SG10201407598VA - Substrate cleaning apparatus and substrate processing apparatus - Google Patents

Substrate cleaning apparatus and substrate processing apparatus

Info

Publication number
SG10201407598VA
SG10201407598VA SG10201407598VA SG10201407598VA SG10201407598VA SG 10201407598V A SG10201407598V A SG 10201407598VA SG 10201407598V A SG10201407598V A SG 10201407598VA SG 10201407598V A SG10201407598V A SG 10201407598VA SG 10201407598V A SG10201407598V A SG 10201407598VA
Authority
SG
Singapore
Prior art keywords
substrate
processing apparatus
substrate processing
cleaning apparatus
substrate cleaning
Prior art date
Application number
SG10201407598VA
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013239041A external-priority patent/JP2015099852A/en
Priority claimed from JP2013239040A external-priority patent/JP6321353B2/en
Priority claimed from JP2013241960A external-priority patent/JP6282850B2/en
Priority claimed from JP2013242716A external-priority patent/JP6339351B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201407598VA publication Critical patent/SG10201407598VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
SG10201407598VA 2013-11-19 2014-11-14 Substrate cleaning apparatus and substrate processing apparatus SG10201407598VA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013239041A JP2015099852A (en) 2013-11-19 2013-11-19 Substrate cleaning device and substrate processing device
JP2013239040A JP6321353B2 (en) 2013-11-19 2013-11-19 Substrate cleaning apparatus and substrate processing apparatus
JP2013241960A JP6282850B2 (en) 2013-11-22 2013-11-22 Substrate cleaning apparatus and substrate processing apparatus
JP2013242716A JP6339351B2 (en) 2013-11-25 2013-11-25 Substrate cleaning apparatus and substrate processing apparatus

Publications (1)

Publication Number Publication Date
SG10201407598VA true SG10201407598VA (en) 2015-06-29

Family

ID=53181612

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407598VA SG10201407598VA (en) 2013-11-19 2014-11-14 Substrate cleaning apparatus and substrate processing apparatus

Country Status (2)

Country Link
US (1) US10090189B2 (en)
SG (1) SG10201407598VA (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101641948B1 (en) * 2015-01-28 2016-07-25 세메스 주식회사 Substrate treating apparatus and chemical nozzle
SG10201601095UA (en) * 2015-02-18 2016-09-29 Ebara Corp Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus
US11676827B2 (en) 2016-03-08 2023-06-13 Ebara Corporation Substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus, and substrate drying apparatus
KR20190086859A (en) 2018-01-15 2019-07-24 삼성전자주식회사 Substrate Support Mechanism And Substrate Cleaning Device Including The Same
CN112543991A (en) 2018-08-06 2021-03-23 应用材料公司 Non-contact cleaning module
US20200306931A1 (en) * 2019-03-25 2020-10-01 Applied Materials, Inc. Methods and apparatus for removing abrasive particles
JP2021048336A (en) * 2019-09-20 2021-03-25 三菱電機株式会社 Processing liquid generating method, processing liquid generating mechanism, semiconductor manufacturing apparatus and semiconductor manufacturing method
CN114823430B (en) * 2022-06-28 2022-10-18 江苏芯梦半导体设备有限公司 Equipment and method for cleaning wafer
CN114823431B (en) * 2022-06-28 2022-10-18 江苏芯梦半导体设备有限公司 Spraying device for cleaning wafer

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JP2013089797A (en) 2011-10-19 2013-05-13 Ebara Corp Substrate cleaning method and substrate cleaning device
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CN103295936B (en) * 2012-02-29 2016-01-13 斯克林集团公司 Substrate board treatment and substrate processing method using same
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Also Published As

Publication number Publication date
US10090189B2 (en) 2018-10-02
US20150144164A1 (en) 2015-05-28

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