JP5937315B2 - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP5937315B2 JP5937315B2 JP2011175955A JP2011175955A JP5937315B2 JP 5937315 B2 JP5937315 B2 JP 5937315B2 JP 2011175955 A JP2011175955 A JP 2011175955A JP 2011175955 A JP2011175955 A JP 2011175955A JP 5937315 B2 JP5937315 B2 JP 5937315B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- pair
- light emitting
- mounting portion
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Description
12 基板
13 ベース部
13a 表面
13b 裏面
13c 下側面
14 実装部
14a 表面
14b 裏面
15 発光素子
16 樹脂体
17 第1電極
18 第2電極
19a,19b 熱伝導体
20 マザーボード
21 表面絶縁部
21a 縁部
21b 仕切部
22 裏面絶縁部
22a 縁部
22b 仕切部
23 端子開口部
24 放熱開口部
25 貫通孔
26 金属材料
27 ボンディングワイヤ
28 ハンダ
31 発光ダイオード
32 基板
33 ベース部
33a 表面
33c 下側面
34 実装部
35 発光素子
36 樹脂体
37 第1電極
38 第2電極
43 端子開口部
44 放熱開口部
45 遮蔽部材
46 遮蔽部材
47 ボンディングワイヤ
48 ハンダ
49 スルーホール
51 発光ダイオード
52 基板
53 ベース部
53c 下側面
54 実装部
55 発光素子
56 樹脂体
57 第1電極
58 第2電極
59 第3電極
63 端子開口部
64 放熱開口部
66 絶縁部
67 ボンディングワイヤ
68 ハンダ
69 スルーホール
Claims (1)
- マザーボードに実装される一側面の両角部に一対の端子開口部及びこの一対の端子開口部の間に前記一対の端子開口部より大きく円弧状に切り欠いた放熱開口部が形成される矩形状のベース部と、
前記放熱開口部から裏面の一部が露出するようにして前記ベース部に重ねて配置され、表面及び前記裏面に絶縁部を介して一対の電極がそれぞれ形成され、少なくとも裏面に形成される一対の電極が該裏面の縁部に至るまで形成される実装部と、
前記実装部の表面上に配置される発光素子と、
前記実装部を貫通して表面及び裏面に形成されている一対の電極をそれぞれ熱的に接続する金属材料からなる熱伝導体とを備え、
前記実装部の裏面に形成されている前記一対の電極が前記一対の端子開口部からそれぞれ露出すると共に、前記放熱開口部からは前記実装部の裏面に形成されている前記一対の電極の少なくともいずれかが露出し、前記一対の端子開口部及び前記放熱開口部に露出する電極の下端が前記マザーボードに接するように配置されることを特徴とする発光ダイオード。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011175955A JP5937315B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
US13/584,446 US8618573B2 (en) | 2011-08-11 | 2012-08-13 | Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011175955A JP5937315B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013041865A JP2013041865A (ja) | 2013-02-28 |
JP5937315B2 true JP5937315B2 (ja) | 2016-06-22 |
Family
ID=47676975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011175955A Active JP5937315B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
Country Status (2)
Country | Link |
---|---|
US (1) | US8618573B2 (ja) |
JP (1) | JP5937315B2 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6476567B2 (ja) * | 2013-03-29 | 2019-03-06 | 日亜化学工業株式会社 | 発光装置 |
JP6661890B2 (ja) | 2014-05-21 | 2020-03-11 | 日亜化学工業株式会社 | 発光装置 |
JP6504019B2 (ja) * | 2015-10-27 | 2019-04-24 | 豊田合成株式会社 | 発光装置 |
KR102444397B1 (ko) * | 2015-11-26 | 2022-09-19 | 엘지디스플레이 주식회사 | 백라이트 유닛용 광원 장치 |
CN105805576B (zh) * | 2016-05-09 | 2020-10-16 | 泗阳浩轩照明科技有限公司 | 一种智能led面板灯照明装置 |
US10378747B1 (en) * | 2016-09-26 | 2019-08-13 | Ryan Hanslip | Field-configurable LED tape light |
JP6460201B2 (ja) | 2017-04-28 | 2019-01-30 | 日亜化学工業株式会社 | 発光装置 |
CN108807652B (zh) | 2017-04-28 | 2023-03-21 | 日亚化学工业株式会社 | 发光装置 |
JP2019050363A (ja) * | 2017-08-27 | 2019-03-28 | 億光電子工業股▲ふん▼有限公司Everlight Electronics Co.,Ltd. | 半導体パッケージ構造 |
JP6569785B1 (ja) * | 2017-12-22 | 2019-09-04 | 日亜化学工業株式会社 | 発光装置 |
JP7064129B2 (ja) * | 2017-12-22 | 2022-05-10 | 日亜化学工業株式会社 | 発光装置 |
JP6576581B1 (ja) | 2018-03-29 | 2019-09-18 | ルーメンス カンパニー リミテッド | サイドビューledパッケージ及びサイドビューledモジュール |
KR102621850B1 (ko) * | 2018-03-29 | 2024-01-08 | 주식회사 루멘스 | 사이드뷰 엘이디 패키지 및 사이드뷰 엘이디 모듈 |
JP6705479B2 (ja) | 2018-09-12 | 2020-06-03 | 日亜化学工業株式会社 | 光源装置の製造方法 |
CN112331638B (zh) * | 2020-09-28 | 2023-06-06 | 惠州市聚飞光电有限公司 | 发光二极管及背光模组 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3884179B2 (ja) | 1998-04-23 | 2007-02-21 | シャープ株式会社 | 半導体装置及びその製造方法 |
JP2001345485A (ja) * | 2000-06-02 | 2001-12-14 | Toyoda Gosei Co Ltd | 発光装置 |
JP5214128B2 (ja) * | 2005-11-22 | 2013-06-19 | シャープ株式会社 | 発光素子及び発光素子を備えたバックライトユニット |
US8436371B2 (en) * | 2007-05-24 | 2013-05-07 | Cree, Inc. | Microscale optoelectronic device packages |
US7911059B2 (en) * | 2007-06-08 | 2011-03-22 | SeniLEDS Optoelectronics Co., Ltd | High thermal conductivity substrate for a semiconductor device |
JP2009054893A (ja) * | 2007-08-28 | 2009-03-12 | Panasonic Electric Works Co Ltd | 発光装置 |
WO2009128354A1 (ja) * | 2008-04-18 | 2009-10-22 | 旭硝子株式会社 | 発光ダイオードパッケージ |
JP2010021400A (ja) * | 2008-07-11 | 2010-01-28 | Mitsui Mining & Smelting Co Ltd | 放熱特性に優れたプリント配線基板 |
JP2010067902A (ja) * | 2008-09-12 | 2010-03-25 | Toshiba Corp | 発光装置 |
JP2010129834A (ja) * | 2008-11-28 | 2010-06-10 | Sanyo Electric Co Ltd | 光半導体装置およびその実装構造 |
JP2011054736A (ja) * | 2009-09-01 | 2011-03-17 | Sharp Corp | 発光装置、平面光源および液晶表示装置 |
JP5482098B2 (ja) * | 2009-10-26 | 2014-04-23 | 日亜化学工業株式会社 | 発光装置 |
KR20110086648A (ko) * | 2010-01-15 | 2011-07-29 | 엘지이노텍 주식회사 | 발광 모듈, 백라이트 유닛 및 표시 장치 |
EP2346100B1 (en) * | 2010-01-15 | 2019-05-22 | LG Innotek Co., Ltd. | Light emitting apparatus and lighting system |
US7888852B1 (en) * | 2010-02-22 | 2011-02-15 | Wen-Kung Sung | LED heat dissipation structure |
JP2012164774A (ja) * | 2011-02-04 | 2012-08-30 | Nippon Carbide Ind Co Inc | セラミックパッケージの製造方法 |
-
2011
- 2011-08-11 JP JP2011175955A patent/JP5937315B2/ja active Active
-
2012
- 2012-08-13 US US13/584,446 patent/US8618573B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013041865A (ja) | 2013-02-28 |
US8618573B2 (en) | 2013-12-31 |
US20130037847A1 (en) | 2013-02-14 |
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