ITRM950110A0 - Procedimento per la catalizzazione nella placcatura senza corrente. - Google Patents

Procedimento per la catalizzazione nella placcatura senza corrente.

Info

Publication number
ITRM950110A0
ITRM950110A0 ITRM950110A ITRM950110A ITRM950110A0 IT RM950110 A0 ITRM950110 A0 IT RM950110A0 IT RM950110 A ITRM950110 A IT RM950110A IT RM950110 A ITRM950110 A IT RM950110A IT RM950110 A0 ITRM950110 A0 IT RM950110A0
Authority
IT
Italy
Prior art keywords
catalyzing
plating
procedure
current
Prior art date
Application number
ITRM950110A
Other languages
English (en)
Inventor
Yoshihiko Omura
Original Assignee
Daishin Kagaku Kk
Omura Toryo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daishin Kagaku Kk, Omura Toryo Kk filed Critical Daishin Kagaku Kk
Publication of ITRM950110A0 publication Critical patent/ITRM950110A0/it
Publication of ITRM950110A1 publication Critical patent/ITRM950110A1/it
Application granted granted Critical
Publication of IT1281942B1 publication Critical patent/IT1281942B1/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
    • F02B75/00—Other engines
    • F02B75/02—Engines characterised by their cycles, e.g. six-stroke
    • F02B2075/022—Engines characterised by their cycles, e.g. six-stroke having less than six strokes per cycle
    • F02B2075/027—Engines characterised by their cycles, e.g. six-stroke having less than six strokes per cycle four
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Conductive Materials (AREA)
IT95RM000110 1994-12-08 1995-02-23 Procedimento per la catalizzazione nella placcatura senza corrente. IT1281942B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33109794A JP3022226B2 (ja) 1994-12-08 1994-12-08 無電解めっき法における触媒化方法

Publications (3)

Publication Number Publication Date
ITRM950110A0 true ITRM950110A0 (it) 1995-02-23
ITRM950110A1 ITRM950110A1 (it) 1996-08-23
IT1281942B1 IT1281942B1 (it) 1998-03-03

Family

ID=18239827

Family Applications (1)

Application Number Title Priority Date Filing Date
IT95RM000110 IT1281942B1 (it) 1994-12-08 1995-02-23 Procedimento per la catalizzazione nella placcatura senza corrente.

Country Status (19)

Country Link
US (1) US5660883A (it)
JP (1) JP3022226B2 (it)
KR (1) KR960023235A (it)
CN (1) CN1124301A (it)
AU (1) AU699029B2 (it)
BE (1) BE1008679A3 (it)
CA (1) CA2142683C (it)
CH (1) CH689394A5 (it)
DE (1) DE19506551C2 (it)
DK (1) DK172134B1 (it)
FI (1) FI950446A (it)
FR (1) FR2727984B1 (it)
GB (1) GB9502096D0 (it)
IT (1) IT1281942B1 (it)
NL (1) NL9500293A (it)
NO (1) NO310627B1 (it)
RU (1) RU2126459C1 (it)
SE (1) SE514289C2 (it)
TW (1) TW254971B (it)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046107A (en) * 1998-12-17 2000-04-04 Industrial Technology Research Institute Electroless copper employing hypophosphite as a reducing agent
US6703186B1 (en) 1999-08-11 2004-03-09 Mitsuboshi Belting Ltd. Method of forming a conductive pattern on a circuit board
JP2001236885A (ja) * 2000-02-22 2001-08-31 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルおよびその製造方法
JP4897165B2 (ja) * 2000-09-27 2012-03-14 名古屋メッキ工業株式会社 金属めっきされた有機高分子繊維の製造方法
JP2002348673A (ja) * 2001-05-24 2002-12-04 Learonal Japan Inc ホルムアルデヒドを使用しない無電解銅めっき方法および該方法に使用される無電解銅めっき液
US7223694B2 (en) * 2003-06-10 2007-05-29 Intel Corporation Method for improving selectivity of electroless metal deposition
US7049234B2 (en) * 2003-12-22 2006-05-23 Intel Corporation Multiple stage electroless deposition of a metal layer
JP2005243499A (ja) * 2004-02-27 2005-09-08 Fujitsu Ltd フラットディスプレイパネルの電極形成方法
US7732330B2 (en) 2005-06-30 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using an ink-jet method of the same
CN101319315A (zh) * 2008-07-03 2008-12-10 东华大学 一种基于分子自组装技术的柔性基材化学镀前活化方法
WO2010120816A2 (en) * 2009-04-13 2010-10-21 Applied Materials, Inc. Metallized fibers for electrochemical energy storage
JP5663886B2 (ja) * 2010-02-08 2015-02-04 三菱電機株式会社 半導体装置の製造方法
US20110303644A1 (en) * 2010-06-09 2011-12-15 Arlington Plating Company Methods for Plating Plastic Articles
ES2710856T3 (es) * 2010-09-13 2019-04-29 Chemetall Gmbh Procedimiento para recubrimiento de superficies y uso de los objetos recubiertos según este procedimiento
EP2695581B1 (en) 2012-08-07 2019-03-13 Critical Innovations, LLC Device for simultaneously documenting and treating tension pneumothorax and/or hemothorax
CN103114437B (zh) * 2013-02-01 2014-11-05 东华大学 一种纺织品表面无钯化学镀金属镍的方法
US10046147B2 (en) 2013-12-26 2018-08-14 Critical Innovations, LLC Percutaneous access pathway system and method
CN103805971B (zh) * 2014-03-11 2017-02-15 东华大学 一种镍盐活化化学镀铜纺织品的方法
CN104372313B (zh) * 2014-09-29 2018-07-13 安科智慧城市技术（中国）有限公司 一种薄膜太阳能电池背电极的制备方法及薄膜太阳能电池
DE102015201562A1 (de) * 2015-01-29 2016-08-04 Helmholtz-Zentrum Dresden - Rossendorf E.V. Verfahren zur Metallisierung von Kunststoffteilen sowie Lösung
CN105821396A (zh) * 2016-03-27 2016-08-03 华南理工大学 一种无钯化学镀铜的方法
US10814119B2 (en) 2017-09-22 2020-10-27 Critical Innovations, LLC Percutaneous access pathway system
CN110093596A (zh) * 2019-04-24 2019-08-06 南昌大学 一种自动脱落的超薄铜箔的制备方法
CN112063998B (zh) * 2020-08-28 2022-10-11 南昌大学 一种超薄铜/石墨烯复合箔的制备方法
CN112522687A (zh) * 2020-11-02 2021-03-19 深圳市先进连接科技有限公司 树脂表面改性溶液和化学镀银方法
CN112979344B (zh) * 2021-03-16 2022-04-08 河海大学 基于化学镀法在混凝土表面制备的抗菌保护层及制备方法
EP4321116A3 (en) 2022-08-11 2024-05-08 Critical Innovations, LLC Percutaneous access pathway system
CN116782516B (zh) * 2023-07-13 2024-01-23 南华大学 一种基于均相离子型催化油墨制备铜印刷电路的普适工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6036668A (ja) * 1983-08-08 1985-02-25 Hitachi Chem Co Ltd 無電解銅めつき用触媒
US4670306A (en) * 1983-09-15 1987-06-02 Seleco, Inc. Method for treatment of surfaces for electroless plating
US4663240A (en) * 1984-11-06 1987-05-05 Enthone, Incorporated RFI shielded plastic articles and process for making same
US5338822A (en) * 1992-10-02 1994-08-16 Cargill, Incorporated Melt-stable lactide polymer composition and process for manufacture thereof
US5336415A (en) * 1993-02-10 1994-08-09 Vanson L.P. Removing polyvalent metals from aqueous waste streams with chitosan and halogenating agents
DE69423257T2 (de) * 1993-05-28 2000-07-06 Matsushita Electric Ind Co Ltd Denitrierungssystem

Also Published As

Publication number Publication date
FI950446A (fi) 1996-06-09
AU1358195A (en) 1996-06-13
GB9502096D0 (en) 1995-03-22
DK17895A (da) 1996-06-09
KR960023235A (ko) 1996-07-18
NO950563L (no) 1996-06-10
SE9500571D0 (sv) 1995-02-16
NL9500293A (nl) 1996-07-01
AU699029B2 (en) 1998-11-19
DK172134B1 (da) 1997-11-24
DE19506551C2 (de) 2001-05-31
RU95101851A (ru) 1996-11-20
FI950446A0 (fi) 1995-02-01
FR2727984A1 (fr) 1996-06-14
SE514289C2 (sv) 2001-02-05
CN1124301A (zh) 1996-06-12
BE1008679A3 (fr) 1996-07-02
NO310627B1 (no) 2001-07-30
JPH08158057A (ja) 1996-06-18
CA2142683A1 (en) 1996-06-09
DE19506551A1 (de) 1996-06-13
FR2727984B1 (fr) 1997-12-12
CH689394A5 (fr) 1999-03-31
NO950563D0 (no) 1995-02-15
JP3022226B2 (ja) 2000-03-15
IT1281942B1 (it) 1998-03-03
ITRM950110A1 (it) 1996-08-23
RU2126459C1 (ru) 1999-02-20
US5660883A (en) 1997-08-26
SE9500571L (sv) 1996-06-09
CA2142683C (en) 2000-07-18
TW254971B (en) 1995-08-21

Similar Documents

Publication Publication Date Title
ITRM950110A0 (it) Procedimento per la catalizzazione nella placcatura senza corrente.
CY2395B1 (en) Toothbrush.
DE69700667T2 (de) Elektroplattierungsverfahren
NL1004807A1 (nl) Scheerapparaat.
DE69832845D1 (de) Elektroplattierungsverfahren
DE69705349T2 (de) Elektroplattierungsbad
AU3044499A (en) Electroplating solution
DE69713849D1 (de) Elektroplattierungsverfahren
ES1034899Y (es) Sujetador femenino perfeccionado.
GB9902368D0 (en) Electroplating
ES1029442Y (es) Balaustrada perfeccionada.
EP0685183A3 (en) Toothbrush.
KR980002921U (ko) 도금용 지그
ES1026938Y (es) Cepillo de dientes perfeccionado.
ES1033006Y (es) Reposacabezas perfeccionado.
ES1027963Y (es) Pulsador-interruptor perfeccionado.
ITPD960002A1 (it) Corrente per scaffalature
ES1035765Y (es) Sujetador perfeccionado.
IT233741Y1 (it) Rasoio perfezionato.
ES1027450Y (es) Mueble de laboratorio perfeccionado.
ES1027731Y (es) Corredera de baño perfeccionada.
ES1048378Y (es) Cepillo de dientes perfeccionado.
ES1035317Y (es) Freidora perfeccionada.
GB9414866D0 (en) Electrochemical methods
IDS000000150A (id) Lampit rotan berlapis

Legal Events

Date Code Title Description
0001 Granted