MX9306317A - Empaque de material electronico con anchura reducida de sellado. - Google Patents

Empaque de material electronico con anchura reducida de sellado.

Info

Publication number
MX9306317A
MX9306317A MX9306317A MX9306317A MX9306317A MX 9306317 A MX9306317 A MX 9306317A MX 9306317 A MX9306317 A MX 9306317A MX 9306317 A MX9306317 A MX 9306317A MX 9306317 A MX9306317 A MX 9306317A
Authority
MX
Mexico
Prior art keywords
cavity
electronic material
sealing
reduced width
material packing
Prior art date
Application number
MX9306317A
Other languages
English (en)
Inventor
Jeffrey S Braden
Paul R Hoffman
Derek E Tyler
Deepak Mahulikar
Anthony M Pasqualoni
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of MX9306317A publication Critical patent/MX9306317A/es

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Este invención proporciona un empaque de material electrónico (30) en donde los componentes del empaque (12, 14) definen una cavidad (24). Un dispositivo semiconductor (16) y una porción (18) de un bastidor de conductores (20) ocupan parte de la cavidad (24). Sustancialmente el resto de la cavidad (24) es llenada con un polímero blando o flexible (26), tal como un gel de silicona. Puesto que la cavidad (24) ya no es susceptible a la falla de pérdida o fuga total, la anchura de sellado (RW) de los adhesivos (22) utilizados para ensamblar el empaque (30) puede ser reducida, por medio de lo cual se incrementa el área disponible para el montaje del dispositivo semiconductor (16). (Dibujo de la Figura 2).
MX9306317A 1992-10-13 1993-10-11 Empaque de material electronico con anchura reducida de sellado. MX9306317A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/959,571 US5324888A (en) 1992-10-13 1992-10-13 Metal electronic package with reduced seal width

Publications (1)

Publication Number Publication Date
MX9306317A true MX9306317A (es) 1994-04-29

Family

ID=25502156

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9306317A MX9306317A (es) 1992-10-13 1993-10-11 Empaque de material electronico con anchura reducida de sellado.

Country Status (10)

Country Link
US (2) US5324888A (es)
EP (1) EP0664924A4 (es)
JP (1) JPH08502389A (es)
KR (1) KR950703795A (es)
AU (1) AU5132693A (es)
CA (1) CA2145076A1 (es)
MX (1) MX9306317A (es)
PH (1) PH31026A (es)
TW (1) TW241389B (es)
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US5399805A (en) 1995-03-21
AU5132693A (en) 1994-05-09
KR950703795A (ko) 1995-09-20
TW241389B (es) 1995-02-21
US5324888A (en) 1994-06-28
EP0664924A4 (en) 1995-08-30
EP0664924A1 (en) 1995-08-02
WO1994009512A1 (en) 1994-04-28
CA2145076A1 (en) 1994-04-28
JPH08502389A (ja) 1996-03-12
PH31026A (en) 1997-12-29

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