KR960703231A - 고정밀 부품 얼라인먼트 센서 시스템(a high precision component alignment sensor system) - Google Patents
고정밀 부품 얼라인먼트 센서 시스템(a high precision component alignment sensor system) Download PDFInfo
- Publication number
- KR960703231A KR960703231A KR1019960700138A KR19960700138A KR960703231A KR 960703231 A KR960703231 A KR 960703231A KR 1019960700138 A KR1019960700138 A KR 1019960700138A KR 19960700138 A KR19960700138 A KR 19960700138A KR 960703231 A KR960703231 A KR 960703231A
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- South Korea
- Prior art keywords
- component
- shadow
- light
- sensor array
- leading
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 2
- 238000005259 measurement Methods 0.000 claims 1
- 230000011664 signaling Effects 0.000 claims 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/342—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells the sensed object being the obturating part
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Geophysics And Detection Of Objects (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Inspection Of Paper Currency And Valuable Securities (AREA)
- Automatic Control Of Machine Tools (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
표면 장착 부품 배치 기계와 관련하여 사용하는 레이저 얼라인먼트 센서 시스템이 기술되어 있다. 이 시스템은 조준 렌즈를 통과한 다음, CCD 센서 어레이를 스트라이크하기 위해 얼라인되는 부품을 통과하여 집속되는 조준된 광의 스트라이프를 생성하는 애퍼추어를 통과하는 광으로 구성된다. 부품의 빈과 회로 기판 사이에서 부품을 전송하는 동안, 부품은 회전되고, 센서 어레이 상에 떨어지는 섀도우는 모니터된다. 섀도우의 최소 폭이 검출되면, 보정 각 방위는 결정되고, 퀼의 중심과 비교된 섀도우의 중간 연부는 퀼 상의 부품의 좌표 위치를 결정한다. 2개의 얼라인먼트는 통상 90°만큼 변위된다. 센서는 보정 신호의 배치 기게에 송신하여 부품의 각 방위 및 X, Y 위치가 회로 기판 상에 정확하게 배치될 수 있게 한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 배열을 도시판 평면도이다.
제2도는 부품을 회전시키는 회전모터, 배치 헤드 제어 박스및 레이저 얼라인먼트 센서를 포함하는 부품 운반 메카니즘을 더욱 상세하게 도시한 정면도이다.
제3도는 광빔 또는 스트라이프가 부품의 양단을 통과하여 리니어 어레이 영상 센서를 부딪히게 하는 조준 렌즈및 레이저 다이오드를 포함하는 본 발명의 기본 소자들을 설명하는 도면이다.
제4도는 본 발명의 양호한 실시예를 도시한 평면도이다.
제5도는 제4도의 라인 5-5를 따라 절취하여 도시된 레이저 센서의 측단면도이다.
Claims (2)
- 고정밀 고속 부품 얼라인먼트 센서 시스템에 있어서, 광원; 조준 렌즈; 부품을 통과하는 광과, 센서 어레이 상에 부품에 의해 투사된 섀도우를 검출하기 위해 다수의 검출기 소자를 갖고 있는 다중 센서 어레이; 부품 두께의 일부만을 따라 부품 상에 충돌하는 광의 범위를 제한하는 스트라이프 발생 광 소자; 상기 센서 어레이 상에 부품에 의해 투사된 섀도우의 각 연부를 표시하는 다수의 데이타 포인트의 위치를 결정함으로써 부품의 각과 좌표 위치를 계산하는 프로세싱 수단; 상기 부품의 각 방위를 나타내기 위해 상기 프로세싱 수단에 접속된 제1신호 표시(signaling) 수단; 및 상기 부품의 좌표 위치를 나타내기 위해 상기 프로세싱 수단으로부터 접속된 제2신호 표시 수단을 포함하고; 상기 프로세싱 수단은, 섀도우의 선행 연부를 검출하여 분석하는 수단, 섀도우의 후행 연부를 검출하여 분석하는 수단, 및 상기 부품에 의해 투사된 섀도의 선행 및 후행 연부의 위치에 기초하여 부품 위치를 계산하는 수단을 포함하는 것을 특징으로 하는 고정밀 고속 부품 얼라인먼트 센서시스템.
- 표면 장착 부품 배치 기계에 의해 운반된 부품을 얼라인하는 방법에 있어서, 부품을 픽업하는 단계; 부품에 충돌한 광이 부품의 두께를 따라 약해지도록 조준된 광의 스트라이프를 제공하는 단계; 광 경로 내에 광소자 어레이를 제공하는 단계; 부품이 광 소자 어레이 상에 섀도우 프로필을 갖는 섀도우를 투사하도록 부품이 조준된 광의 스트라이프 내로 들어가게 하는 단계; 부품을 회전시키는 단계; 센서 어레이 상에 투사된 섀도위 선행 연부 및 후행 연부를 검출하는 단계; 선행 연부와 후행 연부 측정치를 이용한 최소 섀도우 프로필에 기초하어 각 방위를 계산하는 단계; 및 퀼에 의해 운반될 때의 부품의 수평 위치를 결정하기 위해 섀도우의 선행연부와 후행 연부의 수평 위치를 퀼의 중심과 비교하는 단계를 포함하는 것을 특징으로 하는 부품 얼라인 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US659,983 | 1991-02-22 | ||
US07/659,983 US5278634A (en) | 1991-02-22 | 1991-02-22 | High precision component alignment sensor system |
PCT/US1992/001123 WO1992014988A1 (en) | 1991-02-22 | 1992-02-21 | A high precision component alignment sensor system |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930702497A Division KR0185688B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라인먼트 센서 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960703231A true KR960703231A (ko) | 1996-06-19 |
KR0185694B1 KR0185694B1 (ko) | 1999-05-15 |
Family
ID=24647636
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960700136A KR0185692B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019960700133A KR0185689B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019930702497A KR0185688B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019960700137A KR0185693B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라이먼트 센서 시스템 |
KR1019960700138A KR0185694B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019960700135A KR0185691B1 (ko) | 1991-02-22 | 1996-01-11 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019960700134A KR0185690B1 (ko) | 1991-02-22 | 1996-01-11 | 고정밀 부품 얼라인먼트 센서 시스템 |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960700136A KR0185692B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019960700133A KR0185689B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019930702497A KR0185688B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019960700137A KR0185693B1 (ko) | 1991-02-22 | 1992-02-21 | 고정밀 부품 얼라이먼트 센서 시스템 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960700135A KR0185691B1 (ko) | 1991-02-22 | 1996-01-11 | 고정밀 부품 얼라인먼트 센서 시스템 |
KR1019960700134A KR0185690B1 (ko) | 1991-02-22 | 1996-01-11 | 고정밀 부품 얼라인먼트 센서 시스템 |
Country Status (11)
Country | Link |
---|---|
US (2) | US5278634A (ko) |
EP (1) | EP0572555B1 (ko) |
JP (1) | JP2995707B2 (ko) |
KR (7) | KR0185692B1 (ko) |
AT (1) | ATE161626T1 (ko) |
DE (1) | DE69223770T2 (ko) |
DK (1) | DK0572555T3 (ko) |
ES (1) | ES2113426T3 (ko) |
GR (1) | GR3026481T3 (ko) |
TW (1) | TW217483B (ko) |
WO (1) | WO1992014988A1 (ko) |
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- 1992-02-21 ES ES92907810T patent/ES2113426T3/es not_active Expired - Lifetime
- 1992-02-21 WO PCT/US1992/001123 patent/WO1992014988A1/en active IP Right Grant
- 1992-02-21 DK DK92907810T patent/DK0572555T3/da active
- 1992-02-21 KR KR1019960700133A patent/KR0185689B1/ko not_active IP Right Cessation
- 1992-02-21 DE DE69223770T patent/DE69223770T2/de not_active Expired - Lifetime
- 1992-02-21 KR KR1019930702497A patent/KR0185688B1/ko not_active IP Right Cessation
- 1992-02-21 KR KR1019960700137A patent/KR0185693B1/ko not_active IP Right Cessation
- 1992-02-21 KR KR1019960700138A patent/KR0185694B1/ko not_active IP Right Cessation
- 1992-02-21 JP JP4507292A patent/JP2995707B2/ja not_active Expired - Fee Related
- 1992-02-21 EP EP92907810A patent/EP0572555B1/en not_active Expired - Lifetime
- 1992-06-29 TW TW081105119A patent/TW217483B/zh not_active IP Right Cessation
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1995
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1996
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- 1996-01-11 KR KR1019960700134A patent/KR0185690B1/ko not_active IP Right Cessation
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1998
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Also Published As
Publication number | Publication date |
---|---|
KR960703226A (ko) | 1996-06-19 |
KR960703229A (ko) | 1996-06-19 |
KR960703227A (ko) | 1996-06-19 |
DK0572555T3 (da) | 1998-08-31 |
KR0185694B1 (ko) | 1999-05-15 |
TW217483B (ko) | 1993-12-11 |
KR960703228A (ko) | 1996-06-19 |
KR0185689B1 (ko) | 1999-05-15 |
JPH06504847A (ja) | 1994-06-02 |
KR0185690B1 (ko) | 1999-05-15 |
JP2995707B2 (ja) | 1999-12-27 |
EP0572555A4 (ko) | 1994-03-23 |
KR0185693B1 (ko) | 1999-05-15 |
KR0185692B1 (ko) | 1999-05-15 |
KR960703230A (ko) | 1996-06-19 |
KR930703586A (ko) | 1993-11-30 |
ES2113426T3 (es) | 1998-05-01 |
WO1992014988A1 (en) | 1992-09-03 |
USRE38025E1 (en) | 2003-03-11 |
KR0185688B1 (ko) | 1999-05-15 |
EP0572555B1 (en) | 1997-12-29 |
ATE161626T1 (de) | 1998-01-15 |
GR3026481T3 (en) | 1998-06-30 |
EP0572555A1 (en) | 1993-12-08 |
DE69223770D1 (de) | 1998-02-05 |
DE69223770T2 (de) | 1998-07-16 |
KR0185691B1 (ko) | 1999-05-15 |
US5278634A (en) | 1994-01-11 |
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