MX2007005018A - Metodo y aparato para formar ranuras. - Google Patents
Metodo y aparato para formar ranuras.Info
- Publication number
- MX2007005018A MX2007005018A MX2007005018A MX2007005018A MX2007005018A MX 2007005018 A MX2007005018 A MX 2007005018A MX 2007005018 A MX2007005018 A MX 2007005018A MX 2007005018 A MX2007005018 A MX 2007005018A MX 2007005018 A MX2007005018 A MX 2007005018A
- Authority
- MX
- Mexico
- Prior art keywords
- point
- substrate
- line
- cooling
- unit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 209
- 238000001816 cooling Methods 0.000 claims abstract description 162
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 113
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 10
- 239000003507 refrigerant Substances 0.000 claims description 7
- 230000006870 function Effects 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000010147 laser engraving Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 49
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 239000002826 coolant Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004093 laser heating Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 monocrystal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/16—Transversely of continuously fed work
- Y10T225/18—Progressively to or from one side edge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/304—Including means to apply thermal shock to work
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Quality & Reliability (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004309958 | 2004-10-25 | ||
| PCT/JP2005/019533 WO2006046525A1 (ja) | 2004-10-25 | 2005-10-25 | クラック形成方法およびクラック形成装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2007005018A true MX2007005018A (es) | 2008-02-19 |
Family
ID=36227765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2007005018A MX2007005018A (es) | 2004-10-25 | 2005-10-25 | Metodo y aparato para formar ranuras. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7726532B2 (enExample) |
| EP (1) | EP1806202B1 (enExample) |
| JP (1) | JP4722054B2 (enExample) |
| KR (1) | KR100821937B1 (enExample) |
| CN (1) | CN100475419C (enExample) |
| AT (1) | ATE520495T1 (enExample) |
| MX (1) | MX2007005018A (enExample) |
| TW (1) | TW200621661A (enExample) |
| WO (1) | WO2006046525A1 (enExample) |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007018674A1 (de) * | 2007-04-18 | 2008-10-23 | Lzh Laserzentrum Hannover E.V. | Verfahren zum Bilden von Durchgangslöchern in Bauteilen aus Glas |
| US8496866B2 (en) * | 2007-04-25 | 2013-07-30 | Ceramtec Gmbh | Chip resistor substrate |
| JP5235987B2 (ja) * | 2007-04-30 | 2013-07-10 | コーニング インコーポレイテッド | 移動中の帯状ガラスに切断線を設ける装置、システム及び方法 |
| JP5011048B2 (ja) | 2007-09-27 | 2012-08-29 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法 |
| KR100949152B1 (ko) * | 2007-11-23 | 2010-03-25 | 삼성코닝정밀유리 주식회사 | 유리 기판 레이저 절단 장치 |
| CN101468875A (zh) | 2007-12-24 | 2009-07-01 | 鸿富锦精密工业(深圳)有限公司 | 脆性非金属基材及其切割方法 |
| CN101910076B (zh) * | 2007-12-27 | 2013-01-30 | 三星钻石工业股份有限公司 | 脆性材料基板的裂痕形成方法 |
| CN101497150B (zh) * | 2008-02-01 | 2012-10-10 | 鸿富锦精密工业(深圳)有限公司 | 激光切割装置 |
| KR100848854B1 (ko) * | 2008-04-21 | 2008-07-30 | 주식회사 탑 엔지니어링 | 취성기판의 스크라이빙 장치 및 그 방법 |
| IT1394891B1 (it) * | 2008-07-25 | 2012-07-20 | Matteo Baistrocchi | Impianto di scribing laser per il trattamento superficiale di lamierini magnetici con spot a sezione ellittica |
| KR101041137B1 (ko) * | 2009-03-25 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
| JP2010232603A (ja) * | 2009-03-30 | 2010-10-14 | Mitsuboshi Diamond Industrial Co Ltd | 基板固定装置 |
| TWI517922B (zh) | 2009-05-13 | 2016-01-21 | 康寧公司 | 切割脆性材料之方法 |
| JP5636423B2 (ja) * | 2009-05-27 | 2014-12-03 | コーニング インコーポレイテッド | 高温でのガラスのレーザ・スコアリング |
| US11235395B2 (en) * | 2009-07-15 | 2022-02-01 | Tennine Corp. | Controlled fracture machining method for producing through-holes |
| US20110011227A1 (en) * | 2009-07-15 | 2011-01-20 | Tingley Iii William Q | Method and apparatus for non-rotary holemaking by means of controlled fracturing |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| US8426767B2 (en) * | 2009-08-31 | 2013-04-23 | Corning Incorporated | Methods for laser scribing and breaking thin glass |
| US8946590B2 (en) * | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| WO2011155314A1 (ja) * | 2010-06-07 | 2011-12-15 | 日本電気硝子株式会社 | ガラス板の切断方法 |
| JP5696393B2 (ja) * | 2010-08-02 | 2015-04-08 | 日本電気硝子株式会社 | ガラスフィルムの割断方法 |
| TWI513670B (zh) | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| KR101358672B1 (ko) * | 2012-08-13 | 2014-02-11 | 한국과학기술원 | 극초단 펄스 레이저를 이용한 투명시편 절단방법 및 다이싱 장치 |
| KR101355807B1 (ko) * | 2012-09-11 | 2014-02-03 | 로체 시스템즈(주) | 비금속 재료의 곡선 절단방법 |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| US9092187B2 (en) | 2013-01-08 | 2015-07-28 | Apple Inc. | Ion implant indicia for cover glass or display component |
| US9623628B2 (en) * | 2013-01-10 | 2017-04-18 | Apple Inc. | Sapphire component with residual compressive stress |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| WO2014126551A1 (en) | 2013-02-12 | 2014-08-21 | Apple Inc. | Multi-step ion implantation |
| US10286487B2 (en) * | 2013-02-28 | 2019-05-14 | Ipg Photonics Corporation | Laser system and method for processing sapphire |
| CN105142853B (zh) * | 2013-02-28 | 2017-07-04 | Ipg光子公司 | 用于加工蓝宝石的激光系统和方法 |
| US9416442B2 (en) | 2013-03-02 | 2016-08-16 | Apple Inc. | Sapphire property modification through ion implantation |
| EP2781296B1 (de) * | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US9508570B2 (en) * | 2013-10-21 | 2016-11-29 | Asm Technology Singapore Pte Ltd | Singulation apparatus and method |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| EP3110592B1 (en) | 2014-02-28 | 2020-01-15 | IPG Photonics Corporation | Multple-laser distinct wavelengths and pulse durations processing |
| US10343237B2 (en) | 2014-02-28 | 2019-07-09 | Ipg Photonics Corporation | System and method for laser beveling and/or polishing |
| US9764427B2 (en) | 2014-02-28 | 2017-09-19 | Ipg Photonics Corporation | Multi-laser system and method for cutting and post-cut processing hard dielectric materials |
| WO2015190281A1 (ja) * | 2014-06-11 | 2015-12-17 | 株式会社Ihi | 脆性材料基板の割断方法及び脆性材料基板の割断装置 |
| US11498156B2 (en) * | 2014-07-03 | 2022-11-15 | Nippon Steel Corporation | Laser processing apparatus |
| KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
| WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| TWI659793B (zh) * | 2014-07-14 | 2019-05-21 | 美商康寧公司 | 用於使用可調整雷射束焦線來處理透明材料的系統及方法 |
| WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
| WO2016033494A1 (en) | 2014-08-28 | 2016-03-03 | Ipg Photonics Corporation | System and method for laser beveling and/or polishing |
| CN107148324A (zh) | 2014-08-28 | 2017-09-08 | Ipg光子公司 | 用于切割和切割后加工硬质电介质材料的多激光器系统和方法 |
| JP6303950B2 (ja) * | 2014-09-19 | 2018-04-04 | 旭硝子株式会社 | ガラス板の加工方法 |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| EP3245166B1 (en) | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| WO2016125609A1 (ja) * | 2015-02-03 | 2016-08-11 | セントラル硝子株式会社 | 脆性材料の切断方法、脆性材料の切断装置、切断脆性材料の製造方法及び切断脆性材料 |
| EP3848334A1 (en) | 2015-03-24 | 2021-07-14 | Corning Incorporated | Alkaline earth boro-aluminosilicate glass article with laser cut edge |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| US10280504B2 (en) | 2015-09-25 | 2019-05-07 | Apple Inc. | Ion-implanted, anti-reflective layer formed within sapphire material |
| DE102016000051A1 (de) | 2016-01-05 | 2017-07-06 | Siltectra Gmbh | Verfahren und Vorrichtung zum planaren Erzeugen von Modifikationen in Festkörpern |
| JP6703617B2 (ja) * | 2016-03-22 | 2020-06-03 | ジルテクトラ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 分離されるべき固体物の複合レーザ処理 |
| MY194570A (en) | 2016-05-06 | 2022-12-02 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| CN109803934A (zh) | 2016-07-29 | 2019-05-24 | 康宁股份有限公司 | 用于激光处理的装置和方法 |
| WO2018044843A1 (en) | 2016-08-30 | 2018-03-08 | Corning Incorporated | Laser processing of transparent materials |
| CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| JP7066701B2 (ja) | 2016-10-24 | 2022-05-13 | コーニング インコーポレイテッド | シート状ガラス基体のレーザに基づく加工のための基体処理ステーション |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| EP3551373A1 (de) | 2016-12-12 | 2019-10-16 | Siltectra GmbH | Verfahren zum dünnen von mit bauteilen versehenen festkörperschichten |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| CN108002696B (zh) * | 2017-12-27 | 2024-05-17 | 信义玻璃(营口)有限公司 | 一种跟踪控制装置和冷却控制系统 |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| CN110293310A (zh) * | 2018-03-22 | 2019-10-01 | 孟晋科技股份有限公司 | 避免铝分子渗入镀铝硅高张力钢板焊道的加工方法 |
| TWI706614B (zh) * | 2018-11-10 | 2020-10-01 | 鴻超環保能源股份有限公司 | 雷射光源模組 |
| CN109680448B (zh) * | 2019-01-21 | 2024-04-19 | 苏州大喆智能科技有限公司 | 一种切线热粘装置 |
| CN112828474B (zh) * | 2020-12-31 | 2022-07-05 | 武汉华工激光工程有限责任公司 | 用于透明脆性材料的斜向切割补偿方法及系统 |
| JP7713186B2 (ja) * | 2021-08-18 | 2025-07-25 | エンシュウ株式会社 | レーザ加工装置 |
| US12387307B2 (en) | 2022-10-26 | 2025-08-12 | Saudi Arabian Oil Company | Determining severity of stepwise cracking in a pressurized vessel |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1244346B (de) * | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
| RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
| JP3195050B2 (ja) | 1992-06-18 | 2001-08-06 | マツダ株式会社 | エンジンの吸入空気量検出装置 |
| CN2178584Y (zh) * | 1993-11-09 | 1994-10-05 | 北京工业大学 | 可产生宽带激光束的转镜装置 |
| JPH0929472A (ja) * | 1995-07-14 | 1997-02-04 | Hitachi Ltd | 割断方法、割断装置及びチップ材料 |
| DE69629704T2 (de) * | 1995-08-31 | 2004-07-08 | Corning Inc. | Verfahren und vorrichtung zum zerbrechen von sprödem material |
| MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
| TW419867B (en) * | 1998-08-26 | 2001-01-21 | Samsung Electronics Co Ltd | Laser cutting apparatus and method |
| JP2001130921A (ja) * | 1999-10-29 | 2001-05-15 | Mitsuboshi Diamond Industrial Co Ltd | 脆性基板の加工方法及び装置 |
| AU1096701A (en) * | 1999-11-12 | 2001-06-06 | P.T.G. Precision Technology Center Llc | Laser glass cutting with super cooled gas chill |
| KR100631304B1 (ko) * | 1999-12-24 | 2006-10-04 | 삼성전자주식회사 | 레이저 빔을 이용한 유리기판 절단 장치 및 그 방법 |
| DE19963939B4 (de) * | 1999-12-31 | 2004-11-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
| JP3802442B2 (ja) * | 2000-12-01 | 2006-07-26 | エルジー電子株式会社 | ガラス切断方法および装置 |
| CN1255858C (zh) * | 2001-07-16 | 2006-05-10 | 三星宝石工业株式会社 | 脆性材料基板的划线装置和脆性材料基板的划线方法 |
| TW583046B (en) * | 2001-08-10 | 2004-04-11 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing brittle material substrate |
| JP2005231035A (ja) * | 2001-08-23 | 2005-09-02 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料の加工方法及び加工装置 |
| KR100794284B1 (ko) * | 2001-09-29 | 2008-01-11 | 삼성전자주식회사 | 비금속 기판 절단 방법 |
| TWI277612B (en) * | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
-
2005
- 2005-10-25 TW TW094137226A patent/TW200621661A/zh not_active IP Right Cessation
- 2005-10-25 EP EP20050805249 patent/EP1806202B1/en not_active Expired - Lifetime
- 2005-10-25 WO PCT/JP2005/019533 patent/WO2006046525A1/ja not_active Ceased
- 2005-10-25 CN CNB2005800365599A patent/CN100475419C/zh not_active Expired - Fee Related
- 2005-10-25 KR KR1020077008844A patent/KR100821937B1/ko not_active Expired - Fee Related
- 2005-10-25 AT AT05805249T patent/ATE520495T1/de not_active IP Right Cessation
- 2005-10-25 MX MX2007005018A patent/MX2007005018A/es active IP Right Grant
- 2005-10-25 JP JP2006543142A patent/JP4722054B2/ja not_active Expired - Fee Related
- 2005-10-25 US US11/575,589 patent/US7726532B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006046525A1 (ja) | 2006-05-04 |
| CN100475419C (zh) | 2009-04-08 |
| EP1806202A4 (en) | 2009-05-06 |
| TW200621661A (en) | 2006-07-01 |
| US20070228100A1 (en) | 2007-10-04 |
| JPWO2006046525A1 (ja) | 2008-05-22 |
| EP1806202A1 (en) | 2007-07-11 |
| CN101048255A (zh) | 2007-10-03 |
| ATE520495T1 (de) | 2011-09-15 |
| EP1806202B1 (en) | 2011-08-17 |
| KR100821937B1 (ko) | 2008-04-15 |
| US7726532B2 (en) | 2010-06-01 |
| JP4722054B2 (ja) | 2011-07-13 |
| KR20070051945A (ko) | 2007-05-18 |
| TWI358395B (enExample) | 2012-02-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX2007005018A (es) | Metodo y aparato para formar ranuras. | |
| JP4666391B2 (ja) | ガラス基板の分断方法 | |
| JP5451238B2 (ja) | レーザ加工方法 | |
| JP5216017B2 (ja) | 脆性材料基板の分断方法 | |
| CN101821071B (zh) | 脆性材料基板的激光划线方法及激光划线装置 | |
| JP6278451B2 (ja) | マーキング装置およびパターン生成装置 | |
| JPWO2008053915A1 (ja) | スキャナ光学システム、レーザ加工装置、及び、スキャナ光学装置 | |
| JP4615231B2 (ja) | スクライブ装置およびこの装置を用いたスクライブ方法 | |
| KR100551527B1 (ko) | 취성재료기판의 스크라이브 방법 및 스크라이브 장치 | |
| JP2005081715A (ja) | レーザ加工装置およびレーザ加工方法 | |
| JP2003115449A (ja) | 露光装置 | |
| KR100960302B1 (ko) | 레이저를 이용한 필름 절단 장치 및 방법 | |
| JP3410989B2 (ja) | 精密レーザ照射装置及び制御方法 | |
| KR20050054444A (ko) | 레이저 결정화 장치 및 레이저 결정화 방법 | |
| CN111293053A (zh) | 激光晶化装置的监控系统 | |
| JP2006315086A (ja) | レーザ加工装置及びレーザ加工方法 | |
| JP2000323025A (ja) | プラズマディスプレイパネルの電極基板製造方法および装置 | |
| JP2006315085A (ja) | レーザ加工装置 | |
| CN116060799A (zh) | 照明光学系统和激光加工装置 | |
| JP2009164444A (ja) | 結晶性半導体膜形成装置、結晶性半導体膜形成方法および結晶性半導体膜形成基板 | |
| JP2005246451A (ja) | レーザ加工装置及びレーザ加工方法 | |
| JPH06152036A (ja) | レーザー処理装置および処理方法 | |
| JP2001085353A (ja) | レーザー処理方法 | |
| JP2002118077A (ja) | レーザーアニール装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |