DE69632817D1 - Gehäuse für mehrere halbleiterbauelemente - Google Patents

Gehäuse für mehrere halbleiterbauelemente

Info

Publication number
DE69632817D1
DE69632817D1 DE69632817T DE69632817T DE69632817D1 DE 69632817 D1 DE69632817 D1 DE 69632817D1 DE 69632817 T DE69632817 T DE 69632817T DE 69632817 T DE69632817 T DE 69632817T DE 69632817 D1 DE69632817 D1 DE 69632817D1
Authority
DE
Germany
Prior art keywords
housing
semiconductor components
several semiconductor
several
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69632817T
Other languages
English (en)
Other versions
DE69632817T2 (de
Inventor
A Kuhn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of DE69632817D1 publication Critical patent/DE69632817D1/de
Application granted granted Critical
Publication of DE69632817T2 publication Critical patent/DE69632817T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/0554—External layer
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49112—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body, e.g. diverging wires
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/013—Alloys
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69632817T 1995-03-13 1996-03-12 Gehäuse für mehrere halbleiterbauelemente Expired - Lifetime DE69632817T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/402,933 US5719436A (en) 1995-03-13 1995-03-13 Package housing multiple semiconductor dies
US402933 1995-03-13
PCT/US1996/003331 WO1996028860A1 (en) 1995-03-13 1996-03-12 A package housing multiple semiconductor dies

Publications (2)

Publication Number Publication Date
DE69632817D1 true DE69632817D1 (de) 2004-08-05
DE69632817T2 DE69632817T2 (de) 2005-07-14

Family

ID=23593865

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69632817T Expired - Lifetime DE69632817T2 (de) 1995-03-13 1996-03-12 Gehäuse für mehrere halbleiterbauelemente

Country Status (8)

Country Link
US (2) US5719436A (de)
EP (1) EP0815615B1 (de)
JP (1) JP3717937B2 (de)
KR (1) KR100272846B1 (de)
AU (1) AU5189596A (de)
DE (1) DE69632817T2 (de)
MY (1) MY124460A (de)
WO (1) WO1996028860A1 (de)

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US7037426B2 (en) * 2000-05-04 2006-05-02 Zenon Environmental Inc. Immersed membrane apparatus
US5677567A (en) * 1996-06-17 1997-10-14 Micron Technology, Inc. Leads between chips assembly
US6054764A (en) * 1996-12-20 2000-04-25 Texas Instruments Incorporated Integrated circuit with tightly coupled passive components
US6037661A (en) * 1996-12-20 2000-03-14 International Business Machines Multichip module
JP3545200B2 (ja) * 1997-04-17 2004-07-21 シャープ株式会社 半導体装置
JP3359846B2 (ja) * 1997-07-18 2002-12-24 シャープ株式会社 半導体装置
US5990549A (en) * 1998-02-06 1999-11-23 Intel Corporation Thermal bus bar design for an electronic cartridge
JP3077668B2 (ja) * 1998-05-01 2000-08-14 日本電気株式会社 半導体装置、半導体装置用リードフレームおよびその製造方法
GB2341482B (en) * 1998-07-30 2003-07-09 Bookham Technology Ltd Lead frame attachment for integrated optoelectronic waveguide device
SG88741A1 (en) * 1998-09-16 2002-05-21 Texas Instr Singapore Pte Ltd Multichip assembly semiconductor
US6049465A (en) * 1998-09-25 2000-04-11 Advanced Micro Devices, Inc. Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor
JP3886659B2 (ja) * 1999-01-13 2007-02-28 東芝マイクロエレクトロニクス株式会社 半導体装置
JP3847997B2 (ja) 1999-01-22 2006-11-22 東芝マイクロエレクトロニクス株式会社 半導体装置及び両面ｍｃｐチップ
US6890798B2 (en) 1999-06-08 2005-05-10 Intel Corporation Stacked chip packaging
US6229219B1 (en) * 2000-03-29 2001-05-08 Advanced Micro Devices, Inc. Flip chip package compatible with multiple die footprints and method of assembling the same
US6560117B2 (en) 2000-06-28 2003-05-06 Micron Technology, Inc. Packaged microelectronic die assemblies and methods of manufacture
US6552910B1 (en) 2000-06-28 2003-04-22 Micron Technology, Inc. Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture
US6525413B1 (en) 2000-07-12 2003-02-25 Micron Technology, Inc. Die to die connection method and assemblies and packages including dice so connected
US7298031B1 (en) 2000-08-09 2007-11-20 Micron Technology, Inc. Multiple substrate microelectronic devices and methods of manufacture
US6607937B1 (en) * 2000-08-23 2003-08-19 Micron Technology, Inc. Stacked microelectronic dies and methods for stacking microelectronic dies
US6858922B2 (en) * 2001-01-19 2005-02-22 International Rectifier Corporation Back-to-back connected power semiconductor device package
US6891257B2 (en) * 2001-03-30 2005-05-10 Fairchild Semiconductor Corporation Packaging system for die-up connection of a die-down oriented integrated circuit
US20040080056A1 (en) * 2001-03-30 2004-04-29 Lim David Chong Sook Packaging system for die-up connection of a die-down oriented integrated circuit
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AU5189596A (en) 1996-10-02
US5793101A (en) 1998-08-11
EP0815615A1 (de) 1998-01-07
JP3717937B2 (ja) 2005-11-16
EP0815615B1 (de) 2004-06-30
KR19980702651A (ko) 1998-08-05
MY124460A (en) 2006-06-30
JPH11502063A (ja) 1999-02-16
EP0815615A4 (de) 2000-12-06
US5719436A (en) 1998-02-17
DE69632817T2 (de) 2005-07-14
KR100272846B1 (ko) 2000-11-15
WO1996028860A1 (en) 1996-09-19

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