NO310627B1 - Fremgangsmåte for katalysering ved strömfri utfelning av metaller på overflaten av et ikke-ledende materiale - Google Patents
Fremgangsmåte for katalysering ved strömfri utfelning av metaller på overflaten av et ikke-ledende materiale Download PDFInfo
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- NO310627B1 NO310627B1 NO19950563A NO950563A NO310627B1 NO 310627 B1 NO310627 B1 NO 310627B1 NO 19950563 A NO19950563 A NO 19950563A NO 950563 A NO950563 A NO 950563A NO 310627 B1 NO310627 B1 NO 310627B1
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Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/22—Roughening, e.g. by etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
- F02B75/00—Other engines
- F02B75/02—Engines characterised by their cycles, e.g. six-stroke
- F02B2075/022—Engines characterised by their cycles, e.g. six-stroke having less than six strokes per cycle
- F02B2075/027—Engines characterised by their cycles, e.g. six-stroke having less than six strokes per cycle four
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Conductive Materials (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33109794A JP3022226B2 (ja) | 1994-12-08 | 1994-12-08 | 無電解めっき法における触媒化方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO950563D0 NO950563D0 (no) | 1995-02-15 |
| NO950563L NO950563L (no) | 1996-06-10 |
| NO310627B1 true NO310627B1 (no) | 2001-07-30 |
Family
ID=18239827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO19950563A NO310627B1 (no) | 1994-12-08 | 1995-02-15 | Fremgangsmåte for katalysering ved strömfri utfelning av metaller på overflaten av et ikke-ledende materiale |
Country Status (19)
| Country | Link |
|---|---|
| US (1) | US5660883A (ko) |
| JP (1) | JP3022226B2 (ko) |
| KR (1) | KR960023235A (ko) |
| CN (1) | CN1124301A (ko) |
| AU (1) | AU699029B2 (ko) |
| BE (1) | BE1008679A3 (ko) |
| CA (1) | CA2142683C (ko) |
| CH (1) | CH689394A5 (ko) |
| DE (1) | DE19506551C2 (ko) |
| DK (1) | DK172134B1 (ko) |
| FI (1) | FI950446A (ko) |
| FR (1) | FR2727984B1 (ko) |
| GB (1) | GB9502096D0 (ko) |
| IT (1) | IT1281942B1 (ko) |
| NL (1) | NL9500293A (ko) |
| NO (1) | NO310627B1 (ko) |
| RU (1) | RU2126459C1 (ko) |
| SE (1) | SE514289C2 (ko) |
| TW (1) | TW254971B (ko) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6046107A (en) * | 1998-12-17 | 2000-04-04 | Industrial Technology Research Institute | Electroless copper employing hypophosphite as a reducing agent |
| US6703186B1 (en) | 1999-08-11 | 2004-03-09 | Mitsuboshi Belting Ltd. | Method of forming a conductive pattern on a circuit board |
| JP2001236885A (ja) * | 2000-02-22 | 2001-08-31 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネルおよびその製造方法 |
| JP4897165B2 (ja) * | 2000-09-27 | 2012-03-14 | 名古屋メッキ工業株式会社 | 金属めっきされた有機高分子繊維の製造方法 |
| JP2002348673A (ja) * | 2001-05-24 | 2002-12-04 | Learonal Japan Inc | ホルムアルデヒドを使用しない無電解銅めっき方法および該方法に使用される無電解銅めっき液 |
| US7223694B2 (en) * | 2003-06-10 | 2007-05-29 | Intel Corporation | Method for improving selectivity of electroless metal deposition |
| US7049234B2 (en) * | 2003-12-22 | 2006-05-23 | Intel Corporation | Multiple stage electroless deposition of a metal layer |
| JP2005243499A (ja) * | 2004-02-27 | 2005-09-08 | Fujitsu Ltd | フラットディスプレイパネルの電極形成方法 |
| US7732330B2 (en) | 2005-06-30 | 2010-06-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method using an ink-jet method of the same |
| CN101319315A (zh) * | 2008-07-03 | 2008-12-10 | 东华大学 | 一种基于分子自组装技术的柔性基材化学镀前活化方法 |
| CN102414874A (zh) * | 2009-04-13 | 2012-04-11 | 应用材料公司 | 含有金属化碳纳米管和纳米纤维的复合材料 |
| JP5663886B2 (ja) * | 2010-02-08 | 2015-02-04 | 三菱電機株式会社 | 半導体装置の製造方法 |
| US20110303644A1 (en) * | 2010-06-09 | 2011-12-15 | Arlington Plating Company | Methods for Plating Plastic Articles |
| JP6448191B2 (ja) * | 2010-09-13 | 2019-01-09 | ヒェメタル ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｈｅｍｅｔａｌｌ ＧｍｂＨ | 表面をコーティングする方法と、この方法でコーティングされた対象物の使用 |
| EP2695581B1 (en) | 2012-08-07 | 2019-03-13 | Critical Innovations, LLC | Device for simultaneously documenting and treating tension pneumothorax and/or hemothorax |
| CN103114437B (zh) * | 2013-02-01 | 2014-11-05 | 东华大学 | 一种纺织品表面无钯化学镀金属镍的方法 |
| US10046147B2 (en) | 2013-12-26 | 2018-08-14 | Critical Innovations, LLC | Percutaneous access pathway system and method |
| CN103805971B (zh) * | 2014-03-11 | 2017-02-15 | 东华大学 | 一种镍盐活化化学镀铜纺织品的方法 |
| CN104372313B (zh) * | 2014-09-29 | 2018-07-13 | 安科智慧城市技术（中国）有限公司 | 一种薄膜太阳能电池背电极的制备方法及薄膜太阳能电池 |
| DE102015201562A1 (de) * | 2015-01-29 | 2016-08-04 | Helmholtz-Zentrum Dresden - Rossendorf E.V. | Verfahren zur Metallisierung von Kunststoffteilen sowie Lösung |
| CN105821396A (zh) * | 2016-03-27 | 2016-08-03 | 华南理工大学 | 一种无钯化学镀铜的方法 |
| US10814119B2 (en) | 2017-09-22 | 2020-10-27 | Critical Innovations, LLC | Percutaneous access pathway system |
| CN110093596A (zh) * | 2019-04-24 | 2019-08-06 | 南昌大学 | 一种自动脱落的超薄铜箔的制备方法 |
| CN112063998B (zh) * | 2020-08-28 | 2022-10-11 | 南昌大学 | 一种超薄铜/石墨烯复合箔的制备方法 |
| CN112522687A (zh) * | 2020-11-02 | 2021-03-19 | 深圳市先进连接科技有限公司 | 树脂表面改性溶液和化学镀银方法 |
| CN112979344B (zh) * | 2021-03-16 | 2022-04-08 | 河海大学 | 基于化学镀法在混凝土表面制备的抗菌保护层及制备方法 |
| EP4321116A3 (en) | 2022-08-11 | 2024-05-08 | Critical Innovations, LLC | Percutaneous access pathway system |
| CN116782516B (zh) * | 2023-07-13 | 2024-01-23 | 南华大学 | 一种基于均相离子型催化油墨制备铜印刷电路的普适工艺 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6036668A (ja) * | 1983-08-08 | 1985-02-25 | Hitachi Chem Co Ltd | 無電解銅めつき用触媒 |
| US4670306A (en) * | 1983-09-15 | 1987-06-02 | Seleco, Inc. | Method for treatment of surfaces for electroless plating |
| US4663240A (en) * | 1984-11-06 | 1987-05-05 | Enthone, Incorporated | RFI shielded plastic articles and process for making same |
| US5338822A (en) * | 1992-10-02 | 1994-08-16 | Cargill, Incorporated | Melt-stable lactide polymer composition and process for manufacture thereof |
| US5336415A (en) * | 1993-02-10 | 1994-08-09 | Vanson L.P. | Removing polyvalent metals from aqueous waste streams with chitosan and halogenating agents |
| DE69423257T2 (de) * | 1993-05-28 | 2000-07-06 | Matsushita Electric Industrial Co., Ltd. | Denitrierungssystem |
-
1994
- 1994-12-08 JP JP33109794A patent/JP3022226B2/ja not_active Expired - Fee Related
- 1994-12-19 TW TW83111861A patent/TW254971B/zh active
-
1995
- 1995-01-16 KR KR1019950000598A patent/KR960023235A/ko not_active Application Discontinuation
- 1995-01-17 CN CN95101769A patent/CN1124301A/zh active Pending
- 1995-02-01 FI FI950446A patent/FI950446A/fi unknown
- 1995-02-02 GB GB9502096A patent/GB9502096D0/en active Pending
- 1995-02-07 RU RU95101851A patent/RU2126459C1/ru active
- 1995-02-13 CH CH00417/95A patent/CH689394A5/fr not_active IP Right Cessation
- 1995-02-15 NO NO19950563A patent/NO310627B1/no not_active IP Right Cessation
- 1995-02-16 SE SE9500571A patent/SE514289C2/sv not_active IP Right Cessation
- 1995-02-16 NL NL9500293A patent/NL9500293A/nl not_active Application Discontinuation
- 1995-02-16 CA CA 2142683 patent/CA2142683C/en not_active Expired - Fee Related
- 1995-02-17 DK DK017895A patent/DK172134B1/da not_active IP Right Cessation
- 1995-02-21 FR FR9501991A patent/FR2727984B1/fr not_active Expired - Fee Related
- 1995-02-23 IT IT95RM000110 patent/IT1281942B1/it active IP Right Grant
- 1995-02-24 AU AU13581/95A patent/AU699029B2/en not_active Ceased
- 1995-02-24 DE DE19506551A patent/DE19506551C2/de not_active Expired - Fee Related
- 1995-03-14 US US08/404,155 patent/US5660883A/en not_active Expired - Fee Related
- 1995-06-13 BE BE9500525A patent/BE1008679A3/fr not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| RU95101851A (ru) | 1996-11-20 |
| DK17895A (da) | 1996-06-09 |
| FI950446A (fi) | 1996-06-09 |
| ITRM950110A0 (it) | 1995-02-23 |
| IT1281942B1 (it) | 1998-03-03 |
| GB9502096D0 (en) | 1995-03-22 |
| JP3022226B2 (ja) | 2000-03-15 |
| NO950563D0 (no) | 1995-02-15 |
| ITRM950110A1 (it) | 1996-08-23 |
| KR960023235A (ko) | 1996-07-18 |
| SE514289C2 (sv) | 2001-02-05 |
| AU699029B2 (en) | 1998-11-19 |
| CH689394A5 (fr) | 1999-03-31 |
| BE1008679A3 (fr) | 1996-07-02 |
| CA2142683A1 (en) | 1996-06-09 |
| RU2126459C1 (ru) | 1999-02-20 |
| JPH08158057A (ja) | 1996-06-18 |
| DK172134B1 (da) | 1997-11-24 |
| US5660883A (en) | 1997-08-26 |
| SE9500571L (sv) | 1996-06-09 |
| TW254971B (en) | 1995-08-21 |
| DE19506551A1 (de) | 1996-06-13 |
| DE19506551C2 (de) | 2001-05-31 |
| CA2142683C (en) | 2000-07-18 |
| CN1124301A (zh) | 1996-06-12 |
| AU1358195A (en) | 1996-06-13 |
| SE9500571D0 (sv) | 1995-02-16 |
| FI950446A0 (fi) | 1995-02-01 |
| FR2727984A1 (fr) | 1996-06-14 |
| FR2727984B1 (fr) | 1997-12-12 |
| NO950563L (no) | 1996-06-10 |
| NL9500293A (nl) | 1996-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM1K | Lapsed by not paying the annual fees |
Free format text: LAPSED IN AUGUST 2002 |