KR890013752A - 반도체장치의 금속제 쉘 - Google Patents

반도체장치의 금속제 쉘 Download PDF

Info

Publication number
KR890013752A
KR890013752A KR1019890002087A KR890002087A KR890013752A KR 890013752 A KR890013752 A KR 890013752A KR 1019890002087 A KR1019890002087 A KR 1019890002087A KR 890002087 A KR890002087 A KR 890002087A KR 890013752 A KR890013752 A KR 890013752A
Authority
KR
South Korea
Prior art keywords
metal shell
semiconductor device
semiconductor chip
ridge line
reinforcement
Prior art date
Application number
KR1019890002087A
Other languages
English (en)
Other versions
KR920006735B1 (ko
Inventor
마사미치 신도
도시하루 사쿠라이
히데오 다구치
노부 이자와
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR890013752A publication Critical patent/KR890013752A/ko
Application granted granted Critical
Publication of KR920006735B1 publication Critical patent/KR920006735B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

내용 없음.

Description

반도체장치의 금속제 쉘
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예를 도시해 놓은 평면도,
제2도는 제1도에 도시된 평면도에서의 II-II선에 대한 단면도,
제3도는 제1도에 도시된 평면도에서의 III-III선에 대한 단면도.

Claims (1)

  1. 패키지기판(1)의 상면에 탑재된 반도체칩(2)의 윗쪽을 덮어서 그 반도체칩(2)을 밀봉하도록 된 금속제 쉘에 있어서, 상기 반도체칩(2)의 표면과 거의 평행한 피복부(13)를 갖추고, 또 그 피복부(13)에는 보강용 볼록부(13a; 또는 오목부)로 이루어지면서 평판부의 외주끝 가장자리로부터 중심을 향해서 뻗은 능선(13b)이 상하 및 좌우대칭으로 형성되며, 중앙부에는 상기 능선(13b)에 연속하는 평탄부(13c)가 형성되어 있는 것을 특징으로 하는 반도체장치의 금속제 쉘.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890002087A 1988-02-22 1989-02-22 반도체장치의 금속제 쉘 KR920006735B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63-039035 1988-02-22
JP63-39035 1988-02-22
JP63039035A JPH0793393B2 (ja) 1988-02-22 1988-02-22 半導体装置の金属製シェル

Publications (2)

Publication Number Publication Date
KR890013752A true KR890013752A (ko) 1989-09-25
KR920006735B1 KR920006735B1 (ko) 1992-08-17

Family

ID=12541856

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890002087A KR920006735B1 (ko) 1988-02-22 1989-02-22 반도체장치의 금속제 쉘

Country Status (5)

Country Link
US (1) US5096081A (ko)
EP (1) EP0330176B1 (ko)
JP (1) JPH0793393B2 (ko)
KR (1) KR920006735B1 (ko)
DE (1) DE68907943T2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3462979B2 (ja) * 1997-12-01 2003-11-05 株式会社東芝 半導体装置
US9837333B1 (en) 2016-09-21 2017-12-05 International Business Machines Corporation Electronic package cover having underside rib

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211503A (en) * 1963-01-09 1965-10-12 United Carr Inc Container
US3327896A (en) * 1965-06-04 1967-06-27 Shell Oil Co Stackable container
JPS5842622B2 (ja) * 1973-12-03 1983-09-21 レイチエム コ−ポレ−シヨン 密封容器
US4126758A (en) * 1973-12-03 1978-11-21 Raychem Corporation Method for sealing integrated circuit components with heat recoverable cap and resulting package
US4109818A (en) * 1975-06-03 1978-08-29 Semi-Alloys, Inc. Hermetic sealing cover for a container for semiconductor devices
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
JPS5748250A (en) * 1980-09-05 1982-03-19 Nec Corp Metal cap for semiconductor device
DE3040959A1 (de) * 1980-10-30 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verpackung fuer elektrische bauelemente
JPS59201446A (ja) * 1983-04-30 1984-11-15 Toshiba Corp 半導体装置及びその製造方法
JPS60133741A (ja) * 1983-12-21 1985-07-16 Fujitsu Ltd 半導体装置及びその製造方法
JPS61204953A (ja) * 1985-03-08 1986-09-11 Sumitomo Metal Mining Co Ltd ハ−メチツクシ−ルカバ−及びその製造方法
JPS6226846A (ja) * 1985-07-26 1987-02-04 Nec Corp 半導体装置封止用キヤツプ
US4640438A (en) * 1986-03-17 1987-02-03 Comienco Limited Cover for semiconductor device packages
US4746583A (en) * 1986-11-21 1988-05-24 Indium Corporation Ceramic combined cover

Also Published As

Publication number Publication date
JPH0793393B2 (ja) 1995-10-09
DE68907943T2 (de) 1993-12-16
EP0330176A3 (en) 1990-10-31
US5096081A (en) 1992-03-17
KR920006735B1 (ko) 1992-08-17
DE68907943D1 (de) 1993-09-09
EP0330176B1 (en) 1993-08-04
EP0330176A2 (en) 1989-08-30
JPH01214050A (ja) 1989-08-28

Similar Documents

Publication Publication Date Title
KR900012799A (ko) 에어백 수납용 커버
AR020256A1 (es) Envase sellado con apendices
KR870008760A (ko) 밀봉 용기의 덮개재
KR880003427A (ko) 반도체 장치 및 그에 사용되는 리드프레임
KR960019629A (ko) 반도체 장치
KR910020866A (ko) 반도체 장치
KR960039306A (ko) 반도체 장치
KR910007094A (ko) 수지밀봉형 반도체장치
KR900007087A (ko) Ic 패키지용 콘테이너 및 그 수송방법
KR890013752A (ko) 반도체장치의 금속제 쉘
KR920010792A (ko) 반도체 장치
KR890006115A (ko) 질화알루미늄 회로기판
KR840006786A (ko) 진 공 병
KR920015525A (ko) 반도체장치
KR910001917A (ko) 반도체장치
KR890013753A (ko) 반도체장치
ATE166493T1 (de) Halbleitervorrichtung mit einem halbleitersubstrat und einer keramischen scheibe als decke
KR880004563A (ko) 집적회로 패키지
KR900004040A (ko) 반도체 집적회로 디바이스
KR860002865A (ko) 열발산장치가 일체로 부착된 집적회로 패키지
KR910010686A (ko) 수지밀봉형 반도체장치
KR940010302A (ko) 반도체 접속장치
KR910008828A (ko) 반도체소자패키지
KR920016985A (ko) 반도체 카드 패키지 장치
KR870004506A (ko) 표면 패케이징용(Packaging)반도체 패케이지

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030801

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee