JP2013041865A - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP2013041865A JP2013041865A JP2011175955A JP2011175955A JP2013041865A JP 2013041865 A JP2013041865 A JP 2013041865A JP 2011175955 A JP2011175955 A JP 2011175955A JP 2011175955 A JP2011175955 A JP 2011175955A JP 2013041865 A JP2013041865 A JP 2013041865A
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- JP
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- Prior art keywords
- electrode
- light emitting
- emitting diode
- substrate
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 239000007769 metal material Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 230000005855 radiation Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】 放熱開口部24が設けられるベース部13、このベース部13上に前記放熱開口部24を塞ぐようにして配置され、第1電極17及び第2電極18が形成される実装部14からなる基板12と、前記第1電極17上に配置される発光素子15とを備え、前記実装部14に設けられる熱伝導部を介して、前記発光素子15から発生する熱を前記放熱開口部24を通して露出する第1電極17から放熱させるようにした。
【選択図】 図1
Description
12 基板
13 ベース部
13a 表面
13b 裏面
13c 下側面
14 実装部
14a 表面
14b 裏面
15 発光素子
16 樹脂体
17 第1電極
18 第2電極
19a,19b 熱伝導体
20 マザーボード
21 表面絶縁部
21a 縁部
21b 仕切部
22 裏面絶縁部
22a 縁部
22b 仕切部
23 端子開口部
24 放熱開口部
25 貫通孔
26 金属材料
27 ボンディングワイヤ
28 ハンダ
31 発光ダイオード
32 基板
33 ベース部
33a 表面
33c 下側面
34 実装部
35 発光素子
36 樹脂体
37 第1電極
38 第2電極
43 端子開口部
44 放熱開口部
45 遮蔽部材
46 遮蔽部材
47 ボンディングワイヤ
48 ハンダ
49 スルーホール
51 発光ダイオード
52 基板
53 ベース部
53c 下側面
54 実装部
55 発光素子
56 樹脂体
57 第1電極
58 第2電極
59 第3電極
63 端子開口部
64 放熱開口部
66 絶縁部
67 ボンディングワイヤ
68 ハンダ
69 スルーホール
Claims (8)
- 放熱用の開口部が設けられるベース部及びこのベース部上に前記放熱用の開口部を塞ぐようにして配置される実装部からなる基板と、
前記実装部上に配置される発光素子とを備え、
前記実装部には前記放熱用の開口部に接続する熱伝導部が設けられていることを特徴とする発光ダイオード。 - 前記実装部が絶縁性基板からなり、この絶縁性基板を貫通するように前記熱伝導部が設けられている請求項1に記載の発光ダイオード。
- 前記絶縁性基板は、表面及び裏面に一対の電極パターンが形成されている請求項1に記載の発光ダイオード。
- 前記熱伝導部は、前記一対の電極パターンが絶縁性基板の表面と裏面とで導通する貫通孔と、この貫通孔内を満たす金属材料によって形成される請求項2に記載の発光ダイオード。
- 前記実装部が導電性基板からなり、この導電性基板を熱伝導部として設けている請求項1に記載の発光ダイオード。
- 前記実装部が導電性のフレキシブル基板からなる請求項1に記載の発光ダイオード。
- 前記放熱用の開口部は、前記ベース部の一側面側を切り欠くようにして形成される請求項1に記載の発光ダイオード。
- 前記基板は、前記発光素子が実装されている側の実装部が発光面となり、前記実装用の開口部が形成されているベース部の側面を介してマザーボード上に実装される請求項1に記載の発光ダイオード。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011175955A JP5937315B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
US13/584,446 US8618573B2 (en) | 2011-08-11 | 2012-08-13 | Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011175955A JP5937315B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013041865A true JP2013041865A (ja) | 2013-02-28 |
JP5937315B2 JP5937315B2 (ja) | 2016-06-22 |
Family
ID=47676975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011175955A Active JP5937315B2 (ja) | 2011-08-11 | 2011-08-11 | 発光ダイオード |
Country Status (2)
Country | Link |
---|---|
US (1) | US8618573B2 (ja) |
JP (1) | JP5937315B2 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014209602A (ja) * | 2013-03-29 | 2014-11-06 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
US9406852B2 (en) | 2014-05-21 | 2016-08-02 | Nichia Corporation | Light emitting device |
KR20170061806A (ko) * | 2015-11-26 | 2017-06-07 | 엘지디스플레이 주식회사 | 백라이트 유닛용 광원 장치 |
EP3396724A1 (en) | 2017-04-28 | 2018-10-31 | Nichia Corporation | Light-emitting device |
JP2019050363A (ja) * | 2017-08-27 | 2019-03-28 | 億光電子工業股▲ふん▼有限公司Everlight Electronics Co.,Ltd. | 半導体パッケージ構造 |
KR20190114726A (ko) * | 2018-03-29 | 2019-10-10 | 주식회사 루멘스 | 사이드뷰 엘이디 패키지 및 사이드뷰 엘이디 모듈 |
JP2019176133A (ja) * | 2018-03-29 | 2019-10-10 | ルーメンス カンパニー リミテッド | サイドビューledパッケージ及びサイドビューledモジュール |
JP2019220694A (ja) * | 2017-12-22 | 2019-12-26 | 日亜化学工業株式会社 | 発光装置 |
KR20200030483A (ko) | 2018-09-12 | 2020-03-20 | 니치아 카가쿠 고교 가부시키가이샤 | 광원 장치의 제조 방법 |
KR20200112782A (ko) | 2017-04-28 | 2020-10-05 | 니치아 카가쿠 고교 가부시키가이샤 | 발광모듈 |
Families Citing this family (5)
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JP6504019B2 (ja) * | 2015-10-27 | 2019-04-24 | 豊田合成株式会社 | 発光装置 |
CN105805576B (zh) * | 2016-05-09 | 2020-10-16 | 泗阳浩轩照明科技有限公司 | 一种智能led面板灯照明装置 |
US10378747B1 (en) * | 2016-09-26 | 2019-08-13 | Ryan Hanslip | Field-configurable LED tape light |
JP7064129B2 (ja) | 2017-12-22 | 2022-05-10 | 日亜化学工業株式会社 | 発光装置 |
CN112331638B (zh) * | 2020-09-28 | 2023-06-06 | 惠州市聚飞光电有限公司 | 发光二极管及背光模组 |
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JP2010129834A (ja) * | 2008-11-28 | 2010-06-10 | Sanyo Electric Co Ltd | 光半導体装置およびその実装構造 |
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JP2011146710A (ja) * | 2010-01-15 | 2011-07-28 | Lg Innotek Co Ltd | 発光モジュール、バックライトユニット、及び表示装置 |
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EP2346100B1 (en) * | 2010-01-15 | 2019-05-22 | LG Innotek Co., Ltd. | Light emitting apparatus and lighting system |
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Cited By (30)
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JP2014209602A (ja) * | 2013-03-29 | 2014-11-06 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
US10559735B2 (en) | 2014-05-21 | 2020-02-11 | Nichia Corporation | Light emitting device having a pair of vias passing through a center of the concave component |
US9406852B2 (en) | 2014-05-21 | 2016-08-02 | Nichia Corporation | Light emitting device |
US9680071B2 (en) | 2014-05-21 | 2017-06-13 | Nichia Corporation | Light emitting device having substrate including heat dissipation terminals |
US9793459B2 (en) | 2014-05-21 | 2017-10-17 | Nichia Corporation | Light emitting device having heat dissipation terminal arranged on substrate |
US9978923B2 (en) | 2014-05-21 | 2018-05-22 | Nichia Corporation | Light emitting device having heat dissipation terminal arranged on substrate |
US10193045B2 (en) | 2014-05-21 | 2019-01-29 | Nichia Corporation | Light emitting device having heat disipation terminal arranged on substrate |
US10892393B2 (en) | 2014-05-21 | 2021-01-12 | Nichia Corporation | Light emitting device having external connection with different width |
US10333043B2 (en) | 2014-05-21 | 2019-06-25 | Nichia Corporation | Light emitting device having element connection sections with convex shapes |
US10734563B2 (en) | 2014-05-21 | 2020-08-04 | Nichia Corporation | Light emitting device having heat dissipation terminal arranged on substrate |
KR20170061806A (ko) * | 2015-11-26 | 2017-06-07 | 엘지디스플레이 주식회사 | 백라이트 유닛용 광원 장치 |
KR102444397B1 (ko) * | 2015-11-26 | 2022-09-19 | 엘지디스플레이 주식회사 | 백라이트 유닛용 광원 장치 |
KR20180121422A (ko) | 2017-04-28 | 2018-11-07 | 니치아 카가쿠 고교 가부시키가이샤 | 발광장치 |
EP3863070A1 (en) | 2017-04-28 | 2021-08-11 | Nichia Corporation | Light-emitting device |
US11652192B2 (en) | 2017-04-28 | 2023-05-16 | Nichia Corporation | Light-emitting device |
EP3396724A1 (en) | 2017-04-28 | 2018-10-31 | Nichia Corporation | Light-emitting device |
US11411144B2 (en) | 2017-04-28 | 2022-08-09 | Nichia Corporation | Light-emitting device |
KR20200112782A (ko) | 2017-04-28 | 2020-10-05 | 니치아 카가쿠 고교 가부시키가이샤 | 발광모듈 |
US11264542B2 (en) | 2017-04-28 | 2022-03-01 | Nichia Corporation | Light-emitting device |
USD930857S1 (en) | 2017-04-28 | 2021-09-14 | Nichia Corporation | Light-emitting unit |
JP2019050363A (ja) * | 2017-08-27 | 2019-03-28 | 億光電子工業股▲ふん▼有限公司Everlight Electronics Co.,Ltd. | 半導体パッケージ構造 |
JP2019220694A (ja) * | 2017-12-22 | 2019-12-26 | 日亜化学工業株式会社 | 発光装置 |
US10847697B2 (en) | 2018-03-29 | 2020-11-24 | Lumens Co., Ltd. | Side view LED package and side view LED module |
KR20190114726A (ko) * | 2018-03-29 | 2019-10-10 | 주식회사 루멘스 | 사이드뷰 엘이디 패키지 및 사이드뷰 엘이디 모듈 |
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KR20210011044A (ko) | 2018-09-12 | 2021-01-29 | 니치아 카가쿠 고교 가부시키가이샤 | 광원 장치의 제조 방법 |
US11171272B2 (en) | 2018-09-12 | 2021-11-09 | Nichia Corporation | Method of producing light source device comprising joining a wiring portion of a light emitting device and a support substrate by a solder member |
KR20200030483A (ko) | 2018-09-12 | 2020-03-20 | 니치아 카가쿠 고교 가부시키가이샤 | 광원 장치의 제조 방법 |
US11799062B2 (en) | 2018-09-12 | 2023-10-24 | Nichia Corporation | Method of producing light source device comprising joining a wiring portion of a light emitting device and a support substrate by a solder member |
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US20130037847A1 (en) | 2013-02-14 |
JP5937315B2 (ja) | 2016-06-22 |
US8618573B2 (en) | 2013-12-31 |
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