KR970700369A - 집적회로패키지와 그 제조방법 - Google Patents

집적회로패키지와 그 제조방법 Download PDF

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KR970700369A
KR970700369A KR1019960703230A KR19960703230A KR970700369A KR 970700369 A KR970700369 A KR 970700369A KR 1019960703230 A KR1019960703230 A KR 1019960703230A KR 19960703230 A KR19960703230 A KR 19960703230A KR 970700369 A KR970700369 A KR 970700369A
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side portion
mounting
mounting region
protrusion
chip
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에취. 제이. 피르켄스 리차드
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에취. 제이. 피르켄스 리차드
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Abstract

리드프레임스트립에 다이패드가 구비되고 돌출부가 그 배면측부로부터 돌출되도록 다이패드상에 형성되어 있다. 직접회로칩이 다이패드의 전면측부에 접착되고 다이패드에 일정한 리드프레임스트립의 부분에 리드로 연결된다. 다이패드, 칩과 리드가 모울드내에 배치되고 에폭시가 모울드내에 주입되어 다이패드, 칩과 리드를 밀봉한다. 돌출부는 다이패드의 배면측부에 대향된 모울드내면으로 부터 다이패드가 간격을 유지하도록 한다.

Description

직접회로패키지와 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (21)

  1. 칩의 취부영역을 갖는 기재로 구성되고, 상기 취부영역은 칩을 취부하기 위한 제1측부와 상기 제1측부에서 대향된 제2측부를 가지며, 상기 취부영역에 상기 제2측부로부터 돌출된 돌출부가 구비됨을 특징으로 마운트.
  2. 청구범위 1항에 있어서, 상기 부재가 평면부를 형성하는 제1부분과 상기 평면부로부터 만곡되고 상기 취부영역을 포함하는 제2부분을 가지고, 상기 취부영역의 상기 제1측부가 상기 평면부를 향함을 특징으로 하는 마운트.
  3. 청구범위 1항에 있어서, 상기 돌출부가 상기 취부영역에 대하여 중심에 위치함을 특징으로 하는 마운트.
  4. 청구범위 1항에 있어서, 상기 돌출부가 상기 기재에 형성된 딤플로 구성됨을 특징으로 하는 마운트.
  5. 제1측부와 이 제1측부로부터 대향된 제2측부를 갖는 취부영역을 갖는 기재와, 상기 취부영역의 상기 제1측부에 고정된 집적회로 칩으로 구성되고, 상기 취부영역에 상기 제2측부로부터 돌출된 돌출부가 구비되어 있음을 특징으로 하는 집적회로 패키지.
  6. 청구범위 5항에 있어서, 상기 기재가 평면부를 형성하는 제1부분과 상기 평면부로부터 만곡되고 상기 취부 영역을 포함하는 제2부분을 가지고, 상기 취부영역의 상기 제1측부가 상기 평면부를 향함을 특징으로 하는 패키지.
  7. 청구범위 5항에 있어서, 상기 돌출부가 상기 취부영역에 대하여 중심에 위치함을 특징으로 하는 패키지.
  8. 청구범위 5항에 있어서, 상기 돌출부가 상기 기재에 형성된 딤플로 구성됨을 특징으로 하는 패키지.
  9. 청구범위 5항에 있어서, 상기 취부영역과 상기 칩이 수용되는 밀봉체가 구성되어 있음을 특징으로 하는 패키지.
  10. 청구범위 9항에 있어서, 상기 밀봉체가 플라스틱으로 구성됨을 특징으로 하는 패키지.
  11. 청구범위 9항에 있어서, 상기 밀봉체가 에폭시로 구성됨을 특징으로 하는 패키지.
  12. 청구범위 9항에 있어서, 상기 밀봉체가 외주면을 가지고 상기 제2측부가 상기 주면으로부터 일정한 간격을 두고 있으며, 상기 돌출부가 상기 제2측부로 부터 상기 주면으로 연장됨을 특징으로 하는 패키지.
  13. 집적회로 패키지의 제조방법에 있어서, 이 방법이 직접회로 칩이 배치되며 이 칩의 취부를 위한 제1측부와 상기 제1측부로 부터 대향된 제2측부를 갖는 취부영역을 갖는 기재를 제공하는 단계와, 상기 제2측부로부터 돌출된 돌출부를 형성하는 단계로 구성됨을 특징으로 하는 집적회로 패키지의 제조방법.
  14. 청구범위 13항에 있어서, 상기 기재와 평면부를 형성하고, 상기 취부영역의 상기 제1측부가 상기 평면부를 향하도록 상기 평면으로부터 상기 취부영역을 만곡시키는 단계가 구성되어 있음을 특징으로 하는 방법.
  15. 청구범위 13항에 있어서, 돌출부 형성단계가 상기 취부영역에 대하여 상기 돌출부를 중앙에 배치하는 단계로 구성됨을 특징으로 하는 방법.
  16. 청구범위 13항에 있어서, 돌출부 형성단계가 상기 기재에 딤플을 형성하는 단계로 구성됨을 특징으로 하는 방법.
  17. 청구범위 13항에 있어서, 상기 취부영역의 상기 제1측부에 선택된 칩을 고정시키는 단계가 구성되어 있음을 특징으로 하는 방법.
  18. 청구범위 17항에 있어서, 상기 취부영역과 상기 선택된 칩을 밀봉하는 단계가 구성되어 있음을 특징으로 하는 방법.
  19. 청구범위 18항에 있어서, 밀봉 단계가 플라스틱을 이용하여 수행됨을 특징으로 하는 방법.
  20. 청구범위 18항에 있어서, 밀봉 단계가 에폭시를 이용하여 수행됨을 특징으로 하는 방법.
  21. 청구범위 18항에 있어서, 밀봉 단계가 외주면을 갖는 밀봉체내에 상기 취부영역과 상기 선택된 칩을 수용하는 단계와, 상기 돌출부를 이용하여 상기 주면으로부터 제2측부를 일정간격으로 유지하는 단계로 구성됨을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960703230A 1994-10-18 1995-10-13 집적회로패키지와그제조방법 KR100428271B1 (ko)

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US08/324,717 US5578871A (en) 1994-10-18 1994-10-18 Integrated circuit package and method of making the same

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JPH09153586A (ja) * 1995-12-01 1997-06-10 Texas Instr Japan Ltd 半導体装置、その製造方法、及びリードフレーム
KR100214544B1 (ko) * 1996-12-28 1999-08-02 구본준 볼 그리드 어레이 반도체 패키지
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US6303985B1 (en) * 1998-11-12 2001-10-16 Micron Technology, Inc. Semiconductor lead frame and package with stiffened mounting paddle
JP3602997B2 (ja) * 1999-12-15 2004-12-15 松下電器産業株式会社 半導体装置及び半導体装置の製造方法
TW541672B (en) * 2001-11-09 2003-07-11 Advanced Semiconductor Eng Semiconductor chip manufacturing method, its product and leadframe
JP2003197663A (ja) * 2001-12-28 2003-07-11 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
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US20040113240A1 (en) * 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
JP2008085002A (ja) * 2006-09-27 2008-04-10 Sanyo Electric Co Ltd 半導体装置およびその製造方法
US7821116B2 (en) * 2007-02-05 2010-10-26 Fairchild Semiconductor Corporation Semiconductor die package including leadframe with die attach pad with folded edge
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US7808089B2 (en) * 2007-12-18 2010-10-05 National Semiconductor Corporation Leadframe having die attach pad with delamination and crack-arresting features
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US20100123230A1 (en) * 2008-11-20 2010-05-20 Frederick Rodriguez Dahilig Integrated circuit packaging system having bumped lead and method of manufacture thereof
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