NO20051935L - Mekanisk risseanordning. - Google Patents
Mekanisk risseanordning.Info
- Publication number
- NO20051935L NO20051935L NO20051935A NO20051935A NO20051935L NO 20051935 L NO20051935 L NO 20051935L NO 20051935 A NO20051935 A NO 20051935A NO 20051935 A NO20051935 A NO 20051935A NO 20051935 L NO20051935 L NO 20051935L
- Authority
- NO
- Norway
- Prior art keywords
- cutter
- workpiece
- specified
- flat tip
- tip surface
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/02—Means for moving the cutting member into its operative position for cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
- C03C17/3678—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/06—Grooving involving removal of material from the surface of the work
- B26D3/065—On sheet material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
- Y10T83/148—Including means to correct the sensed operation
Abstract
Det er tilveiebragt en mekanisk risseanordning (12) for adaptivt å separere hver enhet av tynnfilmsolceller utformet på et enkelt substrat (1), som alltid er i stand til å utføre en forhåndsbestemt nøyaktig rissing av et arbeidsstykke (13) i samsvar med et slitasjetap (d) hos en risseskjærer (9). Denne anordningen (12) er tilveiebragt med et rissemiddel (16) for plassering av en risseskjærer (9) med et sylindrisk legeme tilspisset i en spesifisert konvinkel (?) og med en flat tuppoverflate (91) i en spesifisert overflateposisjon på arbeidsstykket (13), presse skjæreren med en spesifisert trykkraft mot overflaten av arbeidsstykket (13) og bevege skjæreren (9) på overflaten av arbeidsstykket (13), et middel (10) for måling av størrelsen til den flate tuppoverflaten (91) av risseskjæreren og et middel (11) for varierbart å styre trykkraften til risseskjæreren (9) i samsvar med den målte størrelsen til den flate tuppoverflaten (91) av skjæreren.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002319028A JP3867230B2 (ja) | 2002-09-26 | 2002-09-26 | メカニカルスクライブ装置 |
PCT/JP2003/011140 WO2004028988A1 (ja) | 2002-09-26 | 2003-09-01 | メカニカルスクライブ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20051935L true NO20051935L (no) | 2005-04-20 |
Family
ID=32040874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20051935A NO20051935L (no) | 2002-09-26 | 2005-04-20 | Mekanisk risseanordning. |
Country Status (6)
Country | Link |
---|---|
US (1) | US7281334B2 (no) |
EP (1) | EP1544172B1 (no) |
JP (1) | JP3867230B2 (no) |
AU (1) | AU2003264362A1 (no) |
NO (1) | NO20051935L (no) |
WO (1) | WO2004028988A1 (no) |
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JPH11312815A (ja) | 1998-04-28 | 1999-11-09 | Matsushita Electric Ind Co Ltd | 薄膜太陽電池の製造方法 |
US6195618B1 (en) * | 1998-10-15 | 2001-02-27 | Microscribe, Llc | Component position verification using a probe apparatus |
EP1041649A1 (de) * | 1999-03-29 | 2000-10-04 | ANTEC Solar GmbH | Verfahren zur Herstellung eines Dünnschichtsolarmoduls und eine Durchtrennungsvorrichtung |
JP2002018482A (ja) * | 2000-07-05 | 2002-01-22 | Mitsubishi Heavy Ind Ltd | セレン酸還元反応装置 |
JP3820958B2 (ja) * | 2001-10-26 | 2006-09-13 | 日本板硝子株式会社 | 光ファイバ結合系 |
DE10211070A1 (de) * | 2002-03-13 | 2003-09-25 | Gurny Broesch Andrea | Vorrichtung zum Vermessen eines Messobjekts |
US7165331B1 (en) * | 2005-05-24 | 2007-01-23 | Micro Processing Technology, Inc. | Apparatus and method for scribing a semiconductor wafer while controlling scribing forces |
-
2002
- 2002-09-26 JP JP2002319028A patent/JP3867230B2/ja not_active Expired - Fee Related
-
2003
- 2003-09-01 EP EP03798384.8A patent/EP1544172B1/en not_active Expired - Fee Related
- 2003-09-01 AU AU2003264362A patent/AU2003264362A1/en not_active Abandoned
- 2003-09-01 WO PCT/JP2003/011140 patent/WO2004028988A1/ja active Application Filing
-
2005
- 2005-03-07 US US11/077,139 patent/US7281334B2/en not_active Expired - Fee Related
- 2005-04-20 NO NO20051935A patent/NO20051935L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1544172A4 (en) | 2009-09-09 |
EP1544172B1 (en) | 2016-01-20 |
AU2003264362A1 (en) | 2004-04-19 |
US20050223570A1 (en) | 2005-10-13 |
JP3867230B2 (ja) | 2007-01-10 |
JP2004115356A (ja) | 2004-04-15 |
WO2004028988A1 (ja) | 2004-04-08 |
US7281334B2 (en) | 2007-10-16 |
EP1544172A1 (en) | 2005-06-22 |
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