IT8224636A0 - Un substrato,in particolare una remetodo per creare una stretta scana gione di un substrato,a carattere latura o fessura in una regione didi semiconduttore - Google Patents

Un substrato,in particolare una remetodo per creare una stretta scana gione di un substrato,a carattere latura o fessura in una regione didi semiconduttore

Info

Publication number
IT8224636A0
IT8224636A0 IT8224636A IT2463682A IT8224636A0 IT 8224636 A0 IT8224636 A0 IT 8224636A0 IT 8224636 A IT8224636 A IT 8224636A IT 2463682 A IT2463682 A IT 2463682A IT 8224636 A0 IT8224636 A0 IT 8224636A0
Authority
IT
Italy
Prior art keywords
substrate
creating
slot
semiconductor
gap
Prior art date
Application number
IT8224636A
Other languages
English (en)
Other versions
IT1191118B (it
IT8224636A1 (it
Inventor
Henricus Godefridus Rafae Maas
Johannes Arnouldus Appels
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of IT8224636A0 publication Critical patent/IT8224636A0/it
Publication of IT8224636A1 publication Critical patent/IT8224636A1/it
Application granted granted Critical
Publication of IT1191118B publication Critical patent/IT1191118B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66946—Charge transfer devices
    • H01L29/66954—Charge transfer devices with an insulated gate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/911—Differential oxidation and etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/947—Subphotolithographic processing
IT24636/82A 1981-12-10 1982-12-06 Metodo per creare una stretta scana latura o fessura in una regione di un substrato,in particolare una regione di un substrato,a carattere di semiconduttore IT1191118B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8105559A NL8105559A (nl) 1981-12-10 1981-12-10 Werkwijze voor het aanbrengen van een smalle groef in een substraatgebied, in het bijzonder een halfgeleidersubstraatgebied.

Publications (3)

Publication Number Publication Date
IT8224636A0 true IT8224636A0 (it) 1982-12-06
IT8224636A1 IT8224636A1 (it) 1984-06-06
IT1191118B IT1191118B (it) 1988-02-24

Family

ID=19838515

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24636/82A IT1191118B (it) 1981-12-10 1982-12-06 Metodo per creare una stretta scana latura o fessura in una regione di un substrato,in particolare una regione di un substrato,a carattere di semiconduttore

Country Status (10)

Country Link
US (1) US4449287A (it)
JP (1) JPS58107637A (it)
CA (1) CA1203323A (it)
CH (1) CH661150A5 (it)
DE (1) DE3245064A1 (it)
FR (1) FR2518316B1 (it)
GB (1) GB2111304B (it)
IE (1) IE54307B1 (it)
IT (1) IT1191118B (it)
NL (1) NL8105559A (it)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119848A (ja) * 1982-12-27 1984-07-11 Fujitsu Ltd 半導体装置の製造方法
NL8302541A (nl) * 1983-07-15 1985-02-01 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting, en halfgeleiderinrichting vervaardigd volgens de werkwijze.
DE3329074A1 (de) * 1983-08-11 1985-02-28 Siemens AG, 1000 Berlin und 8000 München Verhinderung der oxidationsmitteldiffusion bei der herstellung von halbleiterschichtanordnungen
NL8303179A (nl) * 1983-09-15 1985-04-01 Philips Nv Halfgeleiderinrichting.
NL8400224A (nl) * 1984-01-25 1985-08-16 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting en inrichting vervaardigd door toepassing daarvan.
JPS618945A (ja) * 1984-06-25 1986-01-16 Nec Corp 半導体集積回路装置
NL8402223A (nl) * 1984-07-13 1986-02-03 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting en inrichting, vervaardigd door toepassing daarvan.
US4574469A (en) * 1984-09-14 1986-03-11 Motorola, Inc. Process for self-aligned buried layer, channel-stop, and isolation
US4583282A (en) * 1984-09-14 1986-04-22 Motorola, Inc. Process for self-aligned buried layer, field guard, and isolation
NL8402859A (nl) * 1984-09-18 1986-04-16 Philips Nv Werkwijze voor het vervaardigen van submicrongroeven in bijvoorbeeld halfgeleidermateriaal en met deze werkwijze verkregen inrichtingen.
FR2573919B1 (fr) * 1984-11-06 1987-07-17 Thomson Csf Procede de fabrication de grilles pour circuit integre
NL8500771A (nl) * 1985-03-18 1986-10-16 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een op een laag siliciumoxide aanwezige dubbellaag - bestaande uit poly-si en een silicide - in een plasma wordt geetst.
US4650544A (en) * 1985-04-19 1987-03-17 Advanced Micro Devices, Inc. Shallow groove capacitor fabrication method
NL8501338A (nl) * 1985-05-10 1986-12-01 Philips Nv Ladingsgekoppelde halfgeleiderinrichting en werkwijze ter vervaardiging daarvan.
US4648937A (en) * 1985-10-30 1987-03-10 International Business Machines Corporation Method of preventing asymmetric etching of lines in sub-micrometer range sidewall images transfer
IT1213457B (it) * 1986-07-23 1989-12-20 Catania A Procedimento per la fabbricazione di dispositivi integrati, in particolare dispositivi cmos adoppia sacca.
US4735681A (en) * 1986-08-15 1988-04-05 Motorola Inc. Fabrication method for sub-micron trench
EP0694959A3 (en) * 1989-07-03 1997-12-29 AT&T Corp. Trench etching in an integrated-circuit semiconductor device
JP2741964B2 (ja) * 1991-04-15 1998-04-22 シャープ株式会社 半導体装置の製造方法
US5314836A (en) * 1992-09-15 1994-05-24 Eastman Kodak Company Method of making a single electrode level CCD
KR960014456B1 (ko) * 1994-01-19 1996-10-15 현대전자산업 주식회사 트렌치형 소자분리구조를 갖는 반도체 장치 및 그 제조방법
KR0148602B1 (ko) * 1994-11-23 1998-12-01 양승택 반도체 장치의 소자 격리방법
US5696020A (en) * 1994-11-23 1997-12-09 Electronics And Telecommunications Research Institute Method for fabricating semiconductor device isolation region using a trench mask
JP2715972B2 (ja) * 1995-03-04 1998-02-18 日本電気株式会社 半導体装置の製造方法
JP3393286B2 (ja) * 1995-09-08 2003-04-07 ソニー株式会社 パターンの形成方法
US5858256A (en) * 1996-07-11 1999-01-12 The Board Of Trustees Of The Leland Stanford, Jr. University Method of forming small aperture
US6828082B2 (en) * 2002-02-08 2004-12-07 Chartered Semiconductor Manufacturing Ltd. Method to pattern small features by using a re-flowable hard mask
US20040266155A1 (en) * 2003-06-30 2004-12-30 Chartered Semiconductor Manufacturing Ltd. Formation of small gates beyond lithographic limits
US7056757B2 (en) 2003-11-25 2006-06-06 Georgia Tech Research Corporation Methods of forming oxide masks with submicron openings and microstructures formed thereby

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1527894A (en) * 1975-10-15 1978-10-11 Mullard Ltd Methods of manufacturing electronic devices
JPS5373973A (en) * 1976-12-14 1978-06-30 Matsushita Electric Ind Co Ltd Manufacture for semiconductor device
JPS5472972A (en) * 1977-11-24 1979-06-11 Toshiba Corp Manufacture of semiconductor device
US4209349A (en) * 1978-11-03 1980-06-24 International Business Machines Corporation Method for forming a narrow dimensioned mask opening on a silicon body utilizing reactive ion etching
US4274909A (en) * 1980-03-17 1981-06-23 International Business Machines Corporation Method for forming ultra fine deep dielectric isolation
US4334348A (en) * 1980-07-21 1982-06-15 Data General Corporation Retro-etch process for forming gate electrodes of MOS integrated circuits

Also Published As

Publication number Publication date
IT1191118B (it) 1988-02-24
IT8224636A1 (it) 1984-06-06
DE3245064A1 (de) 1983-06-16
NL8105559A (nl) 1983-07-01
CH661150A5 (de) 1987-06-30
FR2518316A1 (fr) 1983-06-17
CA1203323A (en) 1986-04-15
DE3245064C2 (it) 1992-05-14
JPS58107637A (ja) 1983-06-27
IE822900L (en) 1983-06-10
FR2518316B1 (fr) 1985-10-31
GB2111304B (en) 1985-09-11
JPH059939B2 (it) 1993-02-08
GB2111304A (en) 1983-06-29
IE54307B1 (en) 1989-08-16
US4449287A (en) 1984-05-22

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19931222