RU2012106650A - Формуемые в расплаве стекла, содержащие диоксид кремния и натрий - Google Patents

Формуемые в расплаве стекла, содержащие диоксид кремния и натрий Download PDF

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RU2012106650A
RU2012106650A RU2012106650/03A RU2012106650A RU2012106650A RU 2012106650 A RU2012106650 A RU 2012106650A RU 2012106650/03 A RU2012106650/03 A RU 2012106650/03A RU 2012106650 A RU2012106650 A RU 2012106650A RU 2012106650 A RU2012106650 A RU 2012106650A
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Брюс Г. ЭЙТКЕН
Джеймс Е. мл. ДИКИНСОН
Тимоти Дж. КИЧЕНСКИ
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Корнинг Инкорпорейтед
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Abstract

1. Стекло, содержащее, мас.%:50-72% SiO;от более чем 15 до 25% AlO;0-10% BO;10-25% суммарного MO; иот более чем 0 до 25% суммарного RO;где M является щелочным металлом, выбранным из Na, K, Li, Rb и Cs, и где стекло содержит, по меньшей мере, 9 мас.% NaO, и где R является щелочноземельным металлом, выбранным из Mg, Ca, Ba и Sr.2. Стекло по п.1, где стекло содержит менее чем 2,5 мас.% MgO.3. Стекло по п.2, где стекло содержит менее чем 4 мас.% KO.4. Стекло по п.2, где стекло имеет температуру деформации 535°C или более, коэффициент термического расширения 50·10или более, и вязкость при температуре ликвидуса 130000 П или более.5. Стекло по п.4, где стекло содержит менее чем 4 мас.% KO.6. Стекло по п.1, где стекло содержит менее чем 4 мас.% KO.7. Стекло по п.1, где стекло содержит от 0,5 до менее чем 14 мас.% RO.8. Стекло по п.7, где стекло содержит менее чем 2,5 мас.% MgO.9. Стекло по п.8, где стекло содержит менее чем 4 мас.% KO.10. Стекло по п.8, где стекло имеет температуру деформации 535°C или более, коэффициент термического расширения 50·10или более, и вязкость при температуре ликвидуса 130000 П или более.11. Стекло по п.10, где стекло содержит менее чем 4 мас.% KO.12. Стекло, содержащее, мас.%:50-72 SiO;10-25 AlO;0-10 BO;10-25 суммарного MO; иот 0,5 и до менее чем 14 RO;где M является щелочным металлом, выбранным из Na, K, Li, Rb и Cs, и где стекло содержит, по меньшей мере, 9 мас.% NaO, и где R является щелочноземельным металлом, выбранным из Mg, Ca, Ba и Sr.13. Стекло по п.12, где стекло содержит менее чем 2,5 мас.% MgO.14. Фотоэлектрическое устройство, содержащее стекло, содержащее, мас.%:50-72% SiO;10-25% AlO;0-10% BO;10-25% суммарного MO; иот более чем 0 до 25% суммарного RO;где M является щелочным металлом, выбранным из Na, K, Li, Rb и Cs, и где стекло содержит, по меньшей мере, 9 мас.% NaO, и где R является щелочнозе�

Claims (25)

1. Стекло, содержащее, мас.%:
50-72% SiO2;
от более чем 15 до 25% Al2O3;
0-10% B2O3;
10-25% суммарного M2O; и
от более чем 0 до 25% суммарного RO;
где M является щелочным металлом, выбранным из Na, K, Li, Rb и Cs, и где стекло содержит, по меньшей мере, 9 мас.% Na2O, и где R является щелочноземельным металлом, выбранным из Mg, Ca, Ba и Sr.
2. Стекло по п.1, где стекло содержит менее чем 2,5 мас.% MgO.
3. Стекло по п.2, где стекло содержит менее чем 4 мас.% K2O.
4. Стекло по п.2, где стекло имеет температуру деформации 535°C или более, коэффициент термического расширения 50·10-7 или более, и вязкость при температуре ликвидуса 130000 П или более.
5. Стекло по п.4, где стекло содержит менее чем 4 мас.% K2O.
6. Стекло по п.1, где стекло содержит менее чем 4 мас.% K2O.
7. Стекло по п.1, где стекло содержит от 0,5 до менее чем 14 мас.% RO.
8. Стекло по п.7, где стекло содержит менее чем 2,5 мас.% MgO.
9. Стекло по п.8, где стекло содержит менее чем 4 мас.% K2O.
10. Стекло по п.8, где стекло имеет температуру деформации 535°C или более, коэффициент термического расширения 50·10-7 или более, и вязкость при температуре ликвидуса 130000 П или более.
11. Стекло по п.10, где стекло содержит менее чем 4 мас.% K2O.
12. Стекло, содержащее, мас.%:
50-72 SiO2;
10-25 Al2O3;
0-10 B2O3;
10-25 суммарного M2O; и
от 0,5 и до менее чем 14 RO;
где M является щелочным металлом, выбранным из Na, K, Li, Rb и Cs, и где стекло содержит, по меньшей мере, 9 мас.% Na2O, и где R является щелочноземельным металлом, выбранным из Mg, Ca, Ba и Sr.
13. Стекло по п.12, где стекло содержит менее чем 2,5 мас.% MgO.
14. Фотоэлектрическое устройство, содержащее стекло, содержащее, мас.%:
50-72% SiO2;
10-25% Al2O3;
0-10% B2O3;
10-25% суммарного M2O; и
от более чем 0 до 25% суммарного RO;
где M является щелочным металлом, выбранным из Na, K, Li, Rb и Cs, и где стекло содержит, по меньшей мере, 9 мас.% Na2O, и где R является щелочноземельным металлом, выбранным из Mg, Ca, Ba и Sr.
15. Фотоэлектрическое устройство по п.14, в котором стекло имеет температуру деформации 535°C или более, коэффициент термического расширения 50·10-7 или более, и вязкость при температуре ликвидуса 130000 П или более.
16. Фотоэлектрическое устройство по п.14, в котором стекло содержит от более чем 15 до 25 мас.% Al2O3.
17. Фотоэлектрическое устройство по п.14, в котором стекло содержит 55-72 мас.% SiO2.
18. Фотоэлектрическое устройство по п.17, в котором стекло содержит от более чем 15 до 25 мас.% Al2O3.
19. Фотоэлектрическое устройство по п.14, в котором стекло содержит 9-17 мас.% Na2O.
20. Фотоэлектрическое устройство по п.14, в котором стекло содержит от 0,5 до менее чем 14 мас.% RO.
21. Фотоэлектрическое устройство по п.14, в котором стекло содержит от более чем 15 до 25 мас.% Al2O3, и содержащее от 0,5 до менее 14 мас.% RO.
22. Фотоэлектрическое устройство по п.14, в котором стекло находится в виде тонкого листа.
23. Фотоэлектрическое устройство по п.22, в котором стекло находится в виде тонкого листа и является подложкой или вышележащим слоем.
24. Фотоэлектрическое устройство по п.23, содержащее активную фотоэлектрическую среду, содержащую диселенид галлия-индия-меди или теллурид кадмия, прилегающую к подложке или вышележащему слою.
25. Фотоэлектрическое устройство по п.24, содержащее запирающий слой между активной фотоэлектрической средой и подложкой или вышележащим слоем.
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CA2769014A1 (en) 2011-01-27
KR20120049296A (ko) 2012-05-16
JP5686801B2 (ja) 2015-03-18
WO2011011667A1 (en) 2011-01-27
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IN2012DN00690A (ru) 2015-06-19
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US20140150867A1 (en) 2014-06-05
US20110017297A1 (en) 2011-01-27
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JP6193280B2 (ja) 2017-09-06
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CN107285624A (zh) 2017-10-24
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