KR20120037576A - 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법 - Google Patents
단결정 잉곳 절단장치 및 단결정 잉곳 절단방법 Download PDFInfo
- Publication number
- KR20120037576A KR20120037576A KR1020100099111A KR20100099111A KR20120037576A KR 20120037576 A KR20120037576 A KR 20120037576A KR 1020100099111 A KR1020100099111 A KR 1020100099111A KR 20100099111 A KR20100099111 A KR 20100099111A KR 20120037576 A KR20120037576 A KR 20120037576A
- Authority
- KR
- South Korea
- Prior art keywords
- ingot
- single crystal
- cutting
- bath
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000005520 cutting process Methods 0.000 claims abstract description 64
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 239000002002 slurry Substances 0.000 claims description 15
- 238000007598 dipping method Methods 0.000 claims 1
- 230000008602 contraction Effects 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000021332 multicellular organism growth Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
실시예에 따른 단결정 잉곳 절단장치는 잉곳을 절단하는 와이어쏘; 상기 와이어쏘를 구동시키는 롤러; 및 상기 잉곳이 절단되기 전에 상기 잉곳을 냉각시키는 유체를 구비하는 배쓰(bath);를 포함한다.
Description
도 2는 실시예에 따른 단결정 잉곳 절단장치의 측면 예시도.
Claims (10)
- 잉곳을 절단하는 와이어쏘;
상기 와이어쏘를 구동시키는 롤러; 및
상기 잉곳이 절단되기 전에 상기 잉곳을 냉각시키는 유체를 구비하는 배쓰(bath);를 포함하는 단결정 잉곳 절단장치. - 제1 항에 있어서,
상기 잉곳을 상방향으로 이동시키는 이동장치를 더 포함하는 단결정 잉곳 절단장치. - 제1 항에 있어서,
상기 잉곳은 절단되기 전에 상기 유체와 접촉하고 있는 단결정 잉곳 절단장치. - 제1 항에 있어서,
상기 유체는 슬러리를 포함하는 단결정 잉곳 절단장치. - 제1 항에 있어서,
상기 배쓰 내의 유체의 온도를 유지하는 열교환기를 더 구비하는 단결정 잉곳 절단장치. - 제5 항에 있어서,
상기 와이어쏘에 슬러리를 공급하는 슬러리 노즐을 더 포함하며,
상기 유체는 상기 배쓰에서 상기 열교환기를 거쳐 상기 슬러리 노즐을 통해 상기 와이어쏘에 공급되는 단결정 잉곳 절단장치. - 제1 항에 있어서,
상기 잉곳 절단에 따른 웨이퍼를 지지하는 가변 가이드를 더 구비하는 단결정 잉곳 절단장치. - 잉곳을 절단하기 전에 소정의 유체를 구비하는 배쓰(bath)에 담그는 단계;
상기 잉곳을 상기 배쓰로부터 와이어쏘로 다운업(down-up) 공급하는 단계; 및
상기 잉곳을 절단하는 단계;를 포함하는 잉곳 절단방법. - 제8 항에 있어서,
상기 잉곳은 절단되기 전에 상기 유체와 접촉하고 있는 잉곳 절단방법. - 제8 항에 있어서,
상기 유체는 상기 배쓰에서 상기 열교환기를 거쳐 슬러리 노즐을 통해 상기 와이어쏘에 공급되는 단결정 잉곳 절단방법.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100099111A KR20120037576A (ko) | 2010-10-12 | 2010-10-12 | 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법 |
| CN2011800486457A CN103153564A (zh) | 2010-10-12 | 2011-09-16 | 用于锯切单晶锭的设备和方法 |
| JP2013533759A JP2013539923A (ja) | 2010-10-12 | 2011-09-16 | 単結晶インゴット切断装置及び単結晶インゴットの切断方法 |
| PCT/KR2011/006874 WO2012050307A2 (en) | 2010-10-12 | 2011-09-16 | Apparatus and method for sawing single crystal ingot |
| EP11832694.1A EP2627488A2 (en) | 2010-10-12 | 2011-09-16 | Apparatus and method for sawing single crystal ingot |
| US13/272,161 US20120085333A1 (en) | 2010-10-12 | 2011-10-12 | Apparatus and method for sawing single crystal ingot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100099111A KR20120037576A (ko) | 2010-10-12 | 2010-10-12 | 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120037576A true KR20120037576A (ko) | 2012-04-20 |
Family
ID=45924143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100099111A Ceased KR20120037576A (ko) | 2010-10-12 | 2010-10-12 | 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120085333A1 (ko) |
| EP (1) | EP2627488A2 (ko) |
| JP (1) | JP2013539923A (ko) |
| KR (1) | KR20120037576A (ko) |
| CN (1) | CN103153564A (ko) |
| WO (1) | WO2012050307A2 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200086458A (ko) * | 2019-01-09 | 2020-07-17 | 에스케이실트론 주식회사 | 와이어 쏘잉 장치용 정온 배쓰 및 이를 포함하는 와이어 쏘잉 장치 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101279681B1 (ko) * | 2010-09-29 | 2013-06-27 | 주식회사 엘지실트론 | 단결정 잉곳 절단장치 |
| EP2711978A1 (en) | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Method of making wafers |
| EP2944444A1 (en) | 2014-05-16 | 2015-11-18 | Meyer Burger AG | Wafer processing method |
| CN109421185B (zh) * | 2017-09-05 | 2021-05-28 | 上海新昇半导体科技有限公司 | 一种晶棒的切割方法及切割装置 |
| CN110733139B (zh) * | 2019-10-14 | 2021-05-28 | 西安奕斯伟硅片技术有限公司 | 一种晶棒切割装置及方法 |
| CN116572410A (zh) * | 2023-06-27 | 2023-08-11 | 宁夏中欣晶圆半导体科技有限公司 | 多线切割控制切割硅片形貌的方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2673544B2 (ja) * | 1988-06-14 | 1997-11-05 | 株式会社日平トヤマ | 脆性材料の切断方法 |
| JP2666436B2 (ja) * | 1988-11-29 | 1997-10-22 | 住友金属工業株式会社 | ワイヤソーによる切断加工方法 |
| JP2516717B2 (ja) * | 1991-11-29 | 1996-07-24 | 信越半導体株式会社 | ワイヤソ―及びその切断方法 |
| JPH07266331A (ja) * | 1994-03-30 | 1995-10-17 | Hitachi Chem Co Ltd | 単結晶の切断方法 |
| JP2885270B2 (ja) * | 1995-06-01 | 1999-04-19 | 信越半導体株式会社 | ワイヤーソー装置及びワークの切断方法 |
| JPH0985737A (ja) * | 1995-09-22 | 1997-03-31 | Toray Eng Co Ltd | ワイヤ式切断装置 |
| JPH09200734A (ja) * | 1996-01-12 | 1997-07-31 | Fuji Photo Film Co Ltd | 監視装置 |
| JPH1085737A (ja) * | 1996-07-23 | 1998-04-07 | Mitsuhiro Fujiwara | 浮遊物除去装置 |
| JPH10217036A (ja) * | 1997-01-29 | 1998-08-18 | Komatsu Electron Metals Co Ltd | 半導体結晶棒の切断装置及び切断方法 |
| JP3637740B2 (ja) * | 1997-08-25 | 2005-04-13 | 三菱住友シリコン株式会社 | ワイヤソーおよびインゴット切断方法 |
| DE19841492A1 (de) * | 1998-09-10 | 2000-03-23 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Abtrennen einer Vielzahl von Scheiben von einem sprödharten Werkstück |
| JP3734018B2 (ja) * | 1999-01-20 | 2006-01-11 | 信越半導体株式会社 | ワイヤソーおよび切断方法 |
| DE19959414A1 (de) * | 1999-12-09 | 2001-06-21 | Wacker Chemie Gmbh | Vorrichtung zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Werkstück |
| JP4659326B2 (ja) * | 2000-05-31 | 2011-03-30 | エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ | 複数の半導体インゴットをスライスするワイヤソー及びプロセス |
| DE10055286A1 (de) * | 2000-11-08 | 2002-05-23 | Freiberger Compound Mat Gmbh | Vorrichtung und Verfahren zum Trennen von Werkstoffen |
| JP3767382B2 (ja) * | 2001-01-09 | 2006-04-19 | 株式会社デンソー | ワイヤソーによる切断方法およびそれに用いる切断装置 |
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| JP2003159650A (ja) * | 2001-11-22 | 2003-06-03 | Takatori Corp | ワイヤソー用スラリータンク |
| US6889684B2 (en) * | 2002-11-06 | 2005-05-10 | Seh America, Inc. | Apparatus, system and method for cutting a crystal ingot |
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| JP2007301687A (ja) * | 2006-05-12 | 2007-11-22 | Naoetsu Electronics Co Ltd | ワーク切断装置 |
| JP4965949B2 (ja) * | 2006-09-22 | 2012-07-04 | 信越半導体株式会社 | 切断方法 |
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| JP4816511B2 (ja) * | 2007-03-06 | 2011-11-16 | 信越半導体株式会社 | 切断方法およびワイヤソー装置 |
| JP5003294B2 (ja) * | 2007-06-08 | 2012-08-15 | 信越半導体株式会社 | 切断方法 |
| CN101855045B (zh) * | 2007-12-19 | 2012-01-18 | 信越半导体股份有限公司 | 利用线锯的工件的切断方法 |
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| BRPI0921043A2 (pt) * | 2008-11-12 | 2018-08-07 | Caris Life Sciences Luxembourg Holdings | métodos e sistemas para usar exossomas para determinar fenótipos |
-
2010
- 2010-10-12 KR KR1020100099111A patent/KR20120037576A/ko not_active Ceased
-
2011
- 2011-09-16 JP JP2013533759A patent/JP2013539923A/ja active Pending
- 2011-09-16 CN CN2011800486457A patent/CN103153564A/zh active Pending
- 2011-09-16 WO PCT/KR2011/006874 patent/WO2012050307A2/en not_active Ceased
- 2011-09-16 EP EP11832694.1A patent/EP2627488A2/en not_active Withdrawn
- 2011-10-12 US US13/272,161 patent/US20120085333A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200086458A (ko) * | 2019-01-09 | 2020-07-17 | 에스케이실트론 주식회사 | 와이어 쏘잉 장치용 정온 배쓰 및 이를 포함하는 와이어 쏘잉 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103153564A (zh) | 2013-06-12 |
| WO2012050307A3 (en) | 2012-06-07 |
| WO2012050307A2 (en) | 2012-04-19 |
| JP2013539923A (ja) | 2013-10-28 |
| EP2627488A2 (en) | 2013-08-21 |
| US20120085333A1 (en) | 2012-04-12 |
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