NL8105559A - Werkwijze voor het aanbrengen van een smalle groef in een substraatgebied, in het bijzonder een halfgeleidersubstraatgebied. - Google Patents
Werkwijze voor het aanbrengen van een smalle groef in een substraatgebied, in het bijzonder een halfgeleidersubstraatgebied. Download PDFInfo
- Publication number
- NL8105559A NL8105559A NL8105559A NL8105559A NL8105559A NL 8105559 A NL8105559 A NL 8105559A NL 8105559 A NL8105559 A NL 8105559A NL 8105559 A NL8105559 A NL 8105559A NL 8105559 A NL8105559 A NL 8105559A
- Authority
- NL
- Netherlands
- Prior art keywords
- layer
- oxidation
- substrate region
- oxidized
- groove
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 64
- 238000000034 method Methods 0.000 title claims description 56
- 239000004065 semiconductor Substances 0.000 title claims description 25
- 229910052710 silicon Inorganic materials 0.000 claims description 61
- 239000010703 silicon Substances 0.000 claims description 61
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 57
- 238000005530 etching Methods 0.000 claims description 33
- 230000003647 oxidation Effects 0.000 claims description 32
- 238000007254 oxidation reaction Methods 0.000 claims description 32
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 26
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 229910021332 silicide Inorganic materials 0.000 claims description 8
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 150000003376 silicon Chemical class 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 229910052814 silicon oxide Inorganic materials 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 238000002513 implantation Methods 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- -1 boron ions Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- ZXEYZECDXFPJRJ-UHFFFAOYSA-N $l^{3}-silane;platinum Chemical compound [SiH3].[Pt] ZXEYZECDXFPJRJ-UHFFFAOYSA-N 0.000 description 1
- VLJQDHDVZJXNQL-UHFFFAOYSA-N 4-methyl-n-(oxomethylidene)benzenesulfonamide Chemical compound CC1=CC=C(S(=O)(=O)N=C=O)C=C1 VLJQDHDVZJXNQL-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- 229910021344 molybdenum silicide Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910021340 platinum monosilicide Inorganic materials 0.000 description 1
- 229910021339 platinum silicide Inorganic materials 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 238000002054 transplantation Methods 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66946—Charge transfer devices
- H01L29/66954—Charge transfer devices with an insulated gate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/911—Differential oxidation and etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/947—Subphotolithographic processing
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8105559A NL8105559A (nl) | 1981-12-10 | 1981-12-10 | Werkwijze voor het aanbrengen van een smalle groef in een substraatgebied, in het bijzonder een halfgeleidersubstraatgebied. |
FR8220394A FR2518316B1 (fr) | 1981-12-10 | 1982-12-06 | Procede de realisation d'une gorge ou fente etroite dans une region de substrat notamment une region de substrat semi-conductrice |
IT24636/82A IT1191118B (it) | 1981-12-10 | 1982-12-06 | Metodo per creare una stretta scana latura o fessura in una regione di un substrato,in particolare una regione di un substrato,a carattere di semiconduttore |
GB08234745A GB2111304B (en) | 1981-12-10 | 1982-12-06 | Providing a groove in a substrate region |
DE19823245064 DE3245064A1 (de) | 1981-12-10 | 1982-12-06 | Verfahren zum anbringen einer schmalen nut oder eines spaltes in einem substratgebiet, insbesondere einem halbleitersubstratgebiet |
IE2900/82A IE54307B1 (en) | 1981-12-10 | 1982-12-07 | Providing a groove in a substrate |
CH7115/82A CH661150A5 (de) | 1981-12-10 | 1982-12-07 | Verfahren zum erzeugen einer schmalen nut in einem substratgebiet, insbesondere einem halbleitersubstratgebiet. |
US06/447,844 US4449287A (en) | 1981-12-10 | 1982-12-08 | Method of providing a narrow groove or slot in a substrate region, in particular a semiconductor substrate region |
CA000417321A CA1203323A (en) | 1981-12-10 | 1982-12-09 | Method of providing a narrow groove or slot in a substrate region, in particular a semiconductor substrate region |
JP57216750A JPS58107637A (ja) | 1981-12-10 | 1982-12-10 | 細い溝を基板領域に設ける方法及びそのような基板領域を具える装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8105559 | 1981-12-10 | ||
NL8105559A NL8105559A (nl) | 1981-12-10 | 1981-12-10 | Werkwijze voor het aanbrengen van een smalle groef in een substraatgebied, in het bijzonder een halfgeleidersubstraatgebied. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL8105559A true NL8105559A (nl) | 1983-07-01 |
Family
ID=19838515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL8105559A NL8105559A (nl) | 1981-12-10 | 1981-12-10 | Werkwijze voor het aanbrengen van een smalle groef in een substraatgebied, in het bijzonder een halfgeleidersubstraatgebied. |
Country Status (10)
Country | Link |
---|---|
US (1) | US4449287A (de) |
JP (1) | JPS58107637A (de) |
CA (1) | CA1203323A (de) |
CH (1) | CH661150A5 (de) |
DE (1) | DE3245064A1 (de) |
FR (1) | FR2518316B1 (de) |
GB (1) | GB2111304B (de) |
IE (1) | IE54307B1 (de) |
IT (1) | IT1191118B (de) |
NL (1) | NL8105559A (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119848A (ja) * | 1982-12-27 | 1984-07-11 | Fujitsu Ltd | 半導体装置の製造方法 |
NL8302541A (nl) * | 1983-07-15 | 1985-02-01 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting, en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
DE3329074A1 (de) * | 1983-08-11 | 1985-02-28 | Siemens AG, 1000 Berlin und 8000 München | Verhinderung der oxidationsmitteldiffusion bei der herstellung von halbleiterschichtanordnungen |
NL8303179A (nl) * | 1983-09-15 | 1985-04-01 | Philips Nv | Halfgeleiderinrichting. |
NL8400224A (nl) * | 1984-01-25 | 1985-08-16 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting en inrichting vervaardigd door toepassing daarvan. |
JPS618945A (ja) * | 1984-06-25 | 1986-01-16 | Nec Corp | 半導体集積回路装置 |
NL8402223A (nl) * | 1984-07-13 | 1986-02-03 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting en inrichting, vervaardigd door toepassing daarvan. |
US4583282A (en) * | 1984-09-14 | 1986-04-22 | Motorola, Inc. | Process for self-aligned buried layer, field guard, and isolation |
US4574469A (en) * | 1984-09-14 | 1986-03-11 | Motorola, Inc. | Process for self-aligned buried layer, channel-stop, and isolation |
NL8402859A (nl) * | 1984-09-18 | 1986-04-16 | Philips Nv | Werkwijze voor het vervaardigen van submicrongroeven in bijvoorbeeld halfgeleidermateriaal en met deze werkwijze verkregen inrichtingen. |
FR2573919B1 (fr) * | 1984-11-06 | 1987-07-17 | Thomson Csf | Procede de fabrication de grilles pour circuit integre |
NL8500771A (nl) * | 1985-03-18 | 1986-10-16 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een op een laag siliciumoxide aanwezige dubbellaag - bestaande uit poly-si en een silicide - in een plasma wordt geetst. |
US4650544A (en) * | 1985-04-19 | 1987-03-17 | Advanced Micro Devices, Inc. | Shallow groove capacitor fabrication method |
NL8501338A (nl) * | 1985-05-10 | 1986-12-01 | Philips Nv | Ladingsgekoppelde halfgeleiderinrichting en werkwijze ter vervaardiging daarvan. |
US4648937A (en) * | 1985-10-30 | 1987-03-10 | International Business Machines Corporation | Method of preventing asymmetric etching of lines in sub-micrometer range sidewall images transfer |
IT1213457B (it) * | 1986-07-23 | 1989-12-20 | Catania A | Procedimento per la fabbricazione di dispositivi integrati, in particolare dispositivi cmos adoppia sacca. |
US4735681A (en) * | 1986-08-15 | 1988-04-05 | Motorola Inc. | Fabrication method for sub-micron trench |
EP0407077A3 (en) * | 1989-07-03 | 1992-12-30 | American Telephone And Telegraph Company | Trench etching in an integrated-circuit semiconductor device |
JP2741964B2 (ja) * | 1991-04-15 | 1998-04-22 | シャープ株式会社 | 半導体装置の製造方法 |
US5314836A (en) * | 1992-09-15 | 1994-05-24 | Eastman Kodak Company | Method of making a single electrode level CCD |
KR960014456B1 (ko) * | 1994-01-19 | 1996-10-15 | 현대전자산업 주식회사 | 트렌치형 소자분리구조를 갖는 반도체 장치 및 그 제조방법 |
US5696020A (en) * | 1994-11-23 | 1997-12-09 | Electronics And Telecommunications Research Institute | Method for fabricating semiconductor device isolation region using a trench mask |
KR0148602B1 (ko) * | 1994-11-23 | 1998-12-01 | 양승택 | 반도체 장치의 소자 격리방법 |
JP2715972B2 (ja) * | 1995-03-04 | 1998-02-18 | 日本電気株式会社 | 半導体装置の製造方法 |
JP3393286B2 (ja) * | 1995-09-08 | 2003-04-07 | ソニー株式会社 | パターンの形成方法 |
US5858256A (en) * | 1996-07-11 | 1999-01-12 | The Board Of Trustees Of The Leland Stanford, Jr. University | Method of forming small aperture |
US6828082B2 (en) | 2002-02-08 | 2004-12-07 | Chartered Semiconductor Manufacturing Ltd. | Method to pattern small features by using a re-flowable hard mask |
US20040266155A1 (en) * | 2003-06-30 | 2004-12-30 | Chartered Semiconductor Manufacturing Ltd. | Formation of small gates beyond lithographic limits |
US7056757B2 (en) | 2003-11-25 | 2006-06-06 | Georgia Tech Research Corporation | Methods of forming oxide masks with submicron openings and microstructures formed thereby |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1527894A (en) * | 1975-10-15 | 1978-10-11 | Mullard Ltd | Methods of manufacturing electronic devices |
JPS5373973A (en) * | 1976-12-14 | 1978-06-30 | Matsushita Electric Ind Co Ltd | Manufacture for semiconductor device |
JPS5472972A (en) * | 1977-11-24 | 1979-06-11 | Toshiba Corp | Manufacture of semiconductor device |
US4209349A (en) * | 1978-11-03 | 1980-06-24 | International Business Machines Corporation | Method for forming a narrow dimensioned mask opening on a silicon body utilizing reactive ion etching |
US4274909A (en) * | 1980-03-17 | 1981-06-23 | International Business Machines Corporation | Method for forming ultra fine deep dielectric isolation |
US4334348A (en) * | 1980-07-21 | 1982-06-15 | Data General Corporation | Retro-etch process for forming gate electrodes of MOS integrated circuits |
-
1981
- 1981-12-10 NL NL8105559A patent/NL8105559A/nl not_active Application Discontinuation
-
1982
- 1982-12-06 GB GB08234745A patent/GB2111304B/en not_active Expired
- 1982-12-06 DE DE19823245064 patent/DE3245064A1/de active Granted
- 1982-12-06 IT IT24636/82A patent/IT1191118B/it active
- 1982-12-06 FR FR8220394A patent/FR2518316B1/fr not_active Expired
- 1982-12-07 IE IE2900/82A patent/IE54307B1/en unknown
- 1982-12-07 CH CH7115/82A patent/CH661150A5/de not_active IP Right Cessation
- 1982-12-08 US US06/447,844 patent/US4449287A/en not_active Expired - Lifetime
- 1982-12-09 CA CA000417321A patent/CA1203323A/en not_active Expired
- 1982-12-10 JP JP57216750A patent/JPS58107637A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
IT8224636A0 (it) | 1982-12-06 |
GB2111304B (en) | 1985-09-11 |
US4449287A (en) | 1984-05-22 |
CA1203323A (en) | 1986-04-15 |
IE822900L (en) | 1983-06-10 |
FR2518316B1 (fr) | 1985-10-31 |
JPH059939B2 (de) | 1993-02-08 |
DE3245064C2 (de) | 1992-05-14 |
FR2518316A1 (fr) | 1983-06-17 |
IT8224636A1 (it) | 1984-06-06 |
GB2111304A (en) | 1983-06-29 |
DE3245064A1 (de) | 1983-06-16 |
JPS58107637A (ja) | 1983-06-27 |
CH661150A5 (de) | 1987-06-30 |
IE54307B1 (en) | 1989-08-16 |
IT1191118B (it) | 1988-02-24 |
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