KR102304963B9 - 반도체 패키지 - Google Patents
반도체 패키지Info
- Publication number
- KR102304963B9 KR102304963B9 KR1020190130235A KR20190130235A KR102304963B9 KR 102304963 B9 KR102304963 B9 KR 102304963B9 KR 1020190130235 A KR1020190130235 A KR 1020190130235A KR 20190130235 A KR20190130235 A KR 20190130235A KR 102304963 B9 KR102304963 B9 KR 102304963B9
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- package
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190130235A KR102304963B1 (ko) | 2019-10-18 | 2019-10-18 | 반도체 패키지 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190130235A KR102304963B1 (ko) | 2019-10-18 | 2019-10-18 | 반도체 패키지 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| KR20210046480A KR20210046480A (ko) | 2021-04-28 |
| KR102304963B1 KR102304963B1 (ko) | 2021-09-27 |
| KR102304963B9 true KR102304963B9 (ko) | 2022-04-11 |
Family
ID=75721307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190130235A KR102304963B1 (ko) | 2019-10-18 | 2019-10-18 | 반도체 패키지 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR102304963B1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230055102A1 (en) * | 2021-08-18 | 2023-02-23 | Microchip Technology Incorporated | Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles |
| CN116884927A (zh) * | 2023-07-19 | 2023-10-13 | 先之科半导体科技(东莞)有限公司 | 抗干扰且具有塑封结构的场效应晶体管 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4463390B2 (ja) * | 2000-07-07 | 2010-05-19 | 北川工業株式会社 | 熱伝導材，電磁波シールド構造，及び熱伝導材の製造方法 |
| KR101862370B1 (ko) * | 2011-05-30 | 2018-05-29 | 삼성전자주식회사 | 반도체 소자, 반도체 패키지 및 전자 장치 |
| JP6268086B2 (ja) * | 2012-06-15 | 2018-01-24 | 株式会社カネカ | 放熱構造体 |
| TWI781215B (zh) | 2017-08-21 | 2022-10-21 | 金學模 | 改善散熱及電磁波屏蔽功能的層壓石墨的膜上晶片型半導體封裝 |
-
2019
- 2019-10-18 KR KR1020190130235A patent/KR102304963B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR102304963B1 (ko) | 2021-09-27 |
| KR20210046480A (ko) | 2021-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| AMND | Amendment | ||
| X701 | Decision to grant (after re-examination) | ||
| GRNT | Written decision to grant | ||
| G170 | Re-publication after modification of scope of protection [patent] |