SG10201500486QA - Probing device - Google Patents

Probing device

Info

Publication number
SG10201500486QA
SG10201500486QA SG10201500486QA SG10201500486QA SG10201500486QA SG 10201500486Q A SG10201500486Q A SG 10201500486QA SG 10201500486Q A SG10201500486Q A SG 10201500486QA SG 10201500486Q A SG10201500486Q A SG 10201500486QA SG 10201500486Q A SG10201500486Q A SG 10201500486QA
Authority
SG
Singapore
Prior art keywords
probing device
probing
Prior art date
Application number
SG10201500486QA
Inventor
Wu Chien-Chou
Chi Chen Ming
Che Li Chung
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW100127587A external-priority patent/TWI431282B/en
Priority claimed from TW101213755U external-priority patent/TWM442506U/en
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of SG10201500486QA publication Critical patent/SG10201500486QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
SG10201500486QA 2011-08-03 2012-08-02 Probing device SG10201500486QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100127587A TWI431282B (en) 2011-08-03 2011-08-03 Probing device
TW101213755U TWM442506U (en) 2012-07-17 2012-07-17 Probe testing device

Publications (1)

Publication Number Publication Date
SG10201500486QA true SG10201500486QA (en) 2015-03-30

Family

ID=47613129

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201500486QA SG10201500486QA (en) 2011-08-03 2012-08-02 Probing device
SG2012057501A SG187376A1 (en) 2011-08-03 2012-08-02 Probing device

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012057501A SG187376A1 (en) 2011-08-03 2012-08-02 Probing device

Country Status (3)

Country Link
US (1) US9347971B2 (en)
CN (1) CN102914673B (en)
SG (2) SG10201500486QA (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI541959B (en) * 2013-10-22 2016-07-11 And a space converter for a wafer carrier for a wafer having a long strip contact is used And its manufacturing method
CN104793026B (en) * 2014-01-20 2018-09-28 旺矽科技股份有限公司 Supporting structure applied to probe testing device and manufacturing method thereof
TWI605255B (en) * 2016-04-29 2017-11-11 中華精測科技股份有限公司 Stack type test interface board assembly and manufacturing method thereof
CN108572265A (en) * 2017-03-14 2018-09-25 旺矽科技股份有限公司 Micro-electromechanical probe, manufacturing method thereof and probe head with micro-electromechanical probe
KR102590407B1 (en) * 2017-10-31 2023-10-16 폼팩터, 인크. MEMS probe card assembly with decoupled electrical and mechanical probe connections
TWI679427B (en) * 2018-10-01 2019-12-11 巨擘科技股份有限公司 Probe card device
US11340260B2 (en) 2019-12-24 2022-05-24 Teradyne, Inc. Probe card pad geometry in automated test equipment
US11162980B2 (en) * 2019-12-24 2021-11-02 Teradyne, Inc. Coaxial via arrangement in probe card for automated test equipment
US11333683B2 (en) 2019-12-24 2022-05-17 Teradyne, Inc. Transposed via arrangement in probe card for automated test equipment
US11215641B2 (en) 2019-12-24 2022-01-04 Teradyne, Inc. Probe card assembly in automated test equipment
CN113945741B (en) * 2020-07-15 2023-11-10 台湾中华精测科技股份有限公司 Probe card device and fence-shaped probe thereof
TWI792528B (en) * 2021-08-31 2023-02-11 旺矽科技股份有限公司 Probe card and wafer probing assembly thereof
CN115951203B (en) * 2023-03-14 2023-06-16 杭州朗迅科技股份有限公司 Dual-module integrated circuit high-frequency test equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534784A (en) * 1994-05-02 1996-07-09 Motorola, Inc. Method for probing a semiconductor wafer
TW369601B (en) * 1997-06-17 1999-09-11 Advantest Corp Probe card
JPH1172534A (en) 1997-08-28 1999-03-16 Mitsubishi Electric Corp Semiconductor device with test terminal, and ic socket
US6917525B2 (en) 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
JP5426161B2 (en) * 2006-06-08 2014-02-26 日本発條株式会社 Probe card
CN200968961Y (en) * 2006-11-10 2007-10-31 中兴通讯股份有限公司 Interface neilsbed
US7696766B2 (en) 2007-01-31 2010-04-13 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-fine pitch probe card structure

Also Published As

Publication number Publication date
SG187376A1 (en) 2013-02-28
US20130033283A1 (en) 2013-02-07
CN102914673A (en) 2013-02-06
CN102914673B (en) 2015-09-30
US9347971B2 (en) 2016-05-24

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