SG10201800418RA - Systems and methods for in-situ wafer edge and backside plasma cleaning - Google Patents

Systems and methods for in-situ wafer edge and backside plasma cleaning

Info

Publication number
SG10201800418RA
SG10201800418RA SG10201800418RA SG10201800418RA SG10201800418RA SG 10201800418R A SG10201800418R A SG 10201800418RA SG 10201800418R A SG10201800418R A SG 10201800418RA SG 10201800418R A SG10201800418R A SG 10201800418RA SG 10201800418R A SG10201800418R A SG 10201800418RA
Authority
SG
Singapore
Prior art keywords
systems
methods
plasma cleaning
wafer edge
situ wafer
Prior art date
Application number
SG10201800418RA
Other languages
English (en)
Inventor
Keechan Kim
Jack Chen
Yunsang Kim
Kenneth George Delfin
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201800418RA publication Critical patent/SG10201800418RA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32091Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366Localised processing
    • H01J37/32385Treating the edge of the workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32403Treating multiple sides of workpieces, e.g. 3D workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02082Cleaning product to be cleaned
    • H01L21/02087Cleaning of wafer edges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02082Cleaning product to be cleaned
    • H01L21/0209Cleaning of wafer backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
SG10201800418RA 2013-07-19 2014-07-18 Systems and methods for in-situ wafer edge and backside plasma cleaning SG10201800418RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361856613P 2013-07-19 2013-07-19
US14/032,165 US20150020848A1 (en) 2013-07-19 2013-09-19 Systems and Methods for In-Situ Wafer Edge and Backside Plasma Cleaning

Publications (1)

Publication Number Publication Date
SG10201800418RA true SG10201800418RA (en) 2018-02-27

Family

ID=52342571

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201404208SA SG10201404208SA (en) 2013-07-19 2014-07-18 Systems and methods for in-situ wafer edge and backside plasma cleaning
SG10201800418RA SG10201800418RA (en) 2013-07-19 2014-07-18 Systems and methods for in-situ wafer edge and backside plasma cleaning

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201404208SA SG10201404208SA (en) 2013-07-19 2014-07-18 Systems and methods for in-situ wafer edge and backside plasma cleaning

Country Status (4)

Country Link
US (2) US20150020848A1 (ko)
KR (3) KR102329971B1 (ko)
SG (2) SG10201404208SA (ko)
TW (2) TWI710023B (ko)

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