DE68907943T2 - Gehäusedeckel für Halbleiterbauelemente. - Google Patents

Gehäusedeckel für Halbleiterbauelemente.

Info

Publication number
DE68907943T2
DE68907943T2 DE89103085T DE68907943T DE68907943T2 DE 68907943 T2 DE68907943 T2 DE 68907943T2 DE 89103085 T DE89103085 T DE 89103085T DE 68907943 T DE68907943 T DE 68907943T DE 68907943 T2 DE68907943 T2 DE 68907943T2
Authority
DE
Germany
Prior art keywords
housing cover
semiconductor components
semiconductor
components
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89103085T
Other languages
English (en)
Other versions
DE68907943D1 (de
Inventor
Masamichi Shindo
Toshiharu Sakurai
Hideo Taguchi
Nobu Izawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE68907943D1 publication Critical patent/DE68907943D1/de
Application granted granted Critical
Publication of DE68907943T2 publication Critical patent/DE68907943T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE89103085T 1988-02-22 1989-02-22 Gehäusedeckel für Halbleiterbauelemente. Expired - Fee Related DE68907943T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63039035A JPH0793393B2 (ja) 1988-02-22 1988-02-22 半導体装置の金属製シェル

Publications (2)

Publication Number Publication Date
DE68907943D1 DE68907943D1 (de) 1993-09-09
DE68907943T2 true DE68907943T2 (de) 1993-12-16

Family

ID=12541856

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89103085T Expired - Fee Related DE68907943T2 (de) 1988-02-22 1989-02-22 Gehäusedeckel für Halbleiterbauelemente.

Country Status (5)

Country Link
US (1) US5096081A (de)
EP (1) EP0330176B1 (de)
JP (1) JPH0793393B2 (de)
KR (1) KR920006735B1 (de)
DE (1) DE68907943T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3462979B2 (ja) * 1997-12-01 2003-11-05 株式会社東芝 半導体装置
US9837333B1 (en) 2016-09-21 2017-12-05 International Business Machines Corporation Electronic package cover having underside rib

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211503A (en) * 1963-01-09 1965-10-12 United Carr Inc Container
US3327896A (en) * 1965-06-04 1967-06-27 Shell Oil Co Stackable container
US4126758A (en) * 1973-12-03 1978-11-21 Raychem Corporation Method for sealing integrated circuit components with heat recoverable cap and resulting package
CA1042116A (en) * 1973-12-03 1978-11-07 John F. Krumme Heat recoverable cap
US4109818A (en) * 1975-06-03 1978-08-29 Semi-Alloys, Inc. Hermetic sealing cover for a container for semiconductor devices
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
JPS5748250A (en) * 1980-09-05 1982-03-19 Nec Corp Metal cap for semiconductor device
DE3040959A1 (de) * 1980-10-30 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verpackung fuer elektrische bauelemente
JPS59201446A (ja) * 1983-04-30 1984-11-15 Toshiba Corp 半導体装置及びその製造方法
JPS60133741A (ja) * 1983-12-21 1985-07-16 Fujitsu Ltd 半導体装置及びその製造方法
JPS61204953A (ja) * 1985-03-08 1986-09-11 Sumitomo Metal Mining Co Ltd ハ−メチツクシ−ルカバ−及びその製造方法
JPS6226846A (ja) * 1985-07-26 1987-02-04 Nec Corp 半導体装置封止用キヤツプ
US4640438A (en) * 1986-03-17 1987-02-03 Comienco Limited Cover for semiconductor device packages
US4746583A (en) * 1986-11-21 1988-05-24 Indium Corporation Ceramic combined cover

Also Published As

Publication number Publication date
EP0330176A3 (en) 1990-10-31
US5096081A (en) 1992-03-17
DE68907943D1 (de) 1993-09-09
JPH0793393B2 (ja) 1995-10-09
JPH01214050A (ja) 1989-08-28
KR890013752A (ko) 1989-09-25
EP0330176A2 (de) 1989-08-30
EP0330176B1 (de) 1993-08-04
KR920006735B1 (ko) 1992-08-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee