KR880004563A - 집적회로 패키지 - Google Patents

집적회로 패키지 Download PDF

Info

Publication number
KR880004563A
KR880004563A KR870010459A KR870010459A KR880004563A KR 880004563 A KR880004563 A KR 880004563A KR 870010459 A KR870010459 A KR 870010459A KR 870010459 A KR870010459 A KR 870010459A KR 880004563 A KR880004563 A KR 880004563A
Authority
KR
South Korea
Prior art keywords
die
integrated circuit
circuit package
die attach
package
Prior art date
Application number
KR870010459A
Other languages
English (en)
Inventor
리 오웬즈 노만
Original Assignee
빈센트 죠셉로너
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈센트 죠셉로너, 모토로라 인코포레이티드 filed Critical 빈센트 죠셉로너
Publication of KR880004563A publication Critical patent/KR880004563A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83051—Forming additional members, e.g. dam structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

내용 없음

Description

집적회로 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도 및 4도는 본 발명을 구체화하는 집적회로 패키지의 횡단면도 및 상면도.
제5도는 본 발명의 제2실시예에 대한 상면도.

Claims (5)

  1. 집적회로 패키지에 있어서, 다이를 부착시키는 다이 부착영역을 구비하며, 채널을 규정하는 상기 집적회로 패키지는 상기 다이 부착영역의 부분 주위에 배치된 것을 특징으로 하는 집적회로 패키지.
  2. 제1항에 있어서, 상기 집적회로 패키지에 의해 규정된 채널은 상기 다이 부착 영역 주변에 배치된 것을 특징으로 하는 집적회로 패키지.
  3. 제1항에 있어서, 상기 집적회로 패키지에 의해 규정된 채널은 상부 폭이 바닥폭 보다 넓게끔 테이퍼진 것을 특징으로 하는 집적회로 패키지.
  4. 집적회로 패키지에 있어서, 다이 부착영역을 규정하는 제1오목부분과, 데드 존을 규정하는 제2오목부분을 구비하는데, 데드 존은 상기 다이 부착 영역부분 주위에 배치되고, 집적 회로 패키지는 상기 다이 부착 영역부분주위 데드 존내에 채널을 규정하는 것을 특징으로 하는 집적회로 패키지.
  5. 패키지에 다이를 부착시키는 방법에 있어서, 다이 부착영역을 갖는 패키지 제공단계와, 상기 다이 부착영역내의 상기 패키지 상에 다이 부착물질을 위치시키는 단계와, 상기 다이 부착 물질상에 다이를 위치시키는 단계와, 상기 다이 부착물질의 초과량이 상기 다이 아래로부터 흐르도록 야기시키는 다이 부착물질위에 상기 다이를 압축시키는 단계와, 상기 초과 다이 부착물질 부분이 안으로 흐르도록 상기 패키지내에 채널을 제공하는 단계를 구비하는 것을 특징으로 하는 패키지에 다이를 부착시키는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870010459A 1986-09-22 1987-09-21 집적회로 패키지 KR880004563A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US90953286A 1986-09-22 1986-09-22
US909532 1986-09-22

Publications (1)

Publication Number Publication Date
KR880004563A true KR880004563A (ko) 1988-06-04

Family

ID=25427393

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870010459A KR880004563A (ko) 1986-09-22 1987-09-21 집적회로 패키지

Country Status (4)

Country Link
KR (1) KR880004563A (ko)
GB (1) GB2195825B (ko)
HK (1) HK26692A (ko)
SG (1) SG21192G (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918512A (en) * 1988-12-19 1990-04-17 Motorola, Inc. Semiconductor package having an outwardly arced die cavity
JPH0423441A (ja) * 1990-05-18 1992-01-27 Fujitsu Ltd セラミックパッケージ半導体装置およびその製造方法
US5371386A (en) * 1992-04-28 1994-12-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of assembling the same
US5239131A (en) * 1992-07-13 1993-08-24 Olin Corporation Electronic package having controlled epoxy flow
JPH11233531A (ja) * 1998-02-17 1999-08-27 Nec Corp 電子部品の実装構造および実装方法
US6239480B1 (en) * 1998-07-06 2001-05-29 Clear Logic, Inc. Modified lead frame for improved parallelism of a die to package
GB2344690A (en) * 1998-12-09 2000-06-14 Ibm Cavity down ball grid array module
DE102007037538A1 (de) 2007-08-09 2009-02-12 Robert Bosch Gmbh Baugruppe sowie Herstellung einer Baugruppe

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB863587A (en) * 1958-03-11 1961-03-22 Pye Ltd Improvements in or relating to junction transistor devices
GB1230620A (ko) * 1968-07-26 1971-05-05
GB1376940A (en) * 1970-12-10 1974-12-11 Texas Instruments Inc Panel board circuit systems
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices

Also Published As

Publication number Publication date
GB8721345D0 (en) 1987-10-14
GB2195825A (en) 1988-04-13
HK26692A (en) 1992-04-16
GB2195825B (en) 1990-01-10
SG21192G (en) 1992-04-16

Similar Documents

Publication Publication Date Title
KR890017802A (ko) 반도체 장치용 리드프레임
KR880003427A (ko) 반도체 장치 및 그에 사용되는 리드프레임
KR960033339A (ko) 밴드설치구조
KR880004563A (ko) 집적회로 패키지
KR910017604A (ko) 반도체장치
KR900014227A (ko) 음료 패키지
KR900012740A (ko) 수지봉지장치(樹脂封止裝置)
JPS6457738A (en) Package for semiconductor device
KR910011596A (ko) 금속 몸체 및 플라스틱 파지 부재를 갖는 컨테이너 밀봉부
KR950012696A (ko) 반도체 패키지
KR890015393A (ko) 테이프 본딩방법
FR2394893A1 (fr) Dispositif redresseur de courant
KR910020875A (ko) Ic용 리드프레임
KR920010803A (ko) 와이어본딩방식 반도체장치
KR910003775A (ko) 반도체장치의 땜납 도포방법
KR910010686A (ko) 수지밀봉형 반도체장치
KR910020874A (ko) 리드프레임
KR970705180A (ko) 반도체장치(semiconductor device)
FR2463788B1 (fr) Composition stabilisante liquide, matieres thermoplastiques contenant du chlore stabilisees au moyen de cette composition et objets moules obtenus a partir de cette composition
KR860007736A (ko) 반도체 장치와 그 제조 방법 및 그 제조방법을 사용하는 리이드 프레임
KR890001185A (ko) 반도체 장치용 리드프레임
KR860007083A (ko) 칩 성형 방법
KR920018914A (ko) 반도체 패키지
KR940001370A (ko) 반도체 장치
KR920010862A (ko) 반도체 장치 및 이것에 사용되는 리드프레임

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application