NL195037C - Inrichting voor het beladen en ontladen van kokers voor een testinrichitng voor halfgeleiderschakelingen. - Google Patents
Inrichting voor het beladen en ontladen van kokers voor een testinrichitng voor halfgeleiderschakelingen. Download PDFInfo
- Publication number
- NL195037C NL195037C NL9001820A NL9001820A NL195037C NL 195037 C NL195037 C NL 195037C NL 9001820 A NL9001820 A NL 9001820A NL 9001820 A NL9001820 A NL 9001820A NL 195037 C NL195037 C NL 195037C
- Authority
- NL
- Netherlands
- Prior art keywords
- section
- sleeve
- tubes
- transport block
- loading
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims description 48
- 239000004065 semiconductor Substances 0.000 title claims description 35
- 230000005484 gravity Effects 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000000717 retained effect Effects 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Warehouses Or Storage Devices (AREA)
- Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
Applications Claiming Priority (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019890012565A KR910005377A (ko) | 1989-08-31 | 1989-08-31 | 슬리브의 분리, 수평유지, 낙하의 자동화 장치 |
| KR890012565 | 1989-08-31 | ||
| KR1019890015372A KR960015559B1 (ko) | 1989-10-25 | 1989-10-25 | 아이시(ic)테스트기의 슬리브 로딩 장치 |
| KR890015372 | 1989-10-25 | ||
| KR890015506 | 1989-10-25 | ||
| KR2019890015506U KR930008125Y1 (ko) | 1989-10-25 | 1989-10-25 | 슬리브 방향 검출장치 |
| KR2019890017069U KR940001273Y1 (ko) | 1989-11-18 | 1989-11-18 | 슬리이브속의 ic유무 검출장치 |
| KR890017068 | 1989-11-18 | ||
| KR890017069 | 1989-11-18 | ||
| KR2019890017068U KR940000547Y1 (ko) | 1989-11-18 | 1989-11-18 | 슬리이브의 낙하장치 |
| KR900003834 | 1990-03-31 | ||
| KR2019900003834U KR950006931Y1 (ko) | 1990-03-31 | 1990-03-31 | Ic 테스트 슬리브의 솟터 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL9001820A NL9001820A (nl) | 1991-03-18 |
| NL195037C true NL195037C (nl) | 2003-06-25 |
Family
ID=37735089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL9001820A NL195037C (nl) | 1989-08-31 | 1990-08-14 | Inrichting voor het beladen en ontladen van kokers voor een testinrichitng voor halfgeleiderschakelingen. |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH0645406B2 (enrdf_load_stackoverflow) |
| DE (1) | DE4023772A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2651330B1 (enrdf_load_stackoverflow) |
| GB (1) | GB2235581B (enrdf_load_stackoverflow) |
| NL (1) | NL195037C (enrdf_load_stackoverflow) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR950001245Y1 (ko) * | 1991-09-13 | 1995-02-24 | 금성일렉트론 주식회사 | 핸들러의 디바이스 자동 송출장치 |
| DE4430846C2 (de) * | 1994-08-31 | 1997-04-10 | Jenoptik Jena Gmbh | Einrichtung zur Umsetzung eines Transportobjektes zwischen zwei Endlagen |
| DE4430844C1 (de) * | 1994-08-31 | 1996-02-22 | Jenoptik Technologie Gmbh | Beschickungseinrichtung für Halbleiterbearbeitungsanlagen |
| DE4443061A1 (de) * | 1994-12-03 | 1996-06-05 | Elmako Damm Gmbh | Chip-Handling System |
| JP3063602B2 (ja) * | 1995-12-22 | 2000-07-12 | 日立電子エンジニアリング株式会社 | Ｉｃデバイスの移載装置 |
| TW371347B (en) * | 1995-12-27 | 1999-10-01 | Advantest Corp | Structure of rotary arm and device chuck part of a device handler |
| KR100481298B1 (ko) * | 1997-08-04 | 2006-05-22 | 삼성전자주식회사 | 반도체디바이스이/삽입시스템및이를통한반도체디바이스이/삽입방법 |
| DE19733937C1 (de) * | 1997-08-06 | 1999-03-04 | Multitest Elektronische Syst | Führungsbahn für mikroelektronische Bauelemente |
| DE19813684C2 (de) | 1998-03-27 | 2001-08-16 | Brooks Automation Gmbh | Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation |
| CN108152778B (zh) * | 2018-01-29 | 2024-01-30 | 苏州立讯技术有限公司 | 滤波器自动互调测试设备 |
| CN115432423B (zh) * | 2022-08-29 | 2023-08-18 | 深圳市博辉特科技有限公司 | 一种简便的物料分类机构 |
| CN115870228B (zh) * | 2022-12-21 | 2023-10-20 | 江苏晟銮电子科技有限公司 | 一种肖特基芯片检测系统和芯片检测方法 |
| CN117068737A (zh) * | 2023-08-24 | 2023-11-17 | 江苏信息职业技术学院 | 一种料管自动供应装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3584319D1 (de) * | 1984-06-29 | 1991-11-14 | Advantest Corp | Ic-testeinrichtung. |
| US4775279A (en) * | 1985-12-11 | 1988-10-04 | American Tech Manufacturing, Inc. | Method and apparatus for loading/unloading dip devices |
| US4776747A (en) * | 1986-01-03 | 1988-10-11 | Motorola Inc. | High speed integrated circuit handler |
| US4744799A (en) * | 1986-06-06 | 1988-05-17 | Usm Corporation | Combined sequencer and insertion machine |
| US4850785A (en) * | 1987-03-13 | 1989-07-25 | Quality Automation, Inc. | Eprom feed apparatus |
-
1990
- 1990-07-26 DE DE4023772A patent/DE4023772A1/de active Granted
- 1990-08-10 GB GB9017541A patent/GB2235581B/en not_active Expired - Fee Related
- 1990-08-14 NL NL9001820A patent/NL195037C/nl not_active IP Right Cessation
- 1990-08-24 JP JP2221388A patent/JPH0645406B2/ja not_active Expired - Lifetime
- 1990-08-30 FR FR9010836A patent/FR2651330B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| GB9017541D0 (en) | 1990-09-26 |
| GB2235581B (en) | 1993-06-09 |
| JPH0645406B2 (ja) | 1994-06-15 |
| GB2235581A (en) | 1991-03-06 |
| FR2651330A1 (fr) | 1991-03-01 |
| DE4023772A1 (de) | 1991-03-14 |
| JPH03238233A (ja) | 1991-10-24 |
| DE4023772C2 (enrdf_load_stackoverflow) | 1992-07-16 |
| FR2651330B1 (fr) | 1994-10-28 |
| NL9001820A (nl) | 1991-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A1A | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| BC | A request for examination has been filed | ||
| SNR | Assignments of patents or rights arising from examined patent applications |
Owner name: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
|
| TNT | Modifications of names of proprietors of patents or applicants of examined patent applications |
Owner name: HYNIX SEMICONDUCTOR INC. Owner name: LG SEMICON CO., LTD. Owner name: HYUNDAI MICRO ELECTRONICS CO.,LTD. |
|
| SNR | Assignments of patents or rights arising from examined patent applications |
Owner name: MAGNACHIP SEMICONDUCTOR LTD. Effective date: 20050715 |
|
| V1 | Lapsed because of non-payment of the annual fee |
Effective date: 20070301 |