KR900018410A - 무전해 도금 방법 - Google Patents

무전해 도금 방법 Download PDF

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Publication number
KR900018410A
KR900018410A KR1019900006555A KR900006555A KR900018410A KR 900018410 A KR900018410 A KR 900018410A KR 1019900006555 A KR1019900006555 A KR 1019900006555A KR 900006555 A KR900006555 A KR 900006555A KR 900018410 A KR900018410 A KR 900018410A
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KR
South Korea
Prior art keywords
acid
aqueous solution
plated
mol
concentration
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KR1019900006555A
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English (en)
Other versions
KR930007387B1 (ko
Inventor
아끼시 나까소
가오루 오기누마
다께시 시마자끼
아끼오 다까하시
Original Assignee
원본미기재
히다찌가세이고오교 가부시끼가이샤
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Publication of KR900018410A publication Critical patent/KR900018410A/ko
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Publication of KR930007387B1 publication Critical patent/KR930007387B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

내용 없음

Description

무전해 도금 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (13)

  1. 절연재와 여기에 부착된 금속층 또는 금속 호일을 포함하는 도금할 재료의 표면을 콘디셔닝하고, 얻어진 재료를 무전해도금용 촉매 수용액과 접촉시키고, 얻어진 재료에, 황산과 염화제 1구리 및, 필요하다면, 유기산을 함유한 수용액을 사용하여 수행하는, 활성촉진처리를 행한 다음, 무전해도금을 수행함을 특징으로 하는 무전해 도금방법.
  2. 제1항에 있어서, 황산의 농도가 0.01내지 5mol/ℓ이고 염화 제1구리의 농도가 0.0003내지 0.03mol/ℓ인 도금방법.
  3. 제1항에 있어서, 활성촉진처리용 수용액이 황산, 염화제 제1구리 및 유기산을 함유하는 도금방법.
  4. 제3항에 있어서, 유기산이 시트르산, 글리세르산, 말론산, 말산, 글리콜산, 락트산, 타르타르산, 및 아디프산으로 이루어진 군으로부터 선택된 적어도 하나의 산인 도금방법.
  5. 제3항에 있어서, 유기산을 0.5mol/ℓ이하의 농도로 사용하는 도금방법.
  6. 제1항에 있어서, 무전해도금용 촉매가 팔라듐염과 주석염을 함유하는 도금방법.
  7. 황산과 염화제1구리를 함유하는 활성촉진처리용 수용액.
  8. 제7항에 있어서, 황산의 농도가 0.01내지 5mol/ℓ이고 염화 제1구리의 농도가 0.00003내지 0.03mol/ℓ인 수용액.
  9. 황산, 염화제1구리 및 유기산을 함유하는 활성촉진 처리용 수용액.
  10. 제9항에 있어서, 유기산이 시트르산, 클리세르산, 말론산, 말산, 글리콜산, 락트산, 타르타르산, 및 아디프산으로 구성된 군으로부터 선택된 적어도 하나의 산인 수용액.
  11. 제9항에 있어서, 황산의 농도가 0.01내지 5mol/ℓ이고, 염화제1구의 농도가 0.00003내지 0.03mol/ℓ이며 유기산의 농도가 5mol/ℓ이하인 수용액.
  12. 절연재와 여기에 부착된 금속층 또는 호일을 포함하는 도금할 재료의 표면을 컨디셔닝하고, 도금할 재료를 무전해도금용 촉매를 함유하는 수용액에 침지시키고, 도금할 재료를 제7항의 수용액에 침지시킨 다음, 무전해도금을 행하여 도금할 재료내의 통공의 내벽상에 전기적 연결용 금속층용 형성시킴을 특징으로 하는 무전해도금방법.
  13. 절연재와 여기에 부착된 금속층 또는 금속호일을 포함하는 도금할 재료의 표면으 콘디셔닝하고, 도금할 재료를 무전해도금용 촉매를 함유하는 수용액에 침지시키고, 도금할 재료를 제9항의 수용액에 침지시킨 다음, 무전해도금을 행하여 도금할 재료내의 통공의 내벽상에 전기적 연결용 금속층을 형성시킴을 특징으로 하는 무전해도금방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900006555A 1989-05-09 1990-05-09 무전해 도금 방법 KR930007387B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-115834 1989-05-09
JP1115834A JP2666470B2 (ja) 1989-05-09 1989-05-09 無電解めっき法

Publications (2)

Publication Number Publication Date
KR900018410A true KR900018410A (ko) 1990-12-21
KR930007387B1 KR930007387B1 (ko) 1993-08-09

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KR1019900006555A KR930007387B1 (ko) 1989-05-09 1990-05-09 무전해 도금 방법

Country Status (5)

Country Link
US (1) US5206052A (ko)
EP (1) EP0397412B1 (ko)
JP (1) JP2666470B2 (ko)
KR (1) KR930007387B1 (ko)
DE (1) DE69015689T2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06299360A (ja) * 1993-04-09 1994-10-25 Hitachi Chem Co Ltd 無電解めっき用前処理液
JP2923524B2 (ja) * 1995-08-01 1999-07-26 メック株式会社 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法
US6303500B1 (en) * 1999-02-24 2001-10-16 Micron Technology, Inc. Method and apparatus for electroless plating a contact pad
US7029529B2 (en) 2002-09-19 2006-04-18 Applied Materials, Inc. Method and apparatus for metallization of large area substrates
US20100098863A1 (en) * 2003-03-12 2010-04-22 University Of Missouri Process for spontaneous deposition from an organic solution
JP2005060822A (ja) * 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ
JP4955274B2 (ja) * 2006-01-17 2012-06-20 アルプス電気株式会社 めっき配線基板および無電解めっき方法
JP5023738B2 (ja) * 2007-02-28 2012-09-12 富士通株式会社 プリント配線板の製造方法
JP5997717B2 (ja) * 2014-02-26 2016-09-28 石原 邦雄 放射能防護服用布帛の製造方法

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SU488484A1 (ru) * 1971-06-07 1983-04-07 Уральский ордена Трудового Красного Знамени политехнический институт им.С.М.Кирова Способ металлизации комбинированных металл-диэлектрик поверхностей
JPS50112231A (ko) * 1974-02-15 1975-09-03
JPS5159031A (ja) * 1974-11-08 1976-05-22 Surface Technology Corp Mudenkaimetsukihohooyobimetsukyoeki
US4181750A (en) * 1977-09-09 1980-01-01 Western Electric Company, Inc. Method of depositing a metal on a surface
US4182784A (en) * 1977-12-16 1980-01-08 Mcgean Chemical Company, Inc. Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid
JPS5550690A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Method of manufacturing printed board
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
EP0126171B1 (de) * 1983-05-19 1987-01-07 Ibm Deutschland Gmbh Verfahren zur ganzflächigen Nacharbeitung von Mehrlagenschaltungen mit fehlerhaften äusseren Kupferleiterzügen
ZA843704B (en) * 1983-07-01 1985-09-25 Macdermid Inc Oxidizing accelerator
JPS6083395A (ja) * 1983-10-11 1985-05-11 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 無電解メツキのために誘電体基板の表面を調整する方法
US4448804A (en) * 1983-10-11 1984-05-15 International Business Machines Corporation Method for selective electroless plating of copper onto a non-conductive substrate surface
DE3417563C2 (de) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur Herstellung von Metallmustern auf isolierenden Trägern, insbesondere gedruckte Schaltungen
US4720324A (en) * 1985-10-03 1988-01-19 Hayward John S Process for manufacturing printed circuit boards

Also Published As

Publication number Publication date
EP0397412A3 (en) 1992-03-25
DE69015689D1 (de) 1995-02-16
JPH02294486A (ja) 1990-12-05
EP0397412A2 (en) 1990-11-14
EP0397412B1 (en) 1995-01-04
DE69015689T2 (de) 1995-05-11
JP2666470B2 (ja) 1997-10-22
US5206052A (en) 1993-04-27
KR930007387B1 (ko) 1993-08-09

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