MX9304183A - Montaje de paquete electronico que tiene un flujo controlado de epoxi. - Google Patents

Montaje de paquete electronico que tiene un flujo controlado de epoxi.

Info

Publication number
MX9304183A
MX9304183A MX9304183A MX9304183A MX9304183A MX 9304183 A MX9304183 A MX 9304183A MX 9304183 A MX9304183 A MX 9304183A MX 9304183 A MX9304183 A MX 9304183A MX 9304183 A MX9304183 A MX 9304183A
Authority
MX
Mexico
Prior art keywords
package assembly
electronic package
adhesive
epoxy flow
controlled epoxy
Prior art date
Application number
MX9304183A
Other languages
English (en)
Inventor
Sonny S Pareno
German J Ramirez
Paul R Hoffman
Linda E Strauman
Dexin Liang
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of MX9304183A publication Critical patent/MX9304183A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/00—Constructional details common to different types of electric apparatus
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    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Se proporciona un montaje de paquete electrónico que tiene una paleta de fijación en forma de cuadrito (20) unida a la base (10') del paquete mediante un adhesivo (26) fácil de conformar. Un canal ahuecado (30) formado en la base (10') está parcialmente sobrepuesto por la paleta de fijación en forma de cuadrito (20). Durante el sellado del paquete, se acumula el adhesivo (26) en exceso en el canal ahuecado (34), eliminando la formación de puente del adhesivo (26) al bastidor de conductores (16).
MX9304183A 1992-07-13 1993-07-12 Montaje de paquete electronico que tiene un flujo controlado de epoxi. MX9304183A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/912,456 US5239131A (en) 1992-07-13 1992-07-13 Electronic package having controlled epoxy flow

Publications (1)

Publication Number Publication Date
MX9304183A true MX9304183A (es) 1994-05-31

Family

ID=25431957

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9304183A MX9304183A (es) 1992-07-13 1993-07-12 Montaje de paquete electronico que tiene un flujo controlado de epoxi.

Country Status (10)

Country Link
US (1) US5239131A (es)
EP (1) EP0650658A4 (es)
JP (1) JPH07509101A (es)
KR (1) KR950702789A (es)
AU (1) AU4643193A (es)
CA (1) CA2140154A1 (es)
MX (1) MX9304183A (es)
PH (1) PH30196A (es)
TW (1) TW243547B (es)
WO (1) WO1994001986A1 (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5455386A (en) * 1994-01-14 1995-10-03 Olin Corporation Chamfered electronic package component
AU2103895A (en) * 1994-04-05 1995-10-23 Olin Corporation Cavity filled metal electronic package
WO1995028740A1 (en) * 1994-04-14 1995-10-26 Olin Corporation Electronic package having improved wire bonding capability
JPH11509372A (ja) * 1995-07-14 1999-08-17 オリン コーポレイション 金属ボール・グリッド電子パッケージ
US5764484A (en) * 1996-11-15 1998-06-09 Olin Corporation Ground ring for a metal electronic package
US5989989A (en) * 1996-05-31 1999-11-23 Texas Instruments Incorporated Die and cube reroute process
US5939775A (en) * 1996-11-05 1999-08-17 Gcb Technologies, Llc Leadframe structure and process for packaging intergrated circuits
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WO1994001986A1 (en) 1994-01-20
PH30196A (en) 1997-02-05
US5239131A (en) 1993-08-24
CA2140154A1 (en) 1994-01-20
EP0650658A4 (en) 1996-03-13
TW243547B (es) 1995-03-21
JPH07509101A (ja) 1995-10-05
KR950702789A (ko) 1995-07-29
EP0650658A1 (en) 1995-05-03
AU4643193A (en) 1994-01-31

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