DE69605103T2 - Bestückungsautomat für bauelemente - Google Patents

Bestückungsautomat für bauelemente

Info

Publication number
DE69605103T2
DE69605103T2 DE69605103T DE69605103T DE69605103T2 DE 69605103 T2 DE69605103 T2 DE 69605103T2 DE 69605103 T DE69605103 T DE 69605103T DE 69605103 T DE69605103 T DE 69605103T DE 69605103 T2 DE69605103 T2 DE 69605103T2
Authority
DE
Germany
Prior art keywords
components
assembly machine
assembly
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69605103T
Other languages
English (en)
Other versions
DE69605103D1 (de
Inventor
De Ven Johannes Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Assembleon BV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69605103D1 publication Critical patent/DE69605103D1/de
Application granted granted Critical
Publication of DE69605103T2 publication Critical patent/DE69605103T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
DE69605103T 1995-12-14 1996-11-27 Bestückungsautomat für bauelemente Expired - Lifetime DE69605103T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95203481 1995-12-14
PCT/IB1996/001320 WO1997022238A1 (en) 1995-12-14 1996-11-27 Component placement machine and method of placing a component on a carrier by means of said component placement machine

Publications (2)

Publication Number Publication Date
DE69605103D1 DE69605103D1 (de) 1999-12-16
DE69605103T2 true DE69605103T2 (de) 2000-05-25

Family

ID=8220946

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69605103T Expired - Lifetime DE69605103T2 (de) 1995-12-14 1996-11-27 Bestückungsautomat für bauelemente

Country Status (5)

Country Link
US (1) US5880849A (de)
EP (1) EP0809926B1 (de)
JP (1) JPH11502311A (de)
DE (1) DE69605103T2 (de)
WO (1) WO1997022238A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990081927A (ko) * 1996-11-26 1999-11-15 요트.게.아. 롤페즈 캐리어상에 콤포넌트를 배치하기 위한 방법과 배치기및, 이러한방법과 배치기에 사용되는 보정 캐리어 검출 장치
DE19708464C2 (de) * 1997-02-19 2001-10-04 Hubert Zach Bestückungsvorrichtung zum koplanaren Aufsetzen von Bauelementen auf Leiterplatten
US6408090B1 (en) * 1998-09-28 2002-06-18 Siemens Production And Logistics System Aktiengesellschaft Method for position recognition of components equipped on a substrate in an automatic equipping unit
GB9905742D0 (en) * 1999-03-13 1999-05-05 Koninkl Philips Electronics Nv Electrical components and circuit assembly
EP1284096B1 (de) * 2000-05-23 2004-10-06 Siemens Aktiengesellschaft Vorrichtung zum bestücken von substraten mit elektrischen bauteilen
CN1229010C (zh) * 2001-08-08 2005-11-23 松下电器产业株式会社 安装电子部件的设备和方法
SE523121C2 (sv) * 2001-09-13 2004-03-30 Optillion Ab Metod, anordning och datorprogram för att placera en optisk komponent på en bärare
WO2004086840A2 (en) * 2003-03-28 2004-10-07 Assembleon N.V. Method of placing at least one component on at least one substrate and apparatus therefore
KR20060028643A (ko) * 2003-06-24 2006-03-30 코닌클리케 필립스 일렉트로닉스 엔.브이. 카메라가 제공된 디바이스를 제어 시스템을 통해 원하는위치로 이동시키는 방법, 및 이러한 시스템
NL1036507C2 (nl) * 2009-02-03 2010-08-04 Assembleon Bv Inrichting geschikt voor het met behulp van een sensor vervaardigen van een afbeelding, alsmede componentplaatsingseenheid voorzien van een dergelijke inrichting.
EP2881226A4 (de) * 2012-08-02 2017-01-11 Fuji Machine Mfg. Co., Ltd. Arbeitsmaschine mit einem gelenkroboter und maschine zur montage elektrischer komponenten
US9222769B2 (en) 2012-12-08 2015-12-29 Grale Technologies High speed metrology with numerically controlled machines
EP2978296B1 (de) * 2013-03-18 2019-08-21 FUJI Corporation Komponentenanbringungsvorrichtung und verfahren zur kalibrierung in einer komponentenanbringungsvorrichtung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4797994A (en) * 1986-04-22 1989-01-17 Kulicke & Soffa Industries, Inc. Apparatus for and methods of die bonding
JP2803221B2 (ja) * 1989-09-19 1998-09-24 松下電器産業株式会社 Ｉｃ実装装置及びその方法
US5278634A (en) * 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
JPH04291795A (ja) * 1991-03-20 1992-10-15 Matsushita Electric Ind Co Ltd 電子部品装着装置
US5194948A (en) * 1991-04-26 1993-03-16 At&T Bell Laboratories Article alignment method and apparatus
US5216804A (en) * 1991-05-21 1993-06-08 U.S. Philips Corp. Method and device for placing a component on a printed circuit board

Also Published As

Publication number Publication date
DE69605103D1 (de) 1999-12-16
US5880849A (en) 1999-03-09
EP0809926A1 (de) 1997-12-03
JPH11502311A (ja) 1999-02-23
EP0809926B1 (de) 1999-11-10
WO1997022238A1 (en) 1997-06-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ASSEMBLEON N.V., EINDHOVEN, NL

8328 Change in the person/name/address of the agent

Free format text: VOLMER, G., DIPL.-ING., PAT.-ANW., 52064 AACHEN

8328 Change in the person/name/address of the agent

Representative=s name: ACKMANN MENGES PATENT- UND RECHTSANWAELTE, 80469 M

R082 Change of representative

Ref document number: 809926

Country of ref document: EP

Representative=s name: SCHUMACHER & WILLSAU PATENTANWALTSGESELLSCHAFT, DE