be set to be approximately 0.35 mmφ, which may be properly adapted to the terminal interval of 0.4 mm.
- Preferably, the dielectric ring members are comprised of a resin material and integrally molded with the metal pipe. In this case, the dielectric ring members will not be moved when the contact probe is fitted into the through hole. Therefore, the assembling operation can be facilitated and performed safely. It is more preferable that the dielectric members are integrally molded on recessed portions formed on the outer periphery of the metal pipe.
- Preferably, the jig further comprises a conductive rubber sheet, in which metal filaments are arranged so as to extend in the first direction, and on which the earth terminal of the device to be inspected is brought into contact, so that the earth terminal and the metal block are electrically connected via the metal filaments.
- In such a configuration, the connection between the earth terminal of the inspected device and the metal block can be firmly established over a wide area. Furthermore, since the metal filament connected to the metal block is located between the metal block and the inspected device, there is substantially no electric gap. Therefore, no signal is leaked between the RF input/output terminals, and the isolation characteristic in the inspection can be improved.
- According to the invention, there is also provided a contact probe, inserted into a through hole formed in a metal block of a jig for inspecting a device provided with at least a radio frequency signal terminal and an earth terminal, the contact probe comprising:
- a metal pipe;
- a plunger, retractably projected from one longitudinal end of the metal pipe to be brought into contact with the radio frequency signal terminal; and
- at least two dielectric ring members, provided on an outer periphery of the metal pipe, and fitted with the through hole while forming a gap between the outer periphery of the metal pipe and an inner wall of the through hole, in order to form a coaxial path in which the contact probe serves as a core conductor and the metal block serves as an external conductor,
- The above objects and advantages of the present invention will become more apparent by describing in detail preferred exemplary embodiments thereof with reference to the accompanying drawings, wherein:
- Fig. 1A is a section view of an inspection jig according to one embodiment of the invention;
- Fig. 1B is an explanatory view of a contact probe incorporated in the inspection jig;
- Fig. 2A is a perspective view showing a disassembled state of the inspection jig;
- Fig 2B is an enlarged perspective view showing a disassembled state of a GND board and a conductive rubber sheet in the inspection jig;
- Fig. 2C is an enlarged perspective view of the GND board;
- Fig. 3 is a section view of the contact probe, showing a state that dielectric rings are not provided; and
- Fig. 4 is an explanatory view of a related-art inspection jig.
- Preferred embodiments of the invention will be described below in detail with reference to the accompanying drawings.
- As shown in Fig. 1, in an inspection jig for an RF device according to one embodiment of the invention, a
contact probe 3 for RF signal is provided in ametal block 1 in such a manner that a tip portion of aretractable plunger 11 is projected from the side of one face of themetal block 1. An inspecteddevice 20 on which an RF circuit has been formed is depressed toward themetal block 1, so thatRF signal terminals device 20 are made in contact with thecontact probe 3. The electric inspection of thedevice 20 is carried out by an inspecting circuit which is connected to the other end of thecontact probe 3 via acoaxial cable 7. - In this embodiment, dielectric rings 15 are fixed on at least two places of an outer periphery of the
contact probe 3, and are fitted into a through hole of themetal block 1, so that ahollow portion 15a is formed between thecontact probe 3 and themetal block 1. An outer diameter of thedielectric ring 15 is set so as to establish a desired characteristic impedance of a coaxial ling path in which thecontact probe 3 serves as a core conductor and themetal block 1 serves as an external conductor. - Fig. 3 shows a structure of a general-purpose contact probe 10 (3, 4) with which the
dielectric ring 15 is not equipped. - In the contact probe 10 (3, 4), a
spring 14, and one ends ofplungers metal pipe 13 formed with narrowedportions 13a which cause theplungers metal pipe 13. Theplungers spring 14 such that the tip portions of theplungers metal pipe 13 are made retractable. In a case where no force is applied to theplungers plunger 11 is projected from themetal pipe 13 by approximately 1 mm. - In this embodiment, the
plungers device 20. For example, the other end of the contact probe 10 may be fixed with another member by soldering. - The detailed configuration of the contact probe 10 will be described with reference to Fig. 1B. A length "L1" of the
metal pipe 13 is selected to be approximately 3.5 mm. An outer diameter "d" of themetal pipe 13 is selected to be approximately 0.15 mm. Themetal pipe 13 is made of nickel silver (copper/nickel/zinc alloy). Theplungers plungers plunger 11 from the end of themetal pipe 13 are made by approximately 1 mm. Thespring 14 is formed by a piano wire, or the like. - With respect to the
contact probe 3 for RF signal, molding resin is integrally formed on the outer periphery of the contact probe 10, so that thedielectric ring 15 is formed. Thisdielectric ring 15 has an outer diameter "d2" is selected to be 0.34 mmφ and a length "L3" thereof is selected to be approximately 0.4 mm, in a case where an inner diameter "D" of a through hole formed in themetal block 1 is selected to be 0.33 mmφ. Thedielectric ring 15 is fitted the through hole to be fixed therein. - The outer diameter of this
dielectric ring 15 is determined so as to have a dimension larger than the inner diameter "D" by 0.1 to 0.2 mm. The inner diameter "D" of themetal block 1 is determined by the outer diameter "d" of thecontact probe 3 and the dielectric constant of thedielectric ring 15 corresponding to a dimension ratio relative to thehollow portion 15a, based upon the above-explained formula (1). Here, the dielectric constant of thedielectric ring 15 can be substantially regarded as 1, in a case where the length "L3" of thedielectric ring 15 is sufficiently smaller than the length "L1" of themetal pipe 13. - In order to facilitate the insertion of the
dielectric ring 15 into the through hole of themetal block 1, it is preferable that a center portion of eachdielectric ring 15 in the length direction thereof is made sharp as shown in Figs. 1A and 1B. However, the outer diameter of thedielectric ring 15 may be made equal entirely in the length direction. - Although it is sufficient to provide one piece of the
dielectric ring 15 on each of both end portions of thecontact probe 3, the number of the dielectric rings 15 may be increased if the length of thedielectric ring 15 is long. However, it is preferable to suppress the number of thesedielectric rings 15 in view of such a technical aspect that the dielectric constants of the dielectric substances may be decreased. As to the resin material, such a resin as polypropylene (PP) whose dielectric constant is small may be employed. - Furthermore, as indicated in Fig. 1B, since this
dielectric ring 15 is integrally molded on the narrowed portion (concave portion) 13a of the contact probe 10, thisdielectric ring 15 is not moved when thedielectric ring 15 is fitted into the through hole of themetal block 1. - To obtain the
contact probe 3 as described the above, the contact probe 10 having the structure shown in Fig. 3 is firstly formed. Next, the contact probe 10 is set into a mold where the concave portion confronting the narrowedportion 13a has been formed, and molten resin is then poured into the mold. After this molten resin is cooled to solidify, this assembly is taken out from the mold. Thecontact probe 3 provided with the dielectric rings 15 may be mass-produced in the simple manner. - The other end of the
contact probe 3 is connected to acoaxial cable 7 such as a semi-rigid cable. As shown in Fig. 2A, thiscoaxial cable 7 is connected to an SMA (Sub Miniature Type-A)connector 18 which is provided in awiring box 17 made of a metal plate, for example, aluminum. A not-shown tester may be connected to theSMA connector 18 via a coaxial cable. - The contact probe 4 for power supply terminal need not be formed in a coaxial structure, but may be held via an insulating
member 16 in such a manner that this contact probe 4 may be electrically insulated with respect to themetal block 1. If a dielectric substance having a desirable thickness and a large dielectric constant is formed so as to establish a desirable capacitance between this contact probe 4 and themetal block 1, high frequency noise which is superimposed on the power supply line can be eliminated. As shown in Fig. 1A, therespective contact probes 3 and 4 are designed not to be vertically moved in such a manner that the lower ends thereof are fixed by thewiring board 6, and the upper ends thereof are fixed by way of through holes of a GND board 8 (will be explained later), and also such a portion that a GND electrode is not formed (will be discussed later). - As shown in Fig. 1A, an earth (ground)
terminal 23 of the inspecteddevice 20 is connected to themetal block 1 via both theGND board 8 and anconductive rubber sheet 5. Since such a structure is employed, a contact area between theearth terminal 23 and themetal block 1 can be made several tens larger than that achieved by employing the above-described contact probe for earth shown in Fig. 4. However, theearth terminal 23 may be connected by way of the related-art contact probe. - The
GND board 8 which fixes the upper ends of both the contact probes 3 and 4 is provided on themetal block 1, so that only theplunger 11 is projected upwardly from theGND board 8 by thespring 14. A thickness "t2" of thisGND board 8 is selected to be approximately 0.25 mm, so that thisplunger 11 is projected by approximately 0.45 mm above theconductive rubber sheet 5 which is provided on this GND board 8 (will be discussed later) in a case where theplunger 11 is not depressed by the inspecteddevice 20. - As shown in Fig. 2C, the
GND board 8 is made of for example, a glass epoxy board formed with through holes having dimensions of approximately 0.3 mmϕ in a matrix manner at an interval of approximately 1 mm.Vias 81 are formed in these through holes by way of a plating manner so as to electrically connect an upper face and a lower face of theGND board 8 therethrough. A metal film is formed on almost entire of the upper and lower faces of theGND board 8 so as to avoid theterminals metal block 1 and metal filaments formed in the conductive rubber sheet 5 (will be described later). To establish excellent electrical connection, it is preferable that the metal film and thevias 81 are plated with gold. - As shown in Figs. 1A and 2C, the
GND board 8 is formed with throughholes 82 each having a smaller diameter than the outer diameter of the metal pipe. The through holes 82 are formed at positions confronting the contact probes 3, 4 such that theplungers 11 are allowed to pass through. The upper end of themetal pipe 13 is fixed by a vicinity of the throughhole 82 of thisGND board 8. Therefore, in order to avoid the short-circuit between themetal pipe 13 and themetal block 1, the above described GND electrode and thevias 81 are not formed in the vicinity of the through hole 82 (see Fig. 2C). TheGND board 8 is fixed to themetal block 1 by employing a screw (not shown). - Even when an abnormal condition happens to occur in any one of the contact probes 3 and 4, and/or even in such a case that a foreign matter is entered into a space between these
contact probes 3 and 4, by merely removing theGND board 8, the relevant contact probe may be easily replaced by a new contact probe, or the foreign matter may be removed so as to repair the inspection jig. However, thisGND board 8 may be eliminated so long as the contact probes 3 and 4 can be fixed. - As shown in Fig. 1A, the
conductive rubber sheet 5 comprises: an insulatingmaterial 51 such as elastic rubber; and a large number ofmetal filaments 52 such as gold filaments or copper filaments plated with gold which are embedded in the insulatingmaterial 51. Specifically, a thickness "t1" of the insulatingmaterial 51 is approximately 0.3 mm, and themetal filaments 52 are arranged with a pitch of approximately 30 to 50 µm in a matrix manner. Accordingly, upper and lower faces of therubber sheet 5 is electrically connected via themetal filaments 52, but insulation is established in the lateral direction of therubber sheet 5 by the insulatingmaterial 51 existing between themetal filaments 52. The thickness of theconductive rubber sheet 5 may be selected as approximately 0.2 to 1 mm in view of the purpose. - The
conductive rubber sheet 5 is formed with throughholes 53 at portions to be confronted with the contact probes 3, 4 while avoiding theplungers 11 and theterminals device 20. However, the throughholes 53 may not necessarily avoid theterminals plungers 11 are not disturbed. As described the above, since the insulation in the lateral direction of therubber sheet 5 is established, the short-circuit between theterminals GND board 8 is surely established. - Assuming now that the dimension of the
earth terminal 23 of the inspecteddevice 20 shown in Fig. 1A is selected to be approximately 0.3 mm square, and that themetal filaments 52 of theconductive rubber sheet 5 are arranged at an interval of approximately 50 µm, a total number of themetal filaments 52 which are present within the area of theearth terminal 23 becomes 36 filaments. According to the elasticity, all thefilaments 52 confronting theearth terminal 23 can be brought into contact with theearth terminal 23, upon the depression of the inspecteddevice 20 toward the inspection jig. Therefore, it is possible to secure a considerably larger contact area than the configuration shown in Fig. 4 in which only a tip end of thecontact probe 35 is brought into point contact with theearth terminal 23. - Further, since the
metal filaments 52 are electrically connected with themetal block 1 at portions between theterminals - At least a portion of the outer peripheries of the contact probes 3, 4 may be held by the
metal block 1 formed from a metal plate via an insulating material, so that a coaxial line path may be readily formed and/or a capacitor capable of short-circuiting high frequency noise may be easily formed. - The
wiring board 6 is used to apply electric power to the inspecteddevice 20. While wiring lines are formed on a board, terminals of these wiring lines are formed at places corresponding to the terminals of the inspecteddevice 20 in a proper manner. In this case, when the inspecteddevice 20 corresponds to an amplifier, a chip capacitor, or the like are connected between the power supply terminal and the earth terminal on thewiring board 6. Otherwise, a dielectric material having a large dielectric constant is inserted around the contact probe 4 for power supply terminal in order to form a capacitor, so that noise can be eliminated. Thiswiring board 6 is fixed on themetal block 1 by using, for example, ascrew 9 as shown in Fig. 1A. - In this embodiment, the
coaxial cable 7 is directly connected to the other end of thecontact probe 3. However, thecontact probe 3 may be directly connected to thewiring board 6, and thecoaxial cable 7 may be connected to thewiring board 6. - In a case where an inspected device is constituted only by a passive circuit which requires no electric power, no longer such a power supply electric terminal is required, and thus, such a
wiring board 6 is not required. However, it is preferable that a board member for supporting thecontact probe 3. - An inspection is carried out while the inspected
device 20 is depressed on the jig in which thewiring board 6, themetal block 1, theGND board 8, and theconductive rubber sheet 5 are assembled as shown in Fig. 2A. Since the inspecteddevice 20 is depressed via awork guide 19 made of acrylic resin by employing a depressing mechanism (not shown), thisdevice 20 may be surely depressed while the positions of the contact pins 3 and 4 are precisely located to the positions of the respective terminals of the inspecteddevice 20. Thus, both the terminal for RF signal may be firmly made in contact with the power supply terminal via the contact probe, and the earth terminal may be connected via theconductive rubber sheet 5 with a wide contact area. - In accordance with the inspection jig of the present invention, the
dielectric ring 15 is held in themetal block 1 via thedielectric ring 15, and thehollow portion 15a formed between thecontact probe 3 and themetal block 1 serves as the dielectric member of the coaxial line path thus constructed. Since the dielectric constant of this dielectric member can be decreased, the inner diameter "D" of the external conductor (metal block 1) can be reduced to approximately 0.35 mmφ, while thecontact probe 3 having the thickness "d" nearly equal to the conventional thickness of 0.15 mmϕ is used as the core conductor. Therefore, even when such a currently-available inspected device is inspected in which a pitch between terminals is made very narrow, e.g., approximately 0.4 mm, and even when the contact probe for RF signal having the coaxial structure is employed, this device can be precisely inspected without extremely narrowing the contact probe.
Claims (5)
- A contact probe, inserted into a through hole formed in a metal block (1) of a jig for inspecting a device (20) provided with at least a radio frequency signal terminal (21, 22, 24) and an earth terminal (23), the contact probe comprising:a metal pipe (13);characterized by
a plunger (11), retractably projected from one longitudinal end of the metal pipe (13) to be brought into contact with the radio frequency signal terminal (21, 22, 24); and
at least two dielectric ring members (15), provided on an outer periphery of the metal pipe (13), and fitted with the through hole while forming a gap between the outer periphery of the metal pipe (13) and an inner wall of the through hole, in order to form a coaxial path in which the contact probe serves as a core conductor and the metal block (1) serves as an external conductor,
wherein a diameter of the dielectric ring members (15) is selected such that the coaxial path has a predetermined impedance relative to the radio signal frequency terminal (21, 22, 24), based on a diameter (D) of the through hole. - A jig for inspecting a device (20) provided with at least a radio frequency signal terminal (21, 22, 24) and an earth terminal (23), the jig comprising:a metal block (1), formed with a through hole extending in a first direction; anda contact probe according to claim 1.
- The jig as set forth in claim 2, wherein a dimension in the first direction of each of the dielectric ring members (15) is sufficiently smaller than a length of the metal pipe (13) in the first direction.
- The jig as set forth in claim 2, wherein the dielectric ring members (15) are comprised of a resin material and integrally molded with the metal pipe (13).
- The jig as set forth in claim 2, further comprising a conductive rubber sheet (5), in which metal filaments (52) are arranged so as to extend in the first direction, and on which the earth terminal (23) of the device (20) to be inspected is brought into contact, so that the earth terminal (23) and the metal block (1) are electrically connected via the metal filaments (52).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002334985 | 2002-11-19 | ||
JP2002334985A JP4251855B2 (en) | 2002-11-19 | 2002-11-19 | Manufacturing method of inspection jigs for high frequency and high speed devices |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1422530A2 EP1422530A2 (en) | 2004-05-26 |
EP1422530A3 EP1422530A3 (en) | 2005-01-19 |
EP1422530B1 true EP1422530B1 (en) | 2007-07-11 |
Family
ID=32212057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03026538A Expired - Fee Related EP1422530B1 (en) | 2002-11-19 | 2003-11-18 | Inspection jig for radio frequency device, and contact probe incorporated in the jig |
Country Status (9)
Country | Link |
---|---|
US (1) | US6844748B2 (en) |
EP (1) | EP1422530B1 (en) |
JP (1) | JP4251855B2 (en) |
KR (1) | KR100626629B1 (en) |
CN (1) | CN100401072C (en) |
DE (1) | DE60314824T2 (en) |
MY (1) | MY131824A (en) |
SG (1) | SG115588A1 (en) |
TW (1) | TWI269039B (en) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4707322B2 (en) * | 2002-02-07 | 2011-06-22 | 株式会社ヨコオ | Capacity loaded probe and inspection jig using the same |
US20050176285A1 (en) * | 2003-02-04 | 2005-08-11 | Microfabrica Inc. | Pin-type probes for contacting electronic circuits and methods for making such probes |
US10416192B2 (en) | 2003-02-04 | 2019-09-17 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components |
DE10344409A1 (en) * | 2003-09-25 | 2005-04-28 | Marconi Comm Gmbh | Method for manufacturing a high-frequency module |
JP4689196B2 (en) * | 2003-11-05 | 2011-05-25 | 日本発條株式会社 | Conductive contact holder, conductive contact unit |
JP2005172581A (en) * | 2003-12-10 | 2005-06-30 | Oki Electric Ind Co Ltd | Semi-conductor inspection device |
JP4535828B2 (en) | 2004-09-30 | 2010-09-01 | 株式会社ヨコオ | Inspection unit manufacturing method |
JP4438601B2 (en) * | 2004-10-28 | 2010-03-24 | 株式会社ヨコオ | Inspection unit manufacturing method |
KR100619327B1 (en) * | 2005-06-10 | 2006-09-06 | 삼성전기주식회사 | Jig for measuring microwave frequency characteristic of multi layers circuit |
KR100602373B1 (en) * | 2005-11-16 | 2006-07-19 | 스텝시스템주식회사 | The probe card having the interconnection between the probe and pcb by conductive pipes |
JP4448086B2 (en) * | 2005-12-12 | 2010-04-07 | 大西電子株式会社 | Inspection jig for printed wiring boards |
JP4825610B2 (en) | 2006-07-27 | 2011-11-30 | 株式会社ヨコオ | Inspection socket |
US7362118B2 (en) * | 2006-08-25 | 2008-04-22 | Interconnect Devices, Inc. | Probe with contact ring |
JP4845031B2 (en) * | 2006-11-10 | 2011-12-28 | 株式会社ヨコオ | Relay connector |
TWI328191B (en) * | 2007-01-24 | 2010-08-01 | Ind Tech Res Inst | Method and apparatus for inspecting radio frequency identification tag |
CN101350464B (en) * | 2007-07-20 | 2011-05-04 | 深圳富泰宏精密工业有限公司 | Conductive pole and electronic device containing the same |
JPWO2009098770A1 (en) * | 2008-02-07 | 2011-05-26 | 株式会社アドバンテスト | Product exchange unit and manufacturing method |
US20100073021A1 (en) * | 2008-09-23 | 2010-03-25 | Nichepac Technology Inc. | Electrical contact probe |
JP5386769B2 (en) * | 2008-09-29 | 2014-01-15 | 日本電産リード株式会社 | Inspection jig |
US8760186B2 (en) * | 2010-02-19 | 2014-06-24 | International Business Machines Corporation | Probe apparatus assembly and method |
JP5776687B2 (en) * | 2010-04-19 | 2015-09-09 | 日本電産リード株式会社 | Inspection contact and inspection jig |
WO2013051099A1 (en) * | 2011-10-04 | 2013-04-11 | 富士通株式会社 | Testing jig and semiconductor device test method |
TWI519227B (en) * | 2011-12-02 | 2016-01-21 | Tpk Touch Solutions Inc | Touch panel assembly structure and its guide module |
US9335343B1 (en) * | 2012-03-30 | 2016-05-10 | Altera Corporation | Contactor for reducing ESD in integrated circuit testing |
CN102608365A (en) * | 2012-04-14 | 2012-07-25 | 安拓锐高新测试技术(苏州)有限公司 | Elastic probe |
JP5966688B2 (en) * | 2012-07-04 | 2016-08-10 | 日本電産リード株式会社 | Wiring structure and board inspection device |
KR101479929B1 (en) * | 2013-08-30 | 2015-01-22 | 윌테크놀러지(주) | needle block for semiconductor test apparatus improving performance in high frequency |
US9678109B2 (en) * | 2014-01-09 | 2017-06-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Probe card |
JP6527042B2 (en) * | 2015-07-13 | 2019-06-05 | オルガン針株式会社 | Wire probe holding structure |
KR101882209B1 (en) | 2016-03-23 | 2018-07-27 | 리노공업주식회사 | Coaxial Test Socket Assembly |
JP6766582B2 (en) * | 2016-10-18 | 2020-10-14 | 三菱電機株式会社 | High frequency transmission device |
US10598697B2 (en) | 2017-01-12 | 2020-03-24 | Formfactor, Inc. | Shielding for vertical probe heads |
TWI652482B (en) * | 2017-04-25 | 2019-03-01 | 旺矽科技股份有限公司 | Probe module and probe card |
WO2019022204A1 (en) * | 2017-07-28 | 2019-01-31 | 日本発條株式会社 | Contact probe and probe unit |
CN109581003B (en) * | 2017-09-29 | 2021-01-15 | 中华精测科技股份有限公司 | Probe assembly and capacitive probe thereof |
CN109581005B (en) * | 2017-09-29 | 2021-01-22 | 中华精测科技股份有限公司 | Probe assembly and space conversion interface board thereof |
CN109752573A (en) * | 2017-11-03 | 2019-05-14 | 中华精测科技股份有限公司 | Probe assembly and its tenon joint type capacitance probe |
JP7039259B2 (en) * | 2017-11-16 | 2022-03-22 | 株式会社ヨコオ | Probe head |
KR102015788B1 (en) * | 2017-11-30 | 2019-08-29 | 리노공업주식회사 | Test device |
CN108132367B (en) * | 2017-12-14 | 2020-09-29 | 上海闻泰电子科技有限公司 | Radio frequency test equipment fixing device and radio frequency test system |
US11262383B1 (en) | 2018-09-26 | 2022-03-01 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
CN109061245B (en) * | 2018-10-12 | 2023-12-05 | 上海军友射频技术有限公司 | Radio frequency probe for testing impedance of PCB |
CN113167815B (en) * | 2018-11-27 | 2024-02-23 | 日本发条株式会社 | Probe unit |
US11782074B2 (en) | 2018-11-27 | 2023-10-10 | Nhk Spring Co., Ltd. | Probe unit |
KR102174427B1 (en) | 2019-04-22 | 2020-11-05 | 리노공업주식회사 | Test Device |
KR102184792B1 (en) * | 2019-08-01 | 2020-11-30 | 퀄맥스시험기술 주식회사 | Apparatus for inspecting electronic devices using busing |
WO2021093330A1 (en) * | 2019-11-12 | 2021-05-20 | 苏州华兴源创科技股份有限公司 | Probe module |
US11867721B1 (en) | 2019-12-31 | 2024-01-09 | Microfabrica Inc. | Probes with multiple springs, methods for making, and methods for using |
US11761982B1 (en) | 2019-12-31 | 2023-09-19 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact and methods for making such probes |
CN111722045A (en) * | 2020-06-30 | 2020-09-29 | 瑞声精密制造科技(常州)有限公司 | Test tool for dielectric waveguide filter |
US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
KR102599969B1 (en) * | 2020-09-29 | 2023-11-08 | 주식회사 티에스이 | Test socket |
JP7453891B2 (en) * | 2020-10-06 | 2024-03-21 | 日本航空電子工業株式会社 | Electrical component inspection equipment |
CN112230027A (en) * | 2020-12-18 | 2021-01-15 | 苏州和林微纳科技股份有限公司 | High-frequency coaxial signal probe test unit |
CN114217101B (en) * | 2021-10-30 | 2023-06-13 | 荣耀终端有限公司 | Radio frequency test probe structure and radio frequency test system |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1316108A (en) * | 1969-08-27 | 1973-05-09 | British Aircraft Corp Ltd | Apparatus for testing printed circuit boards |
US4004843A (en) * | 1975-09-25 | 1977-01-25 | Westinghouse Electric Corporation | Probe pin |
GB2161033B (en) * | 1984-06-21 | 1988-05-25 | Gen Electric Co Plc | Programmable bed-of-nails test access jigs with electro-rheological fluid actuation |
US4935696A (en) * | 1987-04-16 | 1990-06-19 | Teradyne, Inc. | Test pin assembly for circuit board tester |
JPH06216205A (en) * | 1993-01-13 | 1994-08-05 | Tokyo Electron Yamanashi Kk | Probe card interface device |
JPH085660A (en) * | 1994-06-16 | 1996-01-12 | Seiken:Kk | Inspection probe |
US6037787A (en) * | 1998-03-24 | 2000-03-14 | Teradyne, Inc. | High performance probe interface for automatic test equipment |
CN1276260C (en) * | 1998-03-04 | 2006-09-20 | 泰拉丁公司 | Coaxial probe interface for automatic test equipment |
EP1113274B1 (en) * | 1998-07-10 | 2005-01-12 | Nhk Spring Co.Ltd. | Conductive contact |
JP2000097969A (en) | 1998-09-26 | 2000-04-07 | Suzuka Fuji Xerox Co Ltd | Contact probe for frame ground |
JP2000241506A (en) | 1999-02-19 | 2000-09-08 | Sony Corp | Inspecting apparatus for printed board |
JP2001091543A (en) * | 1999-09-27 | 2001-04-06 | Hitachi Ltd | Semiconductor inspecting device |
JP2001099889A (en) * | 1999-09-29 | 2001-04-13 | Yokowo Co Ltd | Inspection equipment for high frequency circuit |
JP4707322B2 (en) * | 2002-02-07 | 2011-06-22 | 株式会社ヨコオ | Capacity loaded probe and inspection jig using the same |
US6667628B2 (en) * | 2002-04-02 | 2003-12-23 | Agilent Technologies, Inc. | Method and apparatus for the management of forces in a wireless fixture |
-
2002
- 2002-11-19 JP JP2002334985A patent/JP4251855B2/en not_active Expired - Lifetime
-
2003
- 2003-11-18 EP EP03026538A patent/EP1422530B1/en not_active Expired - Fee Related
- 2003-11-18 DE DE60314824T patent/DE60314824T2/en not_active Expired - Fee Related
- 2003-11-18 US US10/714,978 patent/US6844748B2/en not_active Expired - Lifetime
- 2003-11-19 CN CNB200310117910XA patent/CN100401072C/en not_active Expired - Fee Related
- 2003-11-19 KR KR1020030082093A patent/KR100626629B1/en not_active IP Right Cessation
- 2003-11-19 TW TW092132378A patent/TWI269039B/en not_active IP Right Cessation
- 2003-11-19 SG SG200306818A patent/SG115588A1/en unknown
- 2003-11-19 MY MYPI20034442A patent/MY131824A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE60314824D1 (en) | 2007-08-23 |
JP2004170182A (en) | 2004-06-17 |
SG115588A1 (en) | 2005-10-28 |
DE60314824T2 (en) | 2008-03-13 |
EP1422530A3 (en) | 2005-01-19 |
JP4251855B2 (en) | 2009-04-08 |
KR20040044377A (en) | 2004-05-28 |
TW200419158A (en) | 2004-10-01 |
US6844748B2 (en) | 2005-01-18 |
EP1422530A2 (en) | 2004-05-26 |
KR100626629B1 (en) | 2006-09-22 |
US20040095157A1 (en) | 2004-05-20 |
CN1502995A (en) | 2004-06-09 |
CN100401072C (en) | 2008-07-09 |
TWI269039B (en) | 2006-12-21 |
MY131824A (en) | 2007-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1422530B1 (en) | Inspection jig for radio frequency device, and contact probe incorporated in the jig | |
US7126362B2 (en) | Inspection unit | |
US7102373B2 (en) | Inspection unit | |
US7282378B2 (en) | Method of manufacturing inspection unit | |
US7656175B2 (en) | Inspection unit | |
US6953348B2 (en) | IC socket | |
US7456645B2 (en) | Inspection coaxial probe and inspection unit incorporating the same | |
US7420383B2 (en) | Inspection unit for high frequency/high speed device connections | |
US7663387B2 (en) | Test socket | |
JP4921344B2 (en) | Inspection socket | |
US20080088331A1 (en) | Socket for test | |
US20100188112A1 (en) | Inspection socket | |
JP2001099889A (en) | Inspection equipment for high frequency circuit | |
JP2007178163A (en) | Inspection unit and outer sheath tube assembly for inspection probe used for it | |
JP4251854B2 (en) | Inspection jig for high frequency and high speed devices |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: 7G 01R 1/067 B Ipc: 7G 01R 1/073 A |
|
17P | Request for examination filed |
Effective date: 20050311 |
|
17Q | First examination report despatched |
Effective date: 20050705 |
|
AKX | Designation fees paid |
Designated state(s): DE FR GB IT NL |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB IT NL |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REF | Corresponds to: |
Ref document number: 60314824 Country of ref document: DE Date of ref document: 20070823 Kind code of ref document: P |
|
ET | Fr: translation filed | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20070711 |
|
NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20080414 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20081114 Year of fee payment: 6 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20081127 Year of fee payment: 6 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20081112 Year of fee payment: 6 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20081112 Year of fee payment: 6 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20091118 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20100730 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20091130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20100601 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20091118 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20091118 |