NO20053153D0 - Sag med flere vaiere. - Google Patents

Sag med flere vaiere.

Info

Publication number
NO20053153D0
NO20053153D0 NO20053153A NO20053153A NO20053153D0 NO 20053153 D0 NO20053153 D0 NO 20053153D0 NO 20053153 A NO20053153 A NO 20053153A NO 20053153 A NO20053153 A NO 20053153A NO 20053153 D0 NO20053153 D0 NO 20053153D0
Authority
NO
Norway
Prior art keywords
case
several wires
wires
several
Prior art date
Application number
NO20053153A
Other languages
English (en)
Other versions
NO326031B1 (no
NO20053153L (no
Inventor
Takafumi Kawasaki
Hirozoh Tsuruta
Hirokazu Nishida
Seiichi Mimura
Masayuki Hamayasu
Hisashi Tominaga
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of NO20053153D0 publication Critical patent/NO20053153D0/no
Publication of NO20053153L publication Critical patent/NO20053153L/no
Publication of NO326031B1 publication Critical patent/NO326031B1/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
NO20053153A 2003-10-27 2005-06-28 Sag med flere vaiere. NO326031B1 (no)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003365719 2003-10-27
JP2003366378 2003-10-27
JP2003369476 2003-10-29
JP2003370859 2003-10-30
PCT/JP2004/015705 WO2005039824A1 (ja) 2003-10-27 2004-10-22 マルチワイヤソー

Publications (3)

Publication Number Publication Date
NO20053153D0 true NO20053153D0 (no) 2005-06-28
NO20053153L NO20053153L (no) 2006-04-21
NO326031B1 NO326031B1 (no) 2008-09-01

Family

ID=34528115

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20053153A NO326031B1 (no) 2003-10-27 2005-06-28 Sag med flere vaiere.

Country Status (5)

Country Link
US (1) US7306508B2 (no)
EP (2) EP2343155B1 (no)
JP (2) JP4387361B2 (no)
NO (1) NO326031B1 (no)
WO (1) WO2005039824A1 (no)

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EP2165805A4 (en) 2007-06-27 2014-02-12 Mitsubishi Electric Corp MULTI-THREAD SAW AND CUTTING METHOD OF INGOT
US8157876B2 (en) * 2007-07-31 2012-04-17 Cabot Microelectronics Corporation Slurry composition containing non-ionic polymer and method for use
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WO2009078130A1 (ja) * 2007-12-19 2009-06-25 Shin-Etsu Handotai Co., Ltd. ワイヤソーによるワークの切断方法およびワイヤソー
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US8425639B2 (en) * 2008-05-30 2013-04-23 Cabot Microelectronics Corporation Wire saw slurry recycling process
KR100898151B1 (ko) * 2008-10-08 2009-05-19 장은영 친환경 와이어쏘 절단장치 및 이를 이용한 절단방법
JP5217918B2 (ja) * 2008-11-07 2013-06-19 信越半導体株式会社 インゴット切断装置及び切断方法
US20100126488A1 (en) * 2008-11-25 2010-05-27 Abhaya Kumar Bakshi Method and apparatus for cutting wafers by wire sawing
US8065995B2 (en) * 2008-11-25 2011-11-29 Cambridge Energy Resources Inc Method and apparatus for cutting and cleaning wafers in a wire saw
US8261730B2 (en) * 2008-11-25 2012-09-11 Cambridge Energy Resources Inc In-situ wafer processing system and method
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TW201507812A (zh) 2010-12-30 2015-03-01 Saint Gobain Abrasives Inc 磨料物品及形成方法
TW201226087A (en) * 2010-12-31 2012-07-01 Micron Diamond Wire & Equipment Co Ltd Cutting and cooling device of diamond wire
DE102011014828A1 (de) 2011-03-23 2012-09-27 Schott Solar Ag Fluide Trennmedien und deren Verwendung
DE102011082366B3 (de) * 2011-09-08 2013-02-28 Siltronic Ag Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
JP5733120B2 (ja) * 2011-09-09 2015-06-10 住友電気工業株式会社 ソーワイヤおよびそれを用いたｉｉｉ族窒化物結晶基板の製造方法
KR101618040B1 (ko) 2011-09-16 2016-05-04 생-고뱅 어브레이시브즈, 인코포레이티드 연마 물품 및 형성방법
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WO2013128653A1 (ja) * 2012-03-02 2013-09-06 株式会社クリスタル光学 シリコンインゴットの切断方法
DE102012209974B4 (de) 2012-06-14 2018-02-15 Siltronic Ag Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück
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TW201402274A (zh) 2012-06-29 2014-01-16 Saint Gobain Abrasives Inc 研磨物品及形成方法
TW201404527A (zh) 2012-06-29 2014-02-01 Saint Gobain Abrasives Inc 研磨物品及形成方法
TWI483803B (zh) * 2012-06-29 2015-05-11 Saint Gobain Abrasives Inc 在工件上進行切割操作之方法
JP5996308B2 (ja) * 2012-07-10 2016-09-21 コマツＮｔｃ株式会社 ワイヤソー
TW201441355A (zh) 2013-04-19 2014-11-01 Saint Gobain Abrasives Inc 研磨製品及其形成方法
CN104354233A (zh) * 2014-10-13 2015-02-18 灵璧县灵磁新材料有限公司 一种钕铁硼多线切割机的冷却装置
WO2016103397A1 (ja) * 2014-12-25 2016-06-30 エムティアール株式会社 Ｃｍｐスラリー再生方法および再生装置
TWI621505B (zh) 2015-06-29 2018-04-21 聖高拜磨料有限公司 研磨物品及形成方法
JP6270796B2 (ja) * 2015-10-28 2018-01-31 株式会社リード 固定砥粒ワイヤーソー及び固定砥粒ワイヤーのドレッシング方法
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JP7113365B2 (ja) * 2017-05-10 2022-08-05 パナソニックＩｐマネジメント株式会社 ソーワイヤー及び切断装置
FR3070538B1 (fr) * 2017-08-30 2020-02-21 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de desassemblage d'un module photovoltaique et installation associee
KR102282063B1 (ko) * 2020-01-30 2021-07-28 에스케이실트론 주식회사 잉곳 온도 제어기 및 그를 구비한 와이어 쏘잉 장치
CN113211278A (zh) * 2021-05-14 2021-08-06 安徽省景隆电子科技有限公司 一种提高合金电阻落料效率的切割方法
CN115958709B (zh) * 2022-12-28 2023-06-20 宁波合盛新材料有限公司 碳化硅晶片的多线切割方法
CN117340357B (zh) * 2023-12-06 2024-03-19 成都游小木创新科技有限公司 一种汽车零件精度切割装置

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Also Published As

Publication number Publication date
EP1685927A4 (en) 2008-11-26
US20060249134A1 (en) 2006-11-09
JP4387361B2 (ja) 2009-12-16
WO2005039824A1 (ja) 2005-05-06
EP1685927A1 (en) 2006-08-02
JP2009142986A (ja) 2009-07-02
US7306508B2 (en) 2007-12-11
JPWO2005039824A1 (ja) 2007-03-01
EP2343155A1 (en) 2011-07-13
NO326031B1 (no) 2008-09-01
NO20053153L (no) 2006-04-21
EP2343155B1 (en) 2014-08-20
JP4907682B2 (ja) 2012-04-04
EP1685927B1 (en) 2013-04-10

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