WO2009096318A1 - プローブユニット - Google Patents
プローブユニット Download PDFInfo
- Publication number
- WO2009096318A1 WO2009096318A1 PCT/JP2009/050999 JP2009050999W WO2009096318A1 WO 2009096318 A1 WO2009096318 A1 WO 2009096318A1 JP 2009050999 W JP2009050999 W JP 2009050999W WO 2009096318 A1 WO2009096318 A1 WO 2009096318A1
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- WIPO (PCT)
- Prior art keywords
- diameter
- small
- probe
- diameter probe
- plunger
- Prior art date
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Definitions
- the present invention relates to a probe unit that houses a conductive probe that inputs and outputs signals in electrical characteristic inspection of a semiconductor integrated circuit or the like.
- a probe unit in which a plurality of conductive probes are accommodated at predetermined positions is used corresponding to the external electrode installation pattern of the semiconductor integrated circuit.
- the probe unit includes a probe holder provided with a plurality of holes through which the contact probe is inserted, and both ends of the conductive probe held by the probe holder are connected to a semiconductor integrated circuit and a circuit board that outputs a test signal. By contacting each of the electrodes, the semiconductor integrated circuit and the circuit board are electrically connected (see, for example, Patent Document 1).
- a probe capable of flowing a large current of about 10 to 20 A has been required in the case of inspecting a semiconductor for a control system of an automobile.
- the probe diameter may be increased.
- the maximum diameter or pitch of the semiconductor electrodes is 1 mm or less, there is a problem that the diameter of the probe has to be made rather thin, and as a result, the allowable current becomes small.
- a probe with a small diameter is necessary, and the allowable current has to be reduced.
- the present invention has been made in view of the above, and an object of the present invention is to provide a probe unit capable of suppressing a reduction in allowable current due to a narrowed probe diameter.
- a probe unit includes a plurality of large-diameter probes, each of which is formed using a conductive material, and is extendable along the longitudinal direction.
- a plurality of small diameter probes having a diameter smaller than the diameter of the large diameter probe, a plurality of large hole portions for individually holding the plurality of large diameter probes, and the large hole portion Smaller diameter, communicated with any of the plurality of large holes, and has a plurality of receiving holes for receiving the end of the small diameter probe in contact with the large diameter probe, and communicated with each other
- Each small hole is A small-diameter probe holder stacked on the large-diameter probe holder so as to communicate with any of a plurality of receiving hole portions, and the central axis in the longitudinal direction of the large-hole portion and the small-hole portion communicating with each other is different.
- the plurality of small holes include a distance between the central axes of two adjacent small holes that is smaller than a distance between the central axes of the two large holes respectively corresponding to the two small holes.
- the probe unit according to the present invention is the above-described invention, wherein the large-diameter probe is a first plunger having a substantially needle shape, a tip is directed in a direction opposite to the tip of the first plunger, and the small-diameter probe A second plunger that is in contact with the elastic member, and one end portion in the longitudinal direction is attached to the first plunger and the other end portion is attached to the second plunger and is elastic in the longitudinal direction.
- the tip of the second plunger forms a plane substantially perpendicular to the longitudinal direction of the large-diameter probe.
- the large-diameter probe holder is laminated on the first substrate, the first substrate holding the tip portion of the first plunger exposed, and the first substrate. And a second substrate that is stacked on the small-diameter probe holder and receives the end of the small-diameter probe held by the small-diameter probe holder.
- the large-diameter probe is a pogo pin.
- the probe unit according to the present invention is characterized in that, in the above-mentioned invention, the tip of the pogo pin that comes into contact with the small-diameter probe forms a plane substantially perpendicular to the longitudinal direction of the large-diameter probe.
- the large-diameter probe holder is laminated on the first substrate and a first substrate that exposes and holds a tip of the pogo pin that does not contact the small-diameter probe. And a second substrate that is stacked on the small diameter probe holder and receives an end of the small diameter probe held by the small diameter probe holder.
- the probe unit according to the present invention is characterized in that, in the above invention, the small-diameter probe holder is formed by laminating two substrates that expose and hold either one end of the small-diameter probe. To do.
- the probe unit according to the present invention is characterized in that, in the above invention, the large-diameter probe holder and the small-diameter probe holder have an insulating property at least in contact with the large-diameter probe and / or the small-diameter probe. To do.
- the probe unit since a pair of probes is configured by combining a large-diameter probe and a small-diameter probe in a state in which the axes are shifted from each other, it is possible to cope with the narrowing of the pitch to be inspected. In addition, it is not necessary to reduce the diameter of both ends of the probe. Therefore, it is possible to suppress a decrease in allowable current due to the narrowing of the probe.
- FIG. 1 is a diagram showing a configuration of a main part of a probe unit according to an embodiment of the present invention.
- FIG. 2 is a diagram schematically showing the positional relationship between the large hole portion and the small hole portion.
- FIG. 3 is a diagram showing an outline of assembly of the probe unit according to the embodiment of the present invention.
- FIG. 4 is a perspective view schematically showing the overall configuration of the probe unit according to the embodiment of the present invention.
- FIG. 5 is a diagram showing a state at the time of inspection of the probe unit according to the embodiment of the present invention.
- FIG. 6 is a diagram showing a configuration of a probe unit according to another embodiment of the present invention.
- FIG. 1 is a partial cross-sectional view showing a configuration of a main part of a probe unit according to an embodiment of the present invention.
- a probe unit 1 shown in FIG. 1 is a device used when an electrical characteristic test is performed on a semiconductor integrated circuit to be inspected, and is provided between the semiconductor integrated circuit and a circuit board that outputs a test signal to the semiconductor integrated circuit. Is an apparatus for electrically connecting the two.
- the probe unit 1 has a plurality of large-diameter probes 2 each having one end in contact with an electrode provided on a circuit board, each one in contact with the large-diameter probe 2, and the other end in contact with an electrode of a semiconductor integrated circuit.
- the large-diameter probe 2 is formed using a conductive material, and has a first needle 21 having a substantially needle shape, a spring member 22 that is an elastic member that has one end attached to the first plunger 21 and is elastic in the longitudinal direction, The other end of the spring member 22 is attached and the second plunger 23 has a tip directed in a direction opposite to the tip of the first plunger 21.
- the first plunger 21, the spring member 22, and the second plunger 23 have the same center axis in the longitudinal direction.
- the first plunger 21 protrudes in a direction opposite to the distal end portion 21a via the flange portion 21b, a distal end portion 21a having a sharp end, a flange portion 21b having a diameter larger than the diameter of the distal end portion 21a, and the flange portion 21b.
- a cylindrical shape having a diameter smaller than the diameter and slightly larger than the inner diameter of the spring member 22 is formed.
- the boss portion 21c into which the end of the spring member 22 is press-fitted, and smaller than the diameter of the boss portion 21c and smaller than the diameter of the spring member 22 A base end portion 21d having a cylindrical shape having a diameter smaller than the inner diameter.
- the spring member 22 is wound in a state in which the end portion is press-fitted into the boss portion 21c of the first plunger 21, and the wire constituting the spring member 22 is in close contact with the coarse winding portion 22a. And a tightly wound portion 22 b that is press-fitted into the second plunger 23.
- the coarsely wound portion 22a and the tightly wound portion 22b are connected to each other and have the same diameter.
- the second plunger 23 has a columnar tip portion 23a and a columnar shape having a diameter smaller than the diameter of the tip portion 23a and slightly larger than the inner diameter of the spring member 22, and the end portion of the tightly wound portion 22b is press-fitted. And a base end portion 23c having a diameter smaller than that of the boss portion 23b and smaller than the inner diameter of the spring member 22.
- the outer diameter of the tip portion 23 a is slightly larger than the outer diameter of the spring member 22.
- the length of the base end portion 23c can be arbitrarily set as long as it does not come into contact with the first plunger 21 even if the large-diameter probe 2 makes a maximum stroke.
- the distal end surface of the distal end portion 23 a that forms the upper surface of the second plunger 23 is a plane orthogonal to the longitudinal direction of the large-diameter probe 2, and the small-diameter probe 3 is in contact with this plane.
- the small-diameter probe 3 is provided with a distal end portion 31 and a proximal end portion 32 each having a sharp end, and a flange having a diameter larger than that of the distal end portion 31 and the proximal end portion 32. Part 33.
- the diameter of the distal end portion 31 and the diameter of the proximal end portion 32 are substantially equal, and those diameters are smaller than the outer diameter of the large diameter probe 2.
- the distal end of the base end portion 32 is in contact with the distal end portion 23a of the second plunger 23 of the large diameter probe 2 as described above.
- the small-diameter probe 3 is disposed at a position offset from the large-diameter probe 2 so that its central axis is parallel to and different from the central axis of the large-diameter probe 2.
- the large-diameter probe holder 4 is formed by laminating a first substrate 41 and a second substrate 42 formed using an insulating material such as resin, machinable ceramic, and silicon in the thickness direction (vertical direction in FIG. 1). Become.
- the large diameter probe holder 4 has a plurality of large hole portions 4a for individually holding the plurality of large diameter probes 2 and a diameter smaller than that of the large hole portion 4a and communicates with any of the plurality of large hole portions 4a.
- 3 has a plurality of receiving hole portions 4b for receiving the base end portions 32 in contact with the large-diameter probe 2. A set of the large hole portion 4a and the receiving hole portion 4b communicating with each other penetrates the large diameter probe holder 4 in the thickness direction.
- the central axes in the longitudinal direction of the large hole portion 4a and the receiving hole portion 4b communicating with each other are parallel and different.
- the distance d between the central axis of the large hole portion 4a and the central axis of the receiving hole portion 4b is set to be smaller than the radius of the circle forming the distal end surface of the distal end portion 23a.
- the first substrate 41 is provided with a plurality of first hole portions 41a that form part of the large hole portions 4a.
- the first hole portion 41a is a cylindrical small-diameter hole 411a that can be inserted through the distal end portion 21a of the first plunger 21, and a cylindrical large-diameter hole that is larger in diameter than the small-diameter hole 411a and coaxial with the small-diameter hole 411a. 412a.
- the diameter of the small diameter hole 411 a is smaller than the diameter of the flange portion 21 b of the first plunger 21.
- the small-diameter hole 411a prevents the first plunger 21 from coming off while the front end portion 21a of the first plunger 21 is exposed.
- the maximum diameter of the large diameter hole 412a is larger than the maximum diameter of the large diameter probe 2.
- the second substrate 42 forms a plurality of receiving hole portions 4b and a part of the large hole portion 4a, and communicates with the corresponding receiving hole portions 4b to penetrate the second substrate 42 in the thickness direction.
- a hole 42a is provided.
- the diameter of the second hole portion 42a is equal to the diameter of the large diameter hole 412a.
- Each of the plurality of second holes 42a is coaxially connected to one of the plurality of large-diameter holes 412a at an end different from the end communicating with the receiving hole 4b.
- the small-diameter probe holder 5 is formed by laminating a third substrate 51 and a fourth substrate 52, which are respectively formed using the same insulating material as that of the large-diameter probe holder 4, in the thickness direction (vertical direction in FIG. 1).
- the small-diameter probe holder 5 is provided with a plurality of small holes 5a that hold the plurality of small-diameter probes 3 in a state in which the small-diameter probes 3 are individually removed and penetrate in the thickness direction.
- the small-diameter probe holder 5 is stacked on the large-diameter probe holder 4 so that each of the plurality of small hole portions 5a communicates coaxially with any of the plurality of receiving hole portions 4b.
- the third substrate 51 is provided with a plurality of third hole portions 51a that form part of the small hole portions 5a.
- the third hole 51a is a cylindrical small diameter hole 511a having a circular cross section through which the tip 31 of the small diameter probe 3 can be inserted, and a cylindrical shape having a diameter larger than that of the small diameter hole 511a and coaxial with the small diameter hole 511a.
- a large-diameter hole 512a The diameter of the small diameter hole 511 a is smaller than the diameter of the flange portion 33 of the small diameter probe 3.
- the diameter of the large-diameter hole 512 a is large enough to accommodate the flange portion 33 of the small-diameter probe 3 and has the same size as the flange portion 33.
- the third substrate 51 prevents the small-diameter probe 3 from coming off while the tip 31 of the small-diameter probe 3 is exposed.
- the fourth substrate 52 is provided with a plurality of fourth hole portions 52a that communicate with the corresponding third hole portions 51a to form the small hole portions 5a.
- the fourth hole 52a is a cylindrical small diameter hole 521a through which the proximal end portion 32 of the small diameter probe 3 can be inserted, and a cylindrical large diameter hole having a diameter larger than that of the small diameter hole 521a and coaxial with the small diameter hole 521a. 522a.
- the small diameter hole 521a communicates with the receiving hole 4b.
- the diameter of the small diameter hole 521a is equal to the diameter of the receiving hole portion 4b.
- the diameter of the large diameter hole 522a is equal to the diameter of the large diameter hole 512a.
- Each of the plurality of large diameter holes 522a communicates coaxially with any of the plurality of large diameter holes 512a.
- the fourth substrate 52 prevents the small-diameter probe 3 from coming off while the proximal end portion 32 of the small-diameter probe 3 is exposed.
- the large hole portion 4a, the receiving hole portion 4b, and the small hole portion 5a are formed by performing drilling, etching, punching molding, or processing using laser, electron beam, ion beam, wire discharge, or the like. .
- the large-diameter probe holder 4 and the small-diameter probe holder 5 include the surface of the substrate made of a conductive material (including portions corresponding to the side surfaces of the large hole portion 4a, the receiving hole portion 4b, and the small hole portion 5a) as insulating materials. It is also possible to have a structure covered with the above.
- FIG. 2 is a diagram schematically showing a positional relationship between the large hole portion 4a and the small hole portion 5a, and more specifically a diagram showing a positional relationship between the large diameter hole 412a and the small diameter hole 511a.
- the center axis distance H of the large diameter hole 412a is greater than the center axis distance h of the small diameter hole 511a.
- the distance between the central axis of the large diameter hole 412a and the central axis of the small diameter hole 511a is the distance between the central axis of the large hole portion 4a and the central axis of the receiving hole portion 4b. Equal to the distance d.
- FIG. 3 is a diagram showing an outline of assembly of the probe unit 1.
- the large-diameter probe holder 4 and the small-diameter probe holder 5 are provided with positioning openings, and positioning pins are provided in the large-diameter probe holder 4 and the small-diameter probe holder 5 corresponding to the opening. If both are positioned by insertion, the assembly of the probe unit 1 can be performed more easily and quickly.
- FIG. 4 is a perspective view showing an overall configuration of the probe unit 1 and an outline of electrical characteristic inspection of a semiconductor integrated circuit using the probe unit 1.
- a holder member 6 is provided on the outer periphery of the large-diameter probe holder 4 and the small-diameter probe holder 5 to prevent the semiconductor integrated circuit 100 from being displaced during inspection.
- a circuit board 200 having a circuit for outputting a test signal is attached to the bottom surface side of the holder member 6.
- FIG. 5 is a partial cross-sectional view showing a configuration of a main part of the probe unit 1 when the semiconductor integrated circuit 100 is inspected.
- the large-diameter probe 2 receives an upward force in the drawing by contacting the electrode 201 of the circuit board 200.
- the small-diameter probe 3 receives a downward force in the figure by contacting the electrode 101 of the semiconductor integrated circuit 100. Therefore, the spring member 22 of the large-diameter probe 2 is contracted along the longitudinal direction as compared with the state where the small-diameter probe 3 is not in contact with the electrode 101 of the semiconductor integrated circuit 100.
- An inspection signal generated when the semiconductor integrated circuit 100 is inspected passes through the first plunger 21 of the large-diameter probe 2, the tightly wound portion 22 b, and the second plunger 23 via the electrode 201 of the circuit board 200, and then passes through the small-diameter probe 3. It reaches the electrode 101 of the semiconductor integrated circuit 100 via the route.
- the first plunger 21 and the second plunger 23 are conducted through the tightly wound portion 22b, so that the conduction path of the electric signal can be minimized. Therefore, it is possible to prevent a signal from flowing to the rough winding portion 22a during the inspection, and to reduce and stabilize the inductance and resistance.
- the small-diameter probe 3 When the probe unit 1 repeats the inspection, the small-diameter probe 3 repeatedly contacts and separates from the electrode 101 every inspection, and therefore, the tip 31 may be worn or the small-diameter probe 3 may be damaged by long-term use. is there. In such a case, in this embodiment, since the small diameter probe holder 5 can be removed from the large diameter probe holder 4, only the small diameter probe 3 can be easily replaced.
- a set of probes is configured by combining a large-diameter probe and a small-diameter probe in a state where their axes are shifted from each other.
- it is not necessary to reduce the diameter of both ends of the probe. Therefore, it is possible to suppress a decrease in allowable current due to the narrowing of the probe.
- the deterioration with time is severe, and the small diameter probe, which is the largest cause of the increase in the contact resistance value, can be replaced independently of the large diameter probe, so that maintenance can be easily performed. It becomes.
- the large-diameter probe holder can be used as it is unless there is a particular problem. Therefore, a large-diameter probe can be saved and it is economical.
- the processing is easier than the case where the large diameter probe and the small diameter probe are offset and integrally formed.
- the probe does not have an axisymmetric shape. For this reason, when housing the integrally formed probe in the probe holder, positioning must be performed while paying attention to the position of the hole through which the portion corresponding to the small diameter probe is inserted, and it takes time to house the probe. There was a problem.
- the large-diameter probe and the small-diameter probe are separated so that each probe has an axisymmetric shape, so that each probe can be easily accommodated in the probe holder. it can.
- FIG. 6 is a partial cross-sectional view showing a configuration of a main part of a probe unit according to another embodiment of the present invention.
- the probe unit 7 shown in the figure has the same configuration as the probe unit 1 described above except for the configuration of a large-diameter probe.
- the large-diameter probe 8 included in the probe unit 7 is a pogo pin.
- the outer circumference of a first plunger 81, a second plunger 82, and a spring member (not shown) interposed between the first plunger 81 and the second plunger 82 is provided.
- a pipe member 83 to be covered.
- the tip of the second plunger 82 forms a plane orthogonal to the longitudinal direction of the large diameter probe 8. According to the probe unit 7 having such a configuration, it is possible to obtain the same effect as in the above embodiment.
- the probe unit according to the present invention is useful for inspection of electrical characteristics of a semiconductor integrated circuit such as an IC chip.
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Abstract
Description
2、8 大径プローブ
3 小径プローブ
4 大径プローブホルダ
4a 大孔部
4b 受容孔部
5 小径プローブホルダ
5a 小孔部
6 ホルダ部材
21、81 第1プランジャ
21a、23a、31 先端部
21b、33 フランジ部
21c、23b ボス部
21d、23c、32 基端部
22 バネ部材
22a 粗巻き部
22b 密着巻き部
23、82 第2プランジャ
41 第1基板
41a 第1孔部
42 第2基板
42a 第2孔部
51 第3基板
51a 第3孔部
52 第4基板
52a 第4孔部
83 パイプ部材
100 半導体集積回路
101、201 電極
200 回路基板
411a、511a、521a 小径孔
412a、512a、522a 大径孔
Claims (9)
- 各々が導電性材料を用いて形成され、長手方向に沿って伸縮自在である複数の大径プローブと、
各々が導電性材料を用いて形成され、前記大径プローブの径よりも小さい径を有する複数の小径プローブと、
前記複数の大径プローブを個別に保持する複数の大孔部と、前記大孔部よりも径が小さく、前記複数の大孔部のいずれかと連通し、前記小径プローブの端部を前記大径プローブと接触した状態で受容する複数の受容孔部とを有し、互いに連通する前記大孔部および前記受容孔部の組が厚さ方向に貫通する大径プローブホルダと、
前記複数の小径プローブを個別に抜け止めした状態で保持する複数の小孔部が厚さ方向に貫通して設けられ、各小孔部が前記複数の受容孔部のいずれかと連通するように前記大径プローブホルダに積層された小径プローブホルダと、
を備え、
互いに連通する前記大孔部および前記小孔部の長手方向の中心軸は異なり、
前記複数の小孔部には、隣接する二つの小孔部の中心軸間距離が該二つの小孔部にそれぞれ対応する二つの大孔部の中心軸間距離より小さいものが含まれること
を特徴とするプローブユニット。 - 前記大径プローブは、
略針状をなす第1プランジャと、
先端が前記第1プランジャの先端と相反する方向を指向し、前記小径プローブと接触する第2プランジャと、
長手方向の一端部が前記第1プランジャに取り付けられるとともに他端部が前記第2プランジャに取り付けられ、当該長手方向に沿って伸縮自在な弾性部材と、
を有することを特徴とする請求項1記載のプローブユニット。 - 前記第2プランジャの先端は、前記大径プローブの長手方向と略直交する平面をなすことを特徴とする請求項2記載のプローブユニット。
- 前記大径プローブホルダは、
前記第1プランジャの先端部を表出させて保持する第1基板と、
前記第1基板に積層されるとともに前記小径プローブホルダに積層され、前記小径プローブホルダが保持する前記小径プローブの端部を受容する第2基板と、
を有することを特徴とする請求項2または3記載のプローブユニット。 - 前記大径プローブはポゴピンであることを特徴とする請求項1記載のプローブユニット。
- 前記小径プローブと接触する前記ポゴピンの先端は、前記大径プローブの長手方向と略直交する平面をなすことを特徴とする請求項5記載のプローブユニット。
- 前記大径プローブホルダは、
前記小径プローブと接触しない前記ポゴピンの先端を表出させて保持する第1基板と、
前記第1基板に積層されるとともに前記小径プローブホルダに積層され、前記小径プローブホルダが保持する前記小径プローブの端部を受容する第2基板と、
を有することを特徴とする請求項5または6記載のプローブユニット。 - 前記小径プローブホルダは、
前記小径プローブのいずれか一方の端部をそれぞれ表出させて保持する二つの基板が積層されて成ることを特徴とする請求項1~7のいずれか一項記載のプローブユニット。 - 前記大径プローブホルダおよび前記小径プローブホルダは、少なくとも前記大径プローブおよび/または前記小径プローブと接触する部分が絶縁性を有することを特徴とする請求項1~8のいずれか一項記載のプローブユニット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09706648.4A EP2239587B1 (en) | 2008-02-01 | 2009-01-22 | Probe unit |
CN2009801037922A CN101932941B (zh) | 2008-02-01 | 2009-01-22 | 探针单元 |
US12/735,598 US8344747B2 (en) | 2008-02-01 | 2009-01-22 | Probe unit |
JP2009551488A JP5607934B2 (ja) | 2008-02-01 | 2009-01-22 | プローブユニット |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-023167 | 2008-02-01 | ||
JP2008023167 | 2008-02-01 |
Publications (1)
Publication Number | Publication Date |
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WO2009096318A1 true WO2009096318A1 (ja) | 2009-08-06 |
Family
ID=40912671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2009/050999 WO2009096318A1 (ja) | 2008-02-01 | 2009-01-22 | プローブユニット |
Country Status (7)
Country | Link |
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US (1) | US8344747B2 (ja) |
EP (1) | EP2239587B1 (ja) |
JP (1) | JP5607934B2 (ja) |
KR (1) | KR101174007B1 (ja) |
CN (1) | CN101932941B (ja) |
TW (1) | TWI397692B (ja) |
WO (1) | WO2009096318A1 (ja) |
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- 2009-01-22 CN CN2009801037922A patent/CN101932941B/zh not_active Expired - Fee Related
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI420111B (zh) * | 2009-12-11 | 2013-12-21 | Nhk Spring Co Ltd | 接觸探針 |
WO2012067125A1 (ja) * | 2010-11-17 | 2012-05-24 | 日本発條株式会社 | プローブユニット |
JPWO2012067125A1 (ja) * | 2010-11-17 | 2014-05-12 | 日本発條株式会社 | プローブユニット |
TWI457573B (zh) * | 2010-11-17 | 2014-10-21 | Nhk Spring Co Ltd | 探針單元 |
JP2019144112A (ja) * | 2018-02-21 | 2019-08-29 | 株式会社日本マイクロニクス | 電気的接続装置 |
Also Published As
Publication number | Publication date |
---|---|
US8344747B2 (en) | 2013-01-01 |
EP2239587B1 (en) | 2017-12-27 |
KR101174007B1 (ko) | 2012-08-16 |
CN101932941A (zh) | 2010-12-29 |
EP2239587A4 (en) | 2014-03-19 |
US20110025358A1 (en) | 2011-02-03 |
JP5607934B2 (ja) | 2014-10-15 |
CN101932941B (zh) | 2013-11-06 |
JPWO2009096318A1 (ja) | 2011-05-26 |
EP2239587A1 (en) | 2010-10-13 |
TW200938847A (en) | 2009-09-16 |
KR20100105749A (ko) | 2010-09-29 |
TWI397692B (zh) | 2013-06-01 |
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