KR960023235A - 무전해 도금법에서의 촉매화 방법 - Google Patents

무전해 도금법에서의 촉매화 방법 Download PDF

Info

Publication number
KR960023235A
KR960023235A KR1019950000598A KR19950000598A KR960023235A KR 960023235 A KR960023235 A KR 960023235A KR 1019950000598 A KR1019950000598 A KR 1019950000598A KR 19950000598 A KR19950000598 A KR 19950000598A KR 960023235 A KR960023235 A KR 960023235A
Authority
KR
South Korea
Prior art keywords
electroless plating
chitosan
catalyst
plating layer
catalysis
Prior art date
Application number
KR1019950000598A
Other languages
English (en)
Inventor
요시히코 오무라
Original Assignee
쓰보이 세이치로
다이신카가쿠 가부시키가이샤
요시히코 오무라
오무라도료 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰보이 세이치로, 다이신카가쿠 가부시키가이샤, 요시히코 오무라, 오무라도료 가부시키가이샤 filed Critical 쓰보이 세이치로
Publication of KR960023235A publication Critical patent/KR960023235A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
    • F02B75/00—Other engines
    • F02B75/02—Engines characterised by their cycles, e.g. six-stroke
    • F02B2075/022—Engines characterised by their cycles, e.g. six-stroke having less than six strokes per cycle
    • F02B2075/027—Engines characterised by their cycles, e.g. six-stroke having less than six strokes per cycle four
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Abstract

본 발명은 증감화-활성화법이나 촉매 촉진법에 따르지 않으며, 무전해 도금법에서 도금층 및 피도금층의 밀착 강도에 관여하는 촉매 금속의 포착을 목적으로 한다.
비전기전도성 물질의 표면에 무전해 도금층을 형성시킬 때에 촉매의 제공 및 무전해 도금 각 공정에 앞서, 비전기전도성 물질의 표면에 적어도 키토산 또는 키토산 유도체를 함유하는 처리액을 도포하여 표면에 친수성 피막을 형성시키고, 이와 같이 수득된 친수성 피막은 키토산이 팔라듐 등의 촉매 금속을 화학적으로 흡착 포착하여 고정화시킨다. 그 결과, 무전해 도금 공정에서 피도금재 표면에 충분한 양의 활성 촉매가 담지된 상태를 얻을 수 있는 이외에, 밀착성이 양호한 무전해 도금층을 균일한 상태에서 효율적으로 형성시킨다.

Description

무전해 도금법에서의 촉매화 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 촉매화가 증감화-활성화 방식인 종래의 무전해 도금 공정이며, 제4도는 키토산을 사용하는 팔라듐의 흡착 메커니즘이다.

Claims (4)

  1. 키토산 또는 키토산 유도체를 함유하는 피막을 비전기전도성 물질의 표면에 형성시킨 다음, 촉매 금속염 용액으로 처리하여 촉매 금속을 화학 흡착시킴을 특징으로 하는 무전해 도금법에서의 촉매화 방법.
  2. 제1항에 있어서, 키토산 또는 키토산 유도체를 함유하는 피막이 수지를 함유하는 무전해 도금법에서의 촉매화 방법.
  3. 제1항 또는 제2항에 있어서, 키토산 또는 키토산 유도체를 함유하는 피막이 무기 안료를 함유하는 무전해 도금법에서의 촉매화 방법.
  4. 제1항 내지 제3항 중의 어느 한 항에 있어서, 촉매 금속염이 귀금속염인 무전해 도금법에서의 촉매화 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950000598A 1994-12-08 1995-01-16 무전해 도금법에서의 촉매화 방법 KR960023235A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33109794A JP3022226B2 (ja) 1994-12-08 1994-12-08 無電解めっき法における触媒化方法
JP94-331097 1994-12-08

Publications (1)

Publication Number Publication Date
KR960023235A true KR960023235A (ko) 1996-07-18

Family

ID=18239827

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950000598A KR960023235A (ko) 1994-12-08 1995-01-16 무전해 도금법에서의 촉매화 방법

Country Status (19)

Country Link
US (1) US5660883A (ko)
JP (1) JP3022226B2 (ko)
KR (1) KR960023235A (ko)
CN (1) CN1124301A (ko)
AU (1) AU699029B2 (ko)
BE (1) BE1008679A3 (ko)
CA (1) CA2142683C (ko)
CH (1) CH689394A5 (ko)
DE (1) DE19506551C2 (ko)
DK (1) DK172134B1 (ko)
FI (1) FI950446A (ko)
FR (1) FR2727984B1 (ko)
GB (1) GB9502096D0 (ko)
IT (1) IT1281942B1 (ko)
NL (1) NL9500293A (ko)
NO (1) NO310627B1 (ko)
RU (1) RU2126459C1 (ko)
SE (1) SE514289C2 (ko)
TW (1) TW254971B (ko)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046107A (en) * 1998-12-17 2000-04-04 Industrial Technology Research Institute Electroless copper employing hypophosphite as a reducing agent
US6703186B1 (en) 1999-08-11 2004-03-09 Mitsuboshi Belting Ltd. Method of forming a conductive pattern on a circuit board
JP2001236885A (ja) * 2000-02-22 2001-08-31 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルおよびその製造方法
JP4897165B2 (ja) * 2000-09-27 2012-03-14 名古屋メッキ工業株式会社 金属めっきされた有機高分子繊維の製造方法
JP2002348673A (ja) * 2001-05-24 2002-12-04 Learonal Japan Inc ホルムアルデヒドを使用しない無電解銅めっき方法および該方法に使用される無電解銅めっき液
US7223694B2 (en) * 2003-06-10 2007-05-29 Intel Corporation Method for improving selectivity of electroless metal deposition
US7049234B2 (en) * 2003-12-22 2006-05-23 Intel Corporation Multiple stage electroless deposition of a metal layer
JP2005243499A (ja) * 2004-02-27 2005-09-08 Fujitsu Ltd フラットディスプレイパネルの電極形成方法
US7732330B2 (en) 2005-06-30 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using an ink-jet method of the same
CN101319315A (zh) * 2008-07-03 2008-12-10 东华大学 一种基于分子自组装技术的柔性基材化学镀前活化方法
US20100261058A1 (en) * 2009-04-13 2010-10-14 Applied Materials, Inc. Composite materials containing metallized carbon nanotubes and nanofibers
JP5663886B2 (ja) * 2010-02-08 2015-02-04 三菱電機株式会社 半導体装置の製造方法
US20110303644A1 (en) * 2010-06-09 2011-12-15 Arlington Plating Company Methods for Plating Plastic Articles
ES2710856T3 (es) * 2010-09-13 2019-04-29 Chemetall Gmbh Procedimiento para recubrimiento de superficies y uso de los objetos recubiertos según este procedimiento
EP2695581B1 (en) 2012-08-07 2019-03-13 Critical Innovations, LLC Device for simultaneously documenting and treating tension pneumothorax and/or hemothorax
CN103114437B (zh) * 2013-02-01 2014-11-05 东华大学 一种纺织品表面无钯化学镀金属镍的方法
US10046147B2 (en) 2013-12-26 2018-08-14 Critical Innovations, LLC Percutaneous access pathway system and method
CN103805971B (zh) * 2014-03-11 2017-02-15 东华大学 一种镍盐活化化学镀铜纺织品的方法
CN104372313B (zh) * 2014-09-29 2018-07-13 安科智慧城市技术（中国）有限公司 一种薄膜太阳能电池背电极的制备方法及薄膜太阳能电池
DE102015201562A1 (de) * 2015-01-29 2016-08-04 Helmholtz-Zentrum Dresden - Rossendorf E.V. Verfahren zur Metallisierung von Kunststoffteilen sowie Lösung
CN105821396A (zh) * 2016-03-27 2016-08-03 华南理工大学 一种无钯化学镀铜的方法
US10814119B2 (en) 2017-09-22 2020-10-27 Critical Innovations, LLC Percutaneous access pathway system
CN110093596A (zh) * 2019-04-24 2019-08-06 南昌大学 一种自动脱落的超薄铜箔的制备方法
CN112063998B (zh) * 2020-08-28 2022-10-11 南昌大学 一种超薄铜/石墨烯复合箔的制备方法
CN112522687A (zh) * 2020-11-02 2021-03-19 深圳市先进连接科技有限公司 树脂表面改性溶液和化学镀银方法
CN112979344B (zh) * 2021-03-16 2022-04-08 河海大学 基于化学镀法在混凝土表面制备的抗菌保护层及制备方法
EP4321116A3 (en) 2022-08-11 2024-05-08 Critical Innovations, LLC Percutaneous access pathway system
CN116782516B (zh) * 2023-07-13 2024-01-23 南华大学 一种基于均相离子型催化油墨制备铜印刷电路的普适工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6036668A (ja) * 1983-08-08 1985-02-25 Hitachi Chem Co Ltd 無電解銅めつき用触媒
US4670306A (en) * 1983-09-15 1987-06-02 Seleco, Inc. Method for treatment of surfaces for electroless plating
US4663240A (en) * 1984-11-06 1987-05-05 Enthone, Incorporated RFI shielded plastic articles and process for making same
US5338822A (en) * 1992-10-02 1994-08-16 Cargill, Incorporated Melt-stable lactide polymer composition and process for manufacture thereof
US5336415A (en) * 1993-02-10 1994-08-09 Vanson L.P. Removing polyvalent metals from aqueous waste streams with chitosan and halogenating agents
EP0627253B1 (en) * 1993-05-28 2000-03-08 Matsushita Electric Industrial Co., Ltd. Denitrification system

Also Published As

Publication number Publication date
CN1124301A (zh) 1996-06-12
DK172134B1 (da) 1997-11-24
TW254971B (en) 1995-08-21
IT1281942B1 (it) 1998-03-03
RU2126459C1 (ru) 1999-02-20
AU699029B2 (en) 1998-11-19
DK17895A (da) 1996-06-09
CA2142683A1 (en) 1996-06-09
NO950563D0 (no) 1995-02-15
NO310627B1 (no) 2001-07-30
FI950446A (fi) 1996-06-09
RU95101851A (ru) 1996-11-20
FI950446A0 (fi) 1995-02-01
FR2727984A1 (fr) 1996-06-14
CA2142683C (en) 2000-07-18
GB9502096D0 (en) 1995-03-22
BE1008679A3 (fr) 1996-07-02
US5660883A (en) 1997-08-26
SE9500571D0 (sv) 1995-02-16
FR2727984B1 (fr) 1997-12-12
CH689394A5 (fr) 1999-03-31
ITRM950110A0 (it) 1995-02-23
SE514289C2 (sv) 2001-02-05
NL9500293A (nl) 1996-07-01
ITRM950110A1 (it) 1996-08-23
JP3022226B2 (ja) 2000-03-15
AU1358195A (en) 1996-06-13
DE19506551C2 (de) 2001-05-31
DE19506551A1 (de) 1996-06-13
NO950563L (no) 1996-06-10
JPH08158057A (ja) 1996-06-18
SE9500571L (sv) 1996-06-09

Similar Documents

Publication Publication Date Title
KR960023235A (ko) 무전해 도금법에서의 촉매화 방법
FR2371241A1 (fr) Procede perfectionne pour l'application de revetements a couches multiples sur des supports
KR920006027A (ko) 촉매체 및 촉매체의 제조 방법
DE3872791T2 (de) Verfahren zur reduktion eines raffinierungskatalysators vor seiner anwendung.
JPH0686666B2 (ja) 化学メッキ用増感活性剤
DE69810135T2 (de) Hydrophilierte materialien und verfahren zu dessen herstellung
KR890014421A (ko) 페놀류 및/또는 시클로헥사논류의 제조방법
KR900018321A (ko) 액체 유기수소폴리실록산을 함유하는 가교결합 가능한 감압성 접착제
JPWO2008132926A1 (ja) エッチング液およびこれを用いたプラスチック表面の金属化方法
KR880010083A (ko) 전분 접착제를 이용한 방수 처리 방법
CA2320191A1 (en) Coating liquid containing organic coloring matter for photocatalyst film
ATE344101T1 (de) Verfahren zur herstellung von trägerkatalysatoren durch stromlose metallabscheidung
DE69109587D1 (de) Verfahren zur Aktivierung der Oberfläche von Schwermetallkarbiden mit erhöhter spezifizischer Oberfläche für katalytische Reaktionen.
CA2029090A1 (en) Electroless copper plating process and apparatus
BR0015179A (pt) Catalisador constituido de paládio metálico e ouro metálico que são úteis para a produção de acetato de vinila pela reação de etileno, oxigênio e ácido acético
KR930000147A (ko) 필터재의 제조 방법
EP0272420A3 (en) Photopatterned aromatic polymeric substrates, method for making same and use
KR900018410A (ko) 무전해 도금 방법
US6541080B1 (en) Double-dip Pd/Sn crosslinker
KR900014628A (ko) 기재상에서 기능성 패턴 라인간에 금속 침착물을 도금하는 방법
DE69009514T2 (de) Überzugsmittel mit hohem Feststoffanteil, damit beschichtete Gegenstände und Überzugsverfahren hierfür.
TH8310B (th) "ขบวนการสำหรับการแคทไลซ์เซชั่นในการชุบแบบไม่ใช้ไฟฟ้า"
TH19391A (th) "ขบวนการสำหรับการแคทไลซ์เซชั่นในการชุบแบบไม่ใช้ไฟฟ้า"
KR880008857A (ko) 용접 스패터 피복부재의 표면처리방법
KR850006673A (ko) 악세서리용 비드(bead)의 도장방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application