JP5770006B2 - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
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- JP5770006B2 JP5770006B2 JP2011091375A JP2011091375A JP5770006B2 JP 5770006 B2 JP5770006 B2 JP 5770006B2 JP 2011091375 A JP2011091375 A JP 2011091375A JP 2011091375 A JP2011091375 A JP 2011091375A JP 5770006 B2 JP5770006 B2 JP 5770006B2
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- 239000004065 semiconductor Substances 0.000 title claims description 23
- 230000017525 heat dissipation Effects 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 230000005855 radiation Effects 0.000 description 37
- 239000000758 substrate Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 10
- 238000007789 sealing Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Description
以下図1〜4で本発明の第1実施形態におけるLED発光装置の構成及びマザー基板への実装状況を説明する。図1示すようにLED発光装置10に含まれる回路基板2の上面側には、2個の電源電極2a、2b、2個の接続電極2e、2f、ビア4a〜d、3個のLED1a、1b、1cがある。ビア4a〜dはそれぞれ電源電極2a、2b、接続電極2e,2fが占める領域内で且つLED1a〜cとは重ならない領域にある。LED1a〜cは回路基板2に対しフリップチップ実装されている。LED1a〜cのP電極は、それぞれ電源電極2a、接続電極2e,2fと接続している。これに対しLED1a〜cのN電極は、それぞれ接続電極2e,2f、電源電極2bと接続している。
LED1aはP電極側から流出する熱を電源電極2a、ビア4a、電源端子電極3aを通して回路基板2の裏面側の電源端子電極3aに伝え、マザー基板(図4参照)側に放出する。N電極側から流出する熱はもともと小さいが、接続電極2e、ビア4c、放熱用電極3cを通して回路基板2の裏面から放出する。同様にLED1bはP電極側から流出する熱を接続電極2e、ビア4c、放熱用電極3cを通して回路基板2の裏面側の放熱用電極3cに伝え、マザー基板側に放出する。LED1bのN電極側から流出する熱は、接続電極2f、ビア4d、放熱用電極3dを通してマザー基板に放熱する。さらにLED1cは、P電極側から流出する熱を接続電極2f、ビア4d、放熱用電極3dを通してマザー基板側に放出する。N電極側から流出する熱は、電源電極2b、ビア4b、電源端子電極3bを通してマザー基板側に放熱する。すなわち、フリップチップ実装したLED1a、1b、1cは、P電極からビア4a,4c,4dを経て回路基板2の裏面側の電極3a、3c、3dに至るまで低い熱抵抗で接続しているため、マザー基板に効率的に放熱できる。
第1実施形態ではLED発光装置10に含まれる複数のLED1a〜cが単純に直列接続していた。しかしながら本発明のLED素子は、複数のLEDの一部が並列接続したLED群を構成し、このLED群同士又は一個のLEDと他のLED群とが接続電極により直列接続してもよい。そこでこの場合に対応するLED発光装置として、図5、図6により本発明の第2実施形態を説明する。図5はLED発光装置20を構成する回路基板22の上面側の平面図、図6は回路基板22の裏面図であり、図1に示すLED発光装置10と基本的構成は同じなので同一部材には同一名称を付し重複する説明は省略する。なお図5は水平方向の中心線(図示せず)について対称になっており、図の上側が図1にほぼ等しい。
第1実施形態におけるLED発光装置10及び第2実施形態におけるLED発光装置20においては、図1及び図5に示すようにビア4a〜d、ビア群24a〜dは平面的にLED1a〜fと重なることがないようにしていた。しかしながらビアの数が多い方が放熱効率が向上するのでビアをLED1a〜fと重なる位置に配置しても良い。そこでこのようなLED発光装置として図7から図9により本発明の第3実施形態を説明する。図7は本発明の第3実施形態におけるLED発光装置30の樹脂封止前の平面図、図8は図7に示す回路基板の裏面図、図9は図7に示す平面図に樹脂封止を行った完成LED発光装置30のA−A断面図である。LED発光装置30の基本的構成は図1から図3に示す第1実施形態におけるLED発光装置10と同じであり、図7から図9においてLED発光装置10と同一部材には同一名称を付し、重複する説明を省略する。
101a、101b、201a、201b、201c LED
2、22、102、202 回路基板
2a、2b、22a、22b 電源電極
102a、102b、202a、202b 電源電極
2e、2f、22e、22f 接続電極
102e、202e、202f 接続電極
3a、3b、23a、23b、203a、203b 電源端子電極
3c、3d 放熱用電極
4a、4b、4c、4d ビア
4a1,4a2、4c1,4c2,4d1,4d2 ビア群
24a、24b、24c、24d ビア群
104、204a、204b サーマルビア
6、106、206 保護樹脂
10、20、30、100、200 LED発光装置
40 マザー基板
40a、40b 電源供給用電極
40c、40d 放熱用ダミー電極
105 ワイヤー
P P電極
N N電極
Claims (1)
- 回路基板上に複数の半導体発光素子をフリプチップ実装し、該複数の半導体発光素子を回路基板上に設けた接続電極により直列接続する半導体発光装置において、前記回路基板は樹脂からなり、前記回路基板の裏面側に放熱用電極を備え、前記接続電極と前記放熱用電極とが導電性を有する複数のビアで接続し、直列接続し隣接する前記半導体発光素子の間に前記ビアが一列で配列され、前記半導体発光素子はN電極とP電極を有し、前記N電極の面積が前記P電極の面積より小さく、前記N電極と前記ビアが平面的に重ならないことを特徴とする半導体発光装置。
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JP2011091375A JP5770006B2 (ja) | 2011-04-15 | 2011-04-15 | 半導体発光装置 |
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JP2011091375A JP5770006B2 (ja) | 2011-04-15 | 2011-04-15 | 半導体発光装置 |
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JP2012227230A JP2012227230A (ja) | 2012-11-15 |
JP5770006B2 true JP5770006B2 (ja) | 2015-08-26 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101804262B1 (ko) * | 2017-07-27 | 2017-12-04 | 주식회사태헌 | 통공형 방열 구조를 갖는 조명 장치 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5986904B2 (ja) * | 2012-11-21 | 2016-09-06 | スタンレー電気株式会社 | 半導体発光素子アレイおよび車両用灯具 |
JP6276557B2 (ja) | 2013-10-25 | 2018-02-07 | シチズン電子株式会社 | Led発光装置 |
JP6273124B2 (ja) | 2013-11-08 | 2018-01-31 | シチズン電子株式会社 | Led照明装置 |
JP7148826B2 (ja) * | 2014-05-21 | 2022-10-06 | 日亜化学工業株式会社 | 発光装置 |
JP6661890B2 (ja) * | 2014-05-21 | 2020-03-11 | 日亜化学工業株式会社 | 発光装置 |
JP6295171B2 (ja) * | 2014-09-16 | 2018-03-14 | アルパッド株式会社 | 発光ユニット及び半導体発光装置 |
US10283688B2 (en) | 2016-08-22 | 2019-05-07 | Nichia Corporation | Light emitting device |
JP6982232B2 (ja) * | 2016-08-22 | 2021-12-17 | 日亜化学工業株式会社 | 発光装置 |
CN110622300B (zh) * | 2017-05-26 | 2024-03-12 | 京瓷株式会社 | 电子部件搭载用基板、电子装置以及电子模块 |
CN107706286B (zh) * | 2017-09-27 | 2019-10-11 | 开发晶照明(厦门)有限公司 | Led发光装置和led支架 |
JP6633111B2 (ja) * | 2018-02-19 | 2020-01-22 | アルパッド株式会社 | 発光ユニット及び半導体発光装置 |
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JP4438492B2 (ja) * | 2003-09-11 | 2010-03-24 | 日亜化学工業株式会社 | 半導体装置およびその製造方法 |
JP4856463B2 (ja) * | 2005-10-17 | 2012-01-18 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
JP2007123437A (ja) * | 2005-10-26 | 2007-05-17 | Toyoda Gosei Co Ltd | 蛍光体板及びこれを備えた発光装置 |
WO2008136230A1 (ja) * | 2007-04-26 | 2008-11-13 | Kyocera Corporation | 発光装置 |
JP4999551B2 (ja) * | 2007-05-24 | 2012-08-15 | 株式会社小糸製作所 | 発光素子モジュール |
JP5251038B2 (ja) * | 2007-08-23 | 2013-07-31 | 豊田合成株式会社 | 発光装置 |
US8058669B2 (en) * | 2008-08-28 | 2011-11-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light-emitting diode integration scheme |
JP2010120260A (ja) * | 2008-11-19 | 2010-06-03 | Cp Toms:Kk | 金型用原型、金型の製造方法および造形型 |
JP2010283253A (ja) * | 2009-06-08 | 2010-12-16 | Hitachi Kyowa Engineering Co Ltd | 発光装置及び発光装置用基板 |
JP5426481B2 (ja) * | 2010-05-26 | 2014-02-26 | 株式会社東芝 | 発光装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101804262B1 (ko) * | 2017-07-27 | 2017-12-04 | 주식회사태헌 | 통공형 방열 구조를 갖는 조명 장치 |
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