NL1010914C2 - Copolymere hars, bereiding daarvan en fotolak die daar gebruik van maakt. - Google Patents

Copolymere hars, bereiding daarvan en fotolak die daar gebruik van maakt. Download PDF

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Publication number
NL1010914C2
NL1010914C2 NL1010914A NL1010914A NL1010914C2 NL 1010914 C2 NL1010914 C2 NL 1010914C2 NL 1010914 A NL1010914 A NL 1010914A NL 1010914 A NL1010914 A NL 1010914A NL 1010914 C2 NL1010914 C2 NL 1010914C2
Authority
NL
Netherlands
Prior art keywords
formula
norbornene
copolymer resin
represented
maleic anhydride
Prior art date
Application number
NL1010914A
Other languages
English (en)
Dutch (nl)
Other versions
NL1010914A1 (nl
Inventor
Jae Chang Jung
Cheol Kyu Bok
Ki Ho Baik
Min-Ho Jung
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Publication of NL1010914A1 publication Critical patent/NL1010914A1/xx
Application granted granted Critical
Publication of NL1010914C2 publication Critical patent/NL1010914C2/nl

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04—Anhydrides, e.g. cyclic anhydrides
    • C08F222/06—Maleic anhydride
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/115—Cationic or anionic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Graft Or Block Polymers (AREA)
NL1010914A 1997-12-29 1998-12-29 Copolymere hars, bereiding daarvan en fotolak die daar gebruik van maakt. NL1010914C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019970077412A KR100321080B1 (ko) 1997-12-29 1997-12-29 공중합체수지와이의제조방법및이수지를이용한포토레지스트
KR19970077412 1997-12-29

Publications (2)

Publication Number Publication Date
NL1010914A1 NL1010914A1 (nl) 1999-06-30
NL1010914C2 true NL1010914C2 (nl) 1999-08-26

Family

ID=19529569

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1010914A NL1010914C2 (nl) 1997-12-29 1998-12-29 Copolymere hars, bereiding daarvan en fotolak die daar gebruik van maakt.

Country Status (10)

Country Link
US (2) US6369181B1 (ko)
JP (1) JP3847991B2 (ko)
KR (1) KR100321080B1 (ko)
CN (1) CN1149237C (ko)
DE (1) DE19860654A1 (ko)
FR (1) FR2773160B1 (ko)
GB (1) GB2332679B (ko)
IT (1) IT1312366B1 (ko)
NL (1) NL1010914C2 (ko)
TW (1) TW515930B (ko)

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US6103845A (en) * 1996-10-11 2000-08-15 Samsung Electronics Co., Ltd. Chemically amplified resist polymers
US6114084A (en) 1997-02-27 2000-09-05 Samsung Electronics Co. Ltd. Chemically amplified resist composition
KR100321080B1 (ko) 1997-12-29 2002-11-22 주식회사 하이닉스반도체 공중합체수지와이의제조방법및이수지를이용한포토레지스트
KR100520148B1 (ko) 1997-12-31 2006-05-12 주식회사 하이닉스반도체 신규한바이시클로알켄유도체와이를이용한포토레지스트중합체및이중합체를함유한포토레지스트조성물
JPH11231541A (ja) * 1998-02-17 1999-08-27 Daicel Chem Ind Ltd 放射線感光材料及びそれを使用したパターン形成方法
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KR100403325B1 (ko) 1998-07-27 2004-03-24 주식회사 하이닉스반도체 포토레지스트중합체및이를이용한포토레지스트조성물
KR20000015014A (ko) 1998-08-26 2000-03-15 김영환 신규의 포토레지스트용 단량체, 중합체 및 이를 이용한 포토레지스트 조성물
JP3587743B2 (ja) 1998-08-26 2004-11-10 株式会社ハイニックスセミコンダクター フォトレジスト単量体とその製造方法、フォトレジスト共重合体とその製造方法、フォトレジスト組成物、フォトレジストパターン形成方法、および、半導体素子。
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KR100682168B1 (ko) * 1999-07-30 2007-02-12 주식회사 하이닉스반도체 신규의 포토레지스트용 공중합체 및 이를 이용한 포토레지스트조성물
KR20010011771A (ko) * 1999-07-30 2001-02-15 김영환 신규의 포토레지스트용 공중합체 및 이를 이용한 포토레지스트조성물
KR100557594B1 (ko) * 1999-08-17 2006-03-10 주식회사 하이닉스반도체 노광후 지연 안정성을 갖는 신규의 포토레지스트용 단량체, 그의 공중합체 및 이를 함유한 포토레지스트 조성물
JP4714955B2 (ja) * 1999-09-29 2011-07-06 日本ゼオン株式会社 環状オレフィン系付加重合体およびその製造方法
US6365322B1 (en) 1999-12-07 2002-04-02 Clariant Finance (Bvi) Limited Photoresist composition for deep UV radiation
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US6777157B1 (en) * 2000-02-26 2004-08-17 Shipley Company, L.L.C. Copolymers and photoresist compositions comprising same
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KR20020082006A (ko) * 2001-04-23 2002-10-30 금호석유화학 주식회사 신규한 산-민감성 중합체 및 이를 함유하는 레지스트 조성물
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JP2003295444A (ja) * 2001-10-09 2003-10-15 Shipley Co Llc アセタール／脂環式ポリマーおよびフォトレジスト組成物
KR20030035006A (ko) * 2001-10-29 2003-05-09 삼성에스디아이 주식회사 화학증폭형 네가티브 포토레지스트 중합체 및포토레지스트 조성물
US6723488B2 (en) 2001-11-07 2004-04-20 Clariant Finance (Bvi) Ltd Photoresist composition for deep UV radiation containing an additive
US20030235775A1 (en) 2002-06-13 2003-12-25 Munirathna Padmanaban Photoresist composition for deep ultraviolet lithography comprising a mixture of photoactive compounds
US7674847B2 (en) * 2003-02-21 2010-03-09 Promerus Llc Vinyl addition polycyclic olefin polymers prepared with non-olefinic chain transfer agents and uses thereof
CN100440431C (zh) * 2003-03-04 2008-12-03 东京応化工业株式会社 液浸曝光工艺用浸渍液及使用该浸渍液的抗蚀剂图案形成方法
US7282159B2 (en) * 2005-02-25 2007-10-16 E.I. Dupont De Nemours And Company Process for heat transfer utilizing a polytrimethylene ether glycol or polytrimethylene ether ester glycol based heat transfer fluid
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US9550846B2 (en) * 2013-03-13 2017-01-24 The Curators Of The University Of Missouri Flexible to rigid nanoporous polyurethane-acrylate (PUAC) type materials for structural and thermal insulation applications
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Also Published As

Publication number Publication date
DE19860654A1 (de) 1999-07-08
JP3847991B2 (ja) 2006-11-22
US6369181B1 (en) 2002-04-09
ITTO981083A1 (it) 2000-06-23
GB2332679B (en) 2002-07-24
GB2332679A (en) 1999-06-30
IT1312366B1 (it) 2002-04-15
FR2773160A1 (fr) 1999-07-02
KR100321080B1 (ko) 2002-11-22
US20020068803A1 (en) 2002-06-06
GB9827043D0 (en) 1999-02-03
CN1226565A (zh) 1999-08-25
TW515930B (en) 2003-01-01
ITTO981083A0 (it) 1998-12-23
NL1010914A1 (nl) 1999-06-30
CN1149237C (zh) 2004-05-12
FR2773160B1 (fr) 2001-01-12
US6608158B2 (en) 2003-08-19
KR19990057361A (ko) 1999-07-15
JPH11255840A (ja) 1999-09-21

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