RU2690165C2 - Светоизлучающее устройство - Google Patents

Светоизлучающее устройство Download PDF

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Publication number
RU2690165C2
RU2690165C2 RU2018145015A RU2018145015A RU2690165C2 RU 2690165 C2 RU2690165 C2 RU 2690165C2 RU 2018145015 A RU2018145015 A RU 2018145015A RU 2018145015 A RU2018145015 A RU 2018145015A RU 2690165 C2 RU2690165 C2 RU 2690165C2
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Russia
Prior art keywords
light
emitting device
substrate
heat sink
main surface
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RU2018145015A
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English (en)
Russian (ru)
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RU2018145015A3 (enExample
RU2018145015A (ru
Inventor
Такуя НАКАБАЯСИ
Акира ХОРИ
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Нитиа Корпорейшн
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
RU2018145015A 2014-05-21 2015-05-20 Светоизлучающее устройство RU2690165C2 (ru)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-105728 2014-05-21
JP2014105728 2014-05-21
JP2015084046A JP6661890B2 (ja) 2014-05-21 2015-04-16 発光装置
JP2015-084046 2015-04-16

Related Parent Applications (1)

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RU2015119029A Division RU2677627C2 (ru) 2014-05-21 2015-05-20 Светоизлучающее устройство

Related Child Applications (1)

Application Number Title Priority Date Filing Date
RU2019114690A Division RU2763308C2 (ru) 2014-05-21 2019-05-15 Светоизлучающее устройство

Publications (3)

Publication Number Publication Date
RU2018145015A RU2018145015A (ru) 2018-12-26
RU2018145015A3 RU2018145015A3 (enExample) 2019-03-27
RU2690165C2 true RU2690165C2 (ru) 2019-05-31

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RU2018145015A RU2690165C2 (ru) 2014-05-21 2015-05-20 Светоизлучающее устройство
RU2015119029A RU2677627C2 (ru) 2014-05-21 2015-05-20 Светоизлучающее устройство
RU2019114690A RU2763308C2 (ru) 2014-05-21 2019-05-15 Светоизлучающее устройство

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RU2015119029A RU2677627C2 (ru) 2014-05-21 2015-05-20 Светоизлучающее устройство
RU2019114690A RU2763308C2 (ru) 2014-05-21 2019-05-15 Светоизлучающее устройство

Country Status (7)

Country Link
US (9) US9406852B2 (enExample)
EP (4) EP2947704B1 (enExample)
JP (2) JP6661890B2 (enExample)
KR (2) KR102110554B1 (enExample)
CN (2) CN105098029B (enExample)
RU (3) RU2690165C2 (enExample)
TW (2) TWI661580B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU202751U1 (ru) * 2020-08-11 2021-03-04 Постовой Денис Александрович Диодная сборка

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6661890B2 (ja) 2014-05-21 2020-03-11 日亜化学工業株式会社 発光装置
JP6484982B2 (ja) * 2014-09-30 2019-03-20 日亜化学工業株式会社 発光装置の製造方法
TW201526315A (zh) * 2015-02-17 2015-07-01 黃秀璋 覆晶式發光二極體及其製造方法
US12364074B2 (en) 2015-03-31 2025-07-15 Creeled, Inc. Light emitting diodes and methods
CN113130725B (zh) * 2015-03-31 2024-09-24 科锐Led公司 具有包封的发光二极管和方法
KR102373329B1 (ko) * 2015-04-30 2022-03-11 삼성디스플레이 주식회사 유기 발광 표시 장치
JP1547626S (enExample) * 2015-08-19 2016-04-11
JP1554165S (enExample) * 2016-01-13 2016-07-19
JP6693369B2 (ja) 2016-09-21 2020-05-13 豊田合成株式会社 光源および発光装置の実装方法
JP6834762B2 (ja) * 2016-09-29 2021-02-24 豊田合成株式会社 発光装置及び電子部品
US10199552B2 (en) * 2016-09-29 2019-02-05 Toyoda Gosei Co., Ltd. Light emitting device and electronic component
JP6565895B2 (ja) * 2016-12-26 2019-08-28 日亜化学工業株式会社 半導体装置用パッケージ及び半導体装置
JP6699580B2 (ja) * 2017-02-09 2020-05-27 日亜化学工業株式会社 発光装置
JP6432639B2 (ja) * 2017-04-28 2018-12-05 日亜化学工業株式会社 発光装置
US11686896B2 (en) 2017-10-27 2023-06-27 Radiant Opto-Electronics(Suzhou) Co., Ltd. LED light source module
KR102481413B1 (ko) * 2017-10-27 2022-12-26 라디안트 옵토-엘렉트로닉스(쑤저우) 컴퍼니 리미티드 Led 광원 모듈 및 이의 제조방법
JP7098930B2 (ja) * 2017-12-28 2022-07-12 住友大阪セメント株式会社 光変調器及びそれを用いた光送信装置
USD892067S1 (en) * 2018-04-13 2020-08-04 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD889422S1 (en) * 2018-04-13 2020-07-07 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD892068S1 (en) * 2018-04-13 2020-08-04 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD919582S1 (en) * 2018-04-13 2021-05-18 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD889421S1 (en) * 2018-04-13 2020-07-07 Seoul Semiconductor Co., Ltd. Light emitting diode package
WO2019231459A1 (en) 2018-05-31 2019-12-05 Nissan North America, Inc. In-module media assembly
US10697627B1 (en) * 2018-06-26 2020-06-30 Kilt Planning Office Inc. Illumination apparatus
JP7161100B2 (ja) * 2018-09-25 2022-10-26 日亜化学工業株式会社 発光装置及びその製造方法
USD881142S1 (en) * 2018-10-12 2020-04-14 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD894853S1 (en) * 2018-10-12 2020-09-01 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD881143S1 (en) * 2018-10-12 2020-04-14 Seoul Semiconductor Co., Ltd. Light emitting diode package
CN111430528B (zh) * 2019-01-10 2021-11-05 深圳市聚飞光电股份有限公司 一种发光装置及其显示装置
CN110112278A (zh) * 2019-04-25 2019-08-09 深圳市聚飞光电股份有限公司 一种安装基板及其发光装置
JP7307874B2 (ja) 2019-04-26 2023-07-13 日亜化学工業株式会社 発光装置及び発光モジュール
CN112802945A (zh) * 2021-02-04 2021-05-14 梅州市展至电子科技有限公司 一种半导体陶瓷封装基板及其封装工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10290029A (ja) * 1997-04-14 1998-10-27 Rohm Co Ltd Ｌｅｄチップ部品
US6093940A (en) * 1997-04-14 2000-07-25 Rohm Co., Ltd. Light-emitting diode chip component and a light-emitting device
RU2453948C2 (ru) * 2006-10-31 2012-06-20 Конинклейке Филипс Электроникс Н.В. Модуль осветительного устройства (варианты)

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3227295B2 (ja) * 1993-12-28 2001-11-12 松下電工株式会社 発光ダイオードの製造方法
JP2000156528A (ja) * 1998-11-19 2000-06-06 Sharp Corp 発光素子
JP2001024312A (ja) * 1999-07-13 2001-01-26 Taiyo Yuden Co Ltd 電子装置の製造方法及び電子装置並びに樹脂充填方法
JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置
JP2001352105A (ja) 2000-06-08 2001-12-21 Stanley Electric Co Ltd 表面実装型発光素子
JP2002237673A (ja) * 2001-02-08 2002-08-23 Murata Mfg Co Ltd 回路基板装置
EP1589586A4 (en) * 2003-01-20 2010-10-13 Sharp Kk TRANSPARENT RESIN COMPOSITION FOR AN OPTICAL SENSOR FILTER, OPTICAL SENSOR AND METHOD OF MANUFACTURING THEREOF
US7000052B2 (en) * 2003-02-24 2006-02-14 Cisco Technology, Inc. System and method for configuring and deploying input/output cards in a communications environment
JP2006093565A (ja) * 2004-09-27 2006-04-06 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
TW200637033A (en) * 2004-11-22 2006-10-16 Matsushita Electric Industrial Co Ltd Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device
US7705465B2 (en) * 2005-04-01 2010-04-27 Panasonic Corporation Surface-mount type optical semiconductor device and method for manufacturing the same
TW200711190A (en) 2005-08-17 2007-03-16 Matsushita Electric Industrial Co Ltd Surface mounted semiconductor device and method for manufacturing same
US20070187701A1 (en) * 2006-02-16 2007-08-16 Goon Wooi K Compact multi-LED light source with improved heat dissipation
WO2007099796A1 (ja) * 2006-02-22 2007-09-07 Nippon Sheet Glass Company, Limited. 発光ユニット、照明装置及び画像読取装置
CN100530721C (zh) * 2006-08-24 2009-08-19 亿光电子工业股份有限公司 适用于超薄型led封装的基板及其封装方法
TW200814362A (en) * 2006-09-13 2008-03-16 Bright Led Electronics Corp Light-emitting diode device with high heat dissipation property
JP2008147605A (ja) * 2006-11-14 2008-06-26 Harison Toshiba Lighting Corp 発光装置及びその製造方法並びに実装基板
US20100025722A1 (en) 2006-11-14 2010-02-04 Harison Toshiba Lighting Corp. Light emitting device, its manufacturing method and its mounted substrate
JP2009117536A (ja) * 2007-11-05 2009-05-28 Towa Corp 樹脂封止発光体及びその製造方法
JP2009188005A (ja) 2008-02-04 2009-08-20 Panasonic Corp 表面実装型半導体装置
JP2009194213A (ja) * 2008-02-15 2009-08-27 Sanyo Electric Co Ltd 電子部品
JP5227677B2 (ja) 2008-06-23 2013-07-03 スタンレー電気株式会社 Ｌｅｄの実装構造、ｌｅｄ光源及びこれを備えたバックライト装置
TWI456784B (zh) * 2008-07-29 2014-10-11 日亞化學工業股份有限公司 發光裝置
JP2010103294A (ja) * 2008-10-23 2010-05-06 Citizen Electronics Co Ltd 発光ダイオード
JP5521325B2 (ja) 2008-12-27 2014-06-11 日亜化学工業株式会社 発光装置及びその製造方法
JP2011054736A (ja) * 2009-09-01 2011-03-17 Sharp Corp 発光装置、平面光源および液晶表示装置
CN102044535B (zh) * 2009-10-26 2012-08-08 佛山市国星光电股份有限公司 一种户外显示屏用的smd led器件及其显示模组
JP5340191B2 (ja) * 2010-02-02 2013-11-13 日東電工株式会社 光半導体装置
JP5640632B2 (ja) * 2010-03-12 2014-12-17 旭硝子株式会社 発光装置
KR20110111243A (ko) * 2010-04-02 2011-10-10 아사히 가라스 가부시키가이샤 발광 소자 탑재 기판 및 이 기판을 사용한 발광 장치
JP2012028501A (ja) * 2010-07-22 2012-02-09 Toshiba Corp 発光装置
CN102376845A (zh) * 2010-08-17 2012-03-14 展晶科技(深圳)有限公司 发光二极管的封装结构
JP2012099544A (ja) * 2010-10-29 2012-05-24 Nichia Chem Ind Ltd 発光装置の製造方法
JP5693194B2 (ja) * 2010-12-14 2015-04-01 シチズン電子株式会社 発光ダイオード
US20120153311A1 (en) * 2010-12-17 2012-06-21 Intematix Corporation Low-cost solid-state based light emitting devices with photoluminescent wavelength conversion and their method of manufacture
US8455908B2 (en) 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
US20120261689A1 (en) * 2011-04-13 2012-10-18 Bernd Karl Appelt Semiconductor device packages and related methods
JP5770006B2 (ja) * 2011-04-15 2015-08-26 シチズン電子株式会社 半導体発光装置
JP2013008772A (ja) * 2011-06-23 2013-01-10 Citizen Electronics Co Ltd 側面実装型ｌｅｄ
JP2013033909A (ja) * 2011-06-29 2013-02-14 Hitachi Cable Ltd 発光素子搭載用基板及びｌｅｄパッケージ
JP5937315B2 (ja) 2011-08-11 2016-06-22 シチズン電子株式会社 発光ダイオード
JP2013110199A (ja) * 2011-11-18 2013-06-06 Citizen Electronics Co Ltd Ｌｅｄ発光装置
JP5933959B2 (ja) * 2011-11-18 2016-06-15 スタンレー電気株式会社 半導体光学装置
JP5940799B2 (ja) * 2011-11-22 2016-06-29 新光電気工業株式会社 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法
CN103137825B (zh) * 2011-11-30 2016-06-01 光宝电子(广州)有限公司 发光二极管基板结构、发光二极管单元及其光源模块
DE102012212968A1 (de) * 2012-07-24 2014-01-30 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterbauteil mit elektrisch isolierendem element
JP6127468B2 (ja) 2012-11-22 2017-05-17 日亜化学工業株式会社 発光装置
US9673364B2 (en) 2013-07-19 2017-06-06 Nichia Corporation Light emitting device and method of manufacturing the same
JP6273124B2 (ja) * 2013-11-08 2018-01-31 シチズン電子株式会社 Ｌｅｄ照明装置
JP2015207754A (ja) 2013-12-13 2015-11-19 日亜化学工業株式会社 発光装置
TWI650389B (zh) * 2014-03-18 2019-02-11 Kuraray Co., Ltd. 電子裝置
DE102014103828A1 (de) * 2014-03-20 2015-09-24 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterbauelementen
JP6318844B2 (ja) * 2014-05-20 2018-05-09 日亜化学工業株式会社 発光装置
JP6661890B2 (ja) * 2014-05-21 2020-03-11 日亜化学工業株式会社 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10290029A (ja) * 1997-04-14 1998-10-27 Rohm Co Ltd Ｌｅｄチップ部品
US5942770A (en) * 1997-04-14 1999-08-24 Rohm, Co., Ltd. Light-emitting diode chip component and a light-emitting device
US6093940A (en) * 1997-04-14 2000-07-25 Rohm Co., Ltd. Light-emitting diode chip component and a light-emitting device
RU2453948C2 (ru) * 2006-10-31 2012-06-20 Конинклейке Филипс Электроникс Н.В. Модуль осветительного устройства (варианты)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU202751U1 (ru) * 2020-08-11 2021-03-04 Постовой Денис Александрович Диодная сборка

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US10559735B2 (en) 2020-02-11
KR20150134273A (ko) 2015-12-01
EP3591721A1 (en) 2020-01-08
TWI661580B (zh) 2019-06-01
EP3454385A1 (en) 2019-03-13
RU2677627C2 (ru) 2019-01-18
RU2015119029A (ru) 2016-12-10
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