SG10201706003QA - Direct-docking probing device - Google Patents

Direct-docking probing device

Info

Publication number
SG10201706003QA
SG10201706003QA SG10201706003QA SG10201706003QA SG10201706003QA SG 10201706003Q A SG10201706003Q A SG 10201706003QA SG 10201706003Q A SG10201706003Q A SG 10201706003QA SG 10201706003Q A SG10201706003Q A SG 10201706003QA SG 10201706003Q A SG10201706003Q A SG 10201706003QA
Authority
SG
Singapore
Prior art keywords
docking
direct
probing device
probing
docking probing
Prior art date
Application number
SG10201706003QA
Inventor
Chien-Chou Wu
Ming-Chi Chen
Tsung-Yi Chen
Chung-Che Li
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201010552375.0A external-priority patent/CN102478590B/en
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of SG10201706003QA publication Critical patent/SG10201706003QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
SG10201706003QA 2010-08-13 2011-04-28 Direct-docking probing device SG10201706003QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW99127029 2010-08-13
CN201010552375.0A CN102478590B (en) 2010-11-22 2010-11-22 Direct probe-testing type probe testing device

Publications (1)

Publication Number Publication Date
SG10201706003QA true SG10201706003QA (en) 2017-08-30

Family

ID=45564365

Family Applications (3)

Application Number Title Priority Date Filing Date
SG2011029972A SG178656A1 (en) 2010-08-13 2011-04-28 Direct-docking probing device
SG2014005508A SG196865A1 (en) 2010-08-13 2011-04-28 Direct-docking probing device
SG10201706003QA SG10201706003QA (en) 2010-08-13 2011-04-28 Direct-docking probing device

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SG2011029972A SG178656A1 (en) 2010-08-13 2011-04-28 Direct-docking probing device
SG2014005508A SG196865A1 (en) 2010-08-13 2011-04-28 Direct-docking probing device

Country Status (2)

Country Link
US (1) US20120038383A1 (en)
SG (3) SG178656A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9134357B1 (en) * 2011-03-25 2015-09-15 Maxim Integrated, Inc. Universal direct docking at probe test
JP6374642B2 (en) * 2012-11-28 2018-08-15 株式会社日本マイクロニクス Probe card and inspection device
TWI480561B (en) * 2013-05-15 2015-04-11 Star Techn Inc Test assembly
JP6393542B2 (en) * 2014-07-18 2018-09-19 株式会社日本マイクロニクス Contact inspection device
US11262384B2 (en) 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
IT201700046645A1 (en) * 2017-04-28 2018-10-28 Technoprobe Spa Measurement board for a test device of electronic devices
US10775414B2 (en) * 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3500105B2 (en) * 2000-02-10 2004-02-23 日本発条株式会社 Support for conductive contact and contact probe unit
US6759860B1 (en) * 2001-06-19 2004-07-06 Lsi Logic Corporation Semiconductor device package substrate probe fixture
JP3878449B2 (en) * 2001-10-17 2007-02-07 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
US6744267B2 (en) * 2002-07-16 2004-06-01 Nptest, Llc Test system and methodology
US7071715B2 (en) * 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
TW200718302A (en) * 2005-10-20 2007-05-01 Mjc Probe Inc Multi-step Print Circuit Board (PCB) designed in a probe card
US7504822B2 (en) * 2005-10-28 2009-03-17 Teradyne, Inc. Automatic testing equipment instrument card and probe cabling system and apparatus
JP5426161B2 (en) * 2006-06-08 2014-02-26 日本発條株式会社 Probe card
US7368928B2 (en) * 2006-08-29 2008-05-06 Mjc Probe Incorporation Vertical type high frequency probe card
JP5190195B2 (en) * 2006-11-29 2013-04-24 株式会社日本マイクロニクス Electrical connection device
EP2253961A1 (en) * 2008-03-14 2010-11-24 FUJIFILM Corporation Probe guard
CN101598743A (en) * 2008-06-02 2009-12-09 旺矽科技股份有限公司 Probe
CN101644724B (en) * 2008-08-04 2012-08-08 旺矽科技股份有限公司 Probe testing device
US20100330830A1 (en) * 2009-06-25 2010-12-30 Corad Technology Inc. Vertical probe intrface system

Also Published As

Publication number Publication date
SG196865A1 (en) 2014-02-13
US20120038383A1 (en) 2012-02-16
SG178656A1 (en) 2012-03-29

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