SG10201905587SA - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
SG10201905587SA
SG10201905587SA SG10201905587SA SG10201905587SA SG10201905587SA SG 10201905587S A SG10201905587S A SG 10201905587SA SG 10201905587S A SG10201905587S A SG 10201905587SA SG 10201905587S A SG10201905587S A SG 10201905587SA SG 10201905587S A SG10201905587S A SG 10201905587SA
Authority
SG
Singapore
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Application number
SG10201905587SA
Other languages
English (en)
Inventor
Baik Seunghyun
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SG10201905587SA publication Critical patent/SG10201905587SA/en

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    • HELECTRICITY
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    • H01L25/0652Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Geometry (AREA)
  • Semiconductor Memories (AREA)
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SG10201905587SA 2018-07-05 2019-06-18 Semiconductor package SG10201905587SA (en)

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KR102671078B1 (ko) * 2019-05-02 2024-05-30 에스케이하이닉스 주식회사 팬 아웃 서브 패키지를 포함한 스택 패키지
US11127727B2 (en) * 2019-06-06 2021-09-21 Intel Corporation Thermal spreading management of 3D stacked integrated circuits
KR20210019226A (ko) * 2019-08-12 2021-02-22 에스케이하이닉스 주식회사 적층 반도체 칩을 포함하는 반도체 패키지
KR20210077290A (ko) * 2019-12-17 2021-06-25 에스케이하이닉스 주식회사 적층 반도체 칩을 포함하는 반도체 패키지
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KR102428150B1 (ko) * 2020-09-21 2022-08-01 스마트 모듈러 테크놀로지스 (글로벌), 인크 고용량 및 와이드 대역폭을 갖는 메모리 장치
KR20220063837A (ko) * 2020-11-10 2022-05-18 삼성전자주식회사 반도체 패키지

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KR102534732B1 (ko) * 2016-06-14 2023-05-19 삼성전자 주식회사 반도체 패키지

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